Corning, Inc. (GLW)

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Press Release Source: Dow Corning Corporation


Dow Corning Expands Thermal Interface Material Offerings
Tuesday March 9, 9:01 am ET
Three new products give electronics industry more choices for controlling heat in devices


MIDLAND, Mich., March 9 /PRNewswire/ -- Dow Corning Corporation today expanded its base of thermal management solutions for the electronics industry, introducing three new thermal interface materials (TIMs). Two of the new materials -- Dow Corning® TP-1600 film series and Dow Corning® TP-2400 pad series -- are the first fabricated TIMs to emerge from Dow Corning following its strategic acquisition of Tyco Electronics' Raychem Power Materials Business Unit last year.


The thermally conductive TP-1600 films and TP-2400 pads help customers improve thermal dissipation in electronic components and assemblies, and are designed for exceptional ease of use and process flexibility. Because they are pre-cured, Dow Corning's fabricated TIMs do not require special application tools, are re-workable and available in a wide range of thicknesses. They are ideally suited for electronics applications in the automotive, display, computer and power markets.

For similar heat management needs in high-powered CPU applications, Dow Corning has introduced Dow Corning® TC-5021, a new thermally conductive grease. As a wet-dispensed material, the grease enables customers to achieve thin bond lines, and can be used in high-volume, automated manufacturing environments.

"The introduction of our newest materials marks another milestone in Dow Corning's strategy to create a broad offering of thermal management choices for our customers," said Tom Cook, global industry executive director, Dow Corning. "Through key acquisitions and innovative product development, Dow Corning is able to offer complete solutions for our customers' thermal interface needs -- from cost-effective low-performance applications to today's most complex and demanding heat dissipation challenges."

Dow Corning significantly expanded its line of thermally conductive materials last year with the acquisition of Tyco Electronics' Raychem Power Materials Business Unit. The acquisition added an extensive suite of fabricated materials to Dow Corning's product line, and complemented its position as a leading provider of wet-dispensed TIMs.

Dow Corning's newest fabricated and wet-dispensed materials are part of the company's growth strategy in the TIMs market, which, according to electronics industry market research firm Prismark, is expected to more than double to $419 million by 2007, up from $170 million in 2002. The market expansion is driven by a growing need to control heat and electrical resistance in electronics devices. As these devices get smaller, faster and less expensive, electronics manufacturers need a broad selection of thermal management solutions to help them address a dynamic range of process needs.