Speaking about a maturing ecosystem!!! When TSMC get in on the party with their PDKs bringing together not just manufacturing, but upfront designing (Ansys) and back-end testing and qualification for high-volume throughput, you know the whole ecosystem in getting close to industry-wide shake-up!! Photonics to the rescue...
And who leads the way for nextgen transceivers and on-board solutions to increase bandwidth and lower power consumption in DCs?!?
$LWLG organic electro-optic polymer-based modulators is who!

3x the speed, 1/10th the power, 1/30th the space, while fully designed and compatible with high-volume CMOS foundries

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https://www.ansys.com/news-center/press-releases/4-24-24-ansys-collaborates-with-tsmc-coupe-on-multiphysics

Marco,
Since LWLG already described a future where revenues would be coming from various business verticals, namely, not only AI / HPC DCs, but also Quantum, Healthcare devices, Displays, Defense etc... I would much rather foresee a way forward including the licensing of verticals to specific market leader(s) - by way of JVs if multiple parties are involved- !!!
This would let the team at LWLG keep working on new gens of Perks, specifically tailored to a given set of technical requirements, per vertical business unit... with fat dividends from all :))
But that could just be me...

3x the speed, 1/10th the power in 1/30th the space, compatible with high-volume CMOS foundries!!!


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Herwig,

Thank you for this update!
I think this slide from yesterday's presentation is a must repost with the growing commercial interest proven by the companies that came for private performance demonstrations at OFC24!! Count the number of Tier ones and their decriptions. Make note of the plurals!!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174272195

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Very good point Lew!

To summarize:
As a chip designing outfit, Synopsys are the ones who, after being tasked by a customer based on a set of performance requirements, put together the chip design, following the PDKs (recipes) shared by their foundry partners, thus allowing a smooth production scale-up, based on tested techniques and processes.

So,... if Synopsys feels confident enough in the data that was presented by LWLG, and presumably acknowledged with their own experience, to share it with the public on social business media, maybe, just maybe, now that the wafers have been "commercially" produced and poled successfully, and finally if the testing of devices is good enough to be presented at OFC24 with groundbreaking speed and low power consumption, then assuredly, a commercial deal is nearing and scale up is just about out of the gates!!!

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Druid, At the moment, we are speaking of heterogeneous integration: assemble an IC, assemble a PIC separately, integrate both components together. Wouldn't the reflow process happen separately during the IC manufacturing, without interfering with the PIC part?
This issue, if it is one, doesn't sound to me like it would affect the PIC manufacturing until we speak of On-Board optics, which isn't for a few years ahead at this point in time...
We'll cross that bridge when we get there kinda problem...
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Jeunke22, If I remember correctly, Dr Lebby has been sharing that he's been working with "Network Equipment Companies" since the late 2019 (Annual Letter to Shareholders) /2020 timeframe... this lines up well with a product release this year! And OFC is a prime placement for a news release / product demonstration for the new 51.2T switches!
The ecosystem has been working together for the next node and $LWLG timing matches it perfectly with scale-up starting in 2024.

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Zero credits going around: you are a pawn!!!

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2:05pm JLPTNG shows up on the board, and, did you guess it, the daily attack on our share price takes us down 10cents, hahaha so f'ing predictable!!!

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Think1st maybe Dr. Dr. intends to do more than just talk about it... as he said in the Benzinga interview last week, he intends on demonstrating the performance while explaining the LT stability, by presenting devices / transceivers (4x200G?!?) that have been loaded with EOP modulators coming out of SiP foundries on 200mm wafers that have been poled and tested at the wafer level and production scale...
What are our shorty friends going to say about that when it happens?

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Is it just me or the board has regained a very enjoyable level of civility today?!?

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KCC, so is the Vermont fab of Global foundries, who just received funding recently for their 200mm fab lines!!!

"GlobalFoundries (Nasdaq: GFS) (GF) CEO Dr. Thomas Caulfield was joined today by Vermont Governor Phill Scott, Senator Peter Welch, U.S. Representative Becca Balint, former Senator Patrick Leahy and other GF and community leaders to celebrate the nearly $130 million in planned direct funding as part of the U.S. CHIPS and Science Act and Vermont state funding that will support the modernization of GF’s longest continuously operated fab and the nation’s first and largest Trusted 200mm facility in Essex Junction."

https://gf.com/gf-press-release/globalfoundries-joined-by-vermont-government-officials-to-celebrate-announcement-of-chips-and-science-act-and-state-funding-to-modernize-essex-junction-facility/

