Re: One theory, which IMO has a low probability or being correct, is for very early in 2006. That would require it to still be Socket 940, fit in the thermal envelope of under 100W, it would need 65nm to be very early, it would also require reworked SRQ to handle more links.
On 90nm in H1 2006, you would be looking at a ~400mm^2 die running at around 1.6GHz to hit 100W power envelope. What a pitiful launch that would be. Almost zero volume and just barely more performance than the 275.
On first gen 65nm in H2 2006, the die size ought to be inline with today's dual cores. A 100W power restraint might enable 2.4GHz; although, dual core will have moved to 2.8GHz by then. Again, without some additional features, it seems like a lame duck, and a huge risk to coincide with initial 65nm volumes (i.e. delays likely with this approach).
Second gen 65nm in 2007 sounds far more plausible, but AMD won't have this until early to mid-07.
Re: since it is called F, I guess it may support FB-DIMMS.
"F"-stepping, maybe?
Re: So my expectation is that i would be very surprised by H1 2006 launch, H2 launch would be a mild pleasant surprise. In H1 2007, it will be a must.
My expectation is 0% chance in H1 2006, 10% chance in H2, and only then as a rushed low volume product, and a high chance that it coincides with AMD's new micro-architecture in 2007, pending no major delays, of course.
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