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$GTCH “We continue to seek to broaden our 3D, multiplanar chip IP with our continuation application. One of the major areas that we plan to enhance is the mount planes of the semiconductor wafers. We believe the idea of mounting on vertical and horizontal planes creates a whole world of possibilities when designing and manufacturing multiplanar microchips. If successfully implemented, we believe these chips will be able to contain more circuitries, operating with higher performance and consuming less power. We believe this is an innovative concept, designed to be accompanied with scaling down ICs size to fit into smaller electronic devices. Redesigning and manufacturing microchips with multiplanetary architecture would enable placing more circuitries on same or smaller space silicon dies, which would expect to significantly lower their cost. The 3D microchip continuation application is planned to broaden the original patent with design and fabrication concepts. With the ever-growing microchip’s complexity, demand for less power, faster performance and smaller size, we believe that the presented patent’s technology can be an efficient solution, enabling economical IC’s design and manufacturing, creating new horizons and standards,” provided Danny Rittman, the Company’s CTO.