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This morning, some kind of fruit, or was it a fruit tart?, wanted to mislead the uneducated readers, on the fact that if you're not working on 300mm wafers, your tech was not even worth wasting time reading about it...
If the seedy one knew what he was speaking about, his comment may have raised eyebrows: but we all know him and his history well enough on this board, to not pay attention.
And to further exemplify his lack of knowledge, those who spend a little time doing real DD, educating themselves, will have noticed the following paragraph in the 10K released last night:
"PIC technologies are based upon semiconductor wafers (such as III-V compound semiconductors – InP, GaAs etc.) as well as silicon wafers (which can be tailored to become SiGe heterogeneous, SOI, etc.). As these platforms are semiconductor based, the wafers are processed in fabs or fabrication facilities to produce devices. As a general rule, silicon has the largest wafers with 8” (200mm) and 12” (300mm) format discs. GaAs typically is running 3” (75mm), 4” (100mm) and 6” (150mm) wafers in production fabs or fabrication plants around the world. There is an expectation that GaAs will eventually move to 8” (200mm) wafers in the next 5 years. InP is in production today on 2” (50mm), 3” (75mm) and 4” (100mm) wafers with an expectation to move to 6” (150mm) in the next 5 years. Heterogeneous solutions with silicon photonics that utilize materials such as SiGe and InP are typically 8” (200mm) and 12” (300mm) format wafers. Polymer photonics can be deposited on either III-V compound semiconductor wafers as well as silicon wafers which makes it suitable for the next generation of PIC based technological platforms for the fiber communications industry."
Those with enough background knowledge and industry connections may even get a clearer idea of the type of leading-edge customers / partners $LWLG is working with when referring to qualifying / testing modulators coming from 200mm wafers runs...

It's friday. If you're serious about your investment here, take some time this weekend and read the 10K: it definitely is time well spent. And it gives me the serenity that 2024 will bear wonderful harvests by the Fall.

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10K: https://s3.amazonaws.com/sec.irpass.cc/2586/0001079973-24-000315.pdf

X, I know what you mean, but then, there's
p2:"Our Company contemplates future applications in market verticals that may address the needs of semiconductor companies, optical network companies, Web 2.0/3.0 media companies, high performance computing companies, telecommunications companies, aerospace companies, automotive companies, as well as for example, government agencies and defense entities."
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AB,
His description of the 51.2T Tomahawk switch, at 12min30 is also quite interesting, especially when you put it in parallel to the new material highlight that you single out, as he speaks of having reduced the power use by 90% compared to previous generations while improving the bandwidth!!! Where have we heard about the importance of a solution that reduces power?!?

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AB,
His description of the 51.2T Tomahawk switch, at 12min30 is also quite interesting, especially when you put it in parallel to the new material highlight that you single out, as he speaks of having reduced the power use by 90% compared to previous generations while improving the bandwidth!!! Where have we heard about the importance of a solution that reduces power?!?

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Proto,
In the discussion reg Drivers per chips, I understand the drivers can eventually be integrated on a single chip, like what the CMOS industry has taught us, but this description from Ayar Lab 4 lane transceiver could be misleading enough to think, maybe this level of integration is what is currently being worked on, rather than a fait-accompli...


Found here:
https://www.photonics.com/Article.aspx?AID=69683

Druid, thanks for teh stimulating conversations.

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Druid, Good thing $LWLG materials work just as efficiently (speed/power) at 1310 and 1550nm for multiple kinds of applications, and still are CMOS compatible and extremely small in size! Nice market to grow into sequentially.

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Dan,
By 2026/2027, 3 years from now, when according to $LWLG first ever ramp volume forecast, their SP could be trading between $50-$100+, depending on future multiples associated with an AI-critical component supplier, neither Carl nor any other long-term Longs, will remember the discomfort of having to wait those few extra months, early on in the project commercial launching phase... The good thing is, as Longs, we can go to bed at night sleeping like babies, without the fear of the coming breakthrough PR that will light this rocket on fire.
Make no mistake about it: it is coming.

2023 annual letter:
...We continue to receive strong interest in licensing our technologies from companies ranging from innovative start-ups to existing OEM companies, as well as multinational tier-1 corporations which manufacture data communications network equipment. In addition, several of these tier-1 manufacturers have requested to meet and test our polymer modulators, while fiber optic transceiver companies have expressed interest in learning how to implement polymer modulators into their ongoing 800G transceiver development programs. Also of note, several commercial foundries are implementing our PIC designs for multi-channel polymer modulator engines, including 4 channel solutions for 800G. Taken together, we continue to see significant momentum on all fronts and we are highly encouraged by these positive discussions.

