Zeev's Turnips Patch-No Politics (ZEEV)

[mjk]

Why is this funny? More die per wafer = better efficiency.

"The basic math is still pretty easy to figure. A 300 mm fab also is more efficient, observes Steve Tso, vice president of operations, Taiwan Semiconductor Manufacturing Corp. (TSMC), Hsinchu, Taiwan. Compared to a 200 mm wafer, a 300 mm wafer contains 2.5 times more large die and 2.2 times more smaller die, he says. "