193 mm^2 for the 1 meg. parts, about 150 mm^2 for the 512k parts. Probably about 130 mm^2 for Paris/Dublin.
90nm will probably drop the die sizes to 114 mm^2 see http://www.realworldtech.com/page.cfm?ArticleID=RWT121303010053&p=2, about 90 mm^2 and less than 80 mm^2. To put it in perspective, the 130nm, 1 meg. parts are a little larger than the original K7, Paris/Dublin is about the same size as Palamino. The 90nm, 1meg. parts will be about 15% larger than Barton, but the 512k parts (socket 939 and 754) will be somewhat larger than the last TBreds. The 256k parts (if they are made) should be smaller than anything AMD has produced since the K6 days.
Of course, AMD could go to more cache and/or dual core and the die sizes will be bigger. Given AMD's plans, a dual core Opteron would be somewhat smaller than 230 mm^2, or less than 10% smaller than the original K5 on 0.5 micron...
Market Data 
Markets 
AI