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Micro, the level of complexity when we hear about heterogenous integration cannot be understated!
Tens/ Hundreds of suppliers have to bring in their expertise in research/materials/deposition/devices/manufacturing/ bonding/welding/ testing/measuring/packaging/re-testing/... you get the idea. Dr Lebby often highlighted the importance of the whole ecosystem moving forward at the same pace for the products to find their high-volume scaling path to commercialization.
All this is best achieved if all are involved early on in the process, choosing to focus on what benefits can be derived from working together, as opposed to trying and failing to get there alone...

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Lots of work being conducted on Lasers dimension for pluggables insertion:
https://effectphotonics.com/insights/why-small-laser-size-matters/

Great to know that LWLG has the lab space operational since last summer, including personnel, for Lasers qualification work!!

LWLG 4x200G PIC on it's way for commercial availability 2H2024, in line with timing from NVDA for NVLink release of 1600G on 8 lanes expected for later this year. NVDA has to be interested in a CMOS compatible PIC solution that reaches 3x speed (200G) while using 1/10th the power (~0.5V/lane) in only 1/30th the space for their nextgen transceivers.

Exciting months ahead.
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Great article ! Thank you for the reminder... Notice how Dr Lebby puts forward the impending need for servers companies... No wonder the Cisco's and Ciena's of the world are in our funnel of engagements... Even if qualification takes time...
See: https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/64db7c2d-d721-ec8f-b813-4c0a8ea7d6c1?origin=2

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One day soon, you will have to eat all these sarcastic statements Nrdc92! Good luck!
Open your eyes and you will find it written in plain english, right here, in front of your nose:

Dr Dr M Lebby speaker at PIC 2024:
"Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. [b]Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages).

https://picinternational.net/speakers

Right in front of your nose...

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Carl, This is good nformation to post in the comments on the other site...

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Spartex, I agree and forgot to say the find was not mine, but that of a dear friend of LWLG, who thinks his time better spent, farther from some of the spewers around here.... Good news all the same.

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Great News: For the 1st time in company history, our CEO is invited to share his knowledge about hybrid integration at OFC!
See: https://www.ofcconference.org/en-us/home/program-speakers/workshops/will-heterogeneous-integration-meet-the-needs/
Sunday, 24 March, 16:00 – 18:30

Room 2

Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device that enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption. It fosters the creation of new optical products that serve new applications with more demanding performance requirements. In this session, we explore how well (and when) the various approaches to heterogeneous integration will meet these challenging needs., and the status and challenges for the service providers (e.g., type of integration platforms, process/tools maturity, and how to handle non-traditional Si materials).

Organizers
Lukas Chrostowski, University of British Columbia, Canada

Patrick Lo, Advanced Micro Foundry, Singapore

Dan Pitt, Palo Alto Innovation Advisors, United States

Mengjie Yu, University of Southern California, United States

Speakers
Alex Chikhaoui, X-Celeprint, Ireland

Ivan Huang, Avicena Tech, United States

Michael Lebby, Lightwave Logic, United States

Sylvie Menezo, Scintil, France

Edward Preisler, Tower Semiconductor, United States

Jing Zhang, IMEC AND Ghent University, Belgium

Mian Zhang, Hyperlight, United States

Now, will the cherry on top be a participation in the DemoZone, where the following subjects are centers of focus: The 2024 OFC Demo Zone showcases various aspects of optical physical layer transmission, hardware, and network orchestration/intelligence. These aspects include, but are not restricted to:

(…)
Systems, sub-systems, and devices for free-space, microwave, or optical fiber transmission and switching;
Server systems and wide bandwidth optical interconnects for data center and high-performance computing; (…)

Looking forward to additional company communication as they approach their scale-up phase :
Reminder from the 2023 ASM (LWLG transceiver shipments, initial forecast):
2024: 800G: 7,000 + 1600G: 900
2025: 61,000 + 17,000
2026: 196,000 + 174,000
which , based on forecasts that were detailed on this board, could result, with a very conservative 50x PE, to the share price overtaking the $100 mark?!?
Will 2024 prove to be the year photonic integration takes a new step closer on it's way towards all-optical computing?

I'm looking forward to finding out.

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Hi Pro,
We know they have demonstrated that photodetectors can capture at least up to 250Ghz signals. Se here:
https://www.lightwavelogic.com/news-events-presentation/press-releases/#b2iLibScrollTo
So, I don't think they have any concern on this part of the link...

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Happy New Year X!

GLTAL,
AR.

How about patents publications regarding our new proprietary processes??

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"Dude" Are you willfully blind or irreparably illiterate?!?
How many scandium producing mine projects do you know of in Nebraska? And even more so, a mine with a processing capability?
p225:"The committee recognizes that the United States may soon become a major producer of high-purity scandium oxide by virtue of a proposed mine and mineral
processing project in Nebraska."
How many domestically sourced Niobium facility do you know of?
p251: "The committee therefore directs the Under Secretary of Defense for Acquisition & Sustainment to brief the House Committee on
Armed Services not later than December 31, 2024, on the Department’s strategy to ensure a domestic source for niobium oxide."

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PS: I had the pleasure of meeting Jim S in person on a few occasions but several people here can vouch for the fact that I am not him. Thanks for the flattery though... lol

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Dutchfree, Here is a link to the document that was signed today:
https://www.govinfo.gov/content/pkg/CRPT-118hrpt125/pdf/CRPT-118hrpt125.pdf

And here are the details provided by Chico himself...

NIOBIUM, TITANIUM, SCANDIUM & RARE EARTH MINERALS: ~H.R. 2670 - NATIONAL DEFENSE AUTHORIZATION ACT FOR FISCAL YEAR 2024~ The urgent need to diversify the United States Defense Industrial base to advance domestic capability, production, modernization, and resilience!

CRPT-118hrpt125.pdf (govinfo.gov)

Page #251~Secure Supply of Niobium Oxide

Page # 232 & 233 ~Extraction and Processing Methods of Rare Earth Elements and Critical Minerals

Page # 223 -224 Aquisition of Titanium

Page # 225-26 ~Aluminum-Scandium Master Alloy Production

Think of it what you wish...
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House passes the Defense Bill with over 2/3 of votes in bi-partisan effort!

https://www.reuters.com/world/us/congress-passes-886-billion-defense-policy-bill-biden-sign-into-law-2023-12-14/

This includes the National Defense Authorization Act (NDAA) that specifically mentions Niocorp's Scandium and Niobium project out of Elk Creek, NE!

On to the president's desk for final signature.



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Wow GMan,
Great update.
Thanks for sharing.

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Market update - From M Lutkowitz LinkedIn- Principal at Fibereality - Dec.4, 2023:
Coming out of nowhere, based on fibeReality’s most recent intelligence, the hyperscalers and NVIDIA are purchasing all the 800G gear in sight (please see: https://lnkd.in/gH5e5GaY). This development was not prognosticated by anybody, including the optics industry cheerleaders. Undoubtedly, the earlier inventory buildout by large users helped to obscure this dramatic change, as the eventual requirement for NVIDIA to farm out in a big way for such equipment, otherwise would have immediately left a greater impression. The largest transceiver suppliers (please see: https://lnkd.in/g_esDRGN) are apparently scrambling to keep pace with demand that could conceivably continue into 2024 as well as into 2025, as the massive training systems for AI have hardly turned out to be hype regarding their impact on the optical device market. In fact, they are providing an unparalleled opportunity for growth. Any point of moderation that would be expected to inevitably take place, simply cannot be predicted right now. We are indeed in “uncharted territory” (please see: https://lnkd.in/eAQbuhjT).

In the last 40 years of the optical components/systems marketplace, there has never been an aberration to occur of this magnitude. Even with the arrival of the Internet in the 1990s, the positive effect on the growth of bandwidth was still diminished with so many of the largest customers across the world still being shackled by the continuing existence of government regulations. Also, the financial community very mistakenly treated them as just a bunch of dotcoms, rather than as traditionally conservative in their planning efforts, resulting in the bubble bursting around the turn of the century. The cloud services providers are among the most successful entities in the history of business, and their optics purchases apply to their private, internal networks. Most significantly, the emergence of AI creates a substantially heightened level of direct competition amongst these players, in which for the first time, they may even be faced with an existential threat, if they do not become sufficiently differentiated, including for their individual requirements in that optical sector (please see: https://lnkd.in/eSQPkTsr).

What a time to launch a range of offering at the 800G and 1600G high-end of the market: price will not be an issue if differentiation is the name of the game! And Lightwave Logic brings plenty of differentiation at 1/30th the space in a transceiver, 3x the speed and 1/10th the power use!!!
Whether deals are signed in 2023, 2024 or 2025 and later, what a time to be a Long term Investor in the $LWLG project!

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Look at them run EOD as the price rises!!! ahahah

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Nrdc92,

Maybe you will find this new white paper as interesting as I did?!?
https://www.jeppix.eu/wp-content/uploads/2023/09/White-paper-on-design-agnostic-PIC-validation_V1.0.pdf

It comes from a collaboration between JePixx (European Foundry) and Fraunhoffer in Germany...
I think it very clearly speaks about the fact that we are witnessing the birth of a new high-volume industry, where photonics is following in the tracks of the electronics industry, working in collaboration with them actually...
And to me it also clearly