Advanced Micro Devices Inc (AMD)

[kpf]

buck wheat

Bill Siegle recently stated in an interview that they are doing a plain shrink first (same number of layers) and going for design changes in a major new stepping lateron, adding two interconnect layers.

As far as shrinking cache cells are concerned, Jerry Moench mentioned they see threshold-voltage fluctating a lot for smaller cache geometries. Could be the reason they are not able to build similar cache densities as Intel and others.

Finally, as for die-specs and real-estate numbers rumoured, I put them in a barrel of salt. There should be samples of 90nm chips in the wild very soon, so its only a question of when somebody opens the case and uses a ruler.

K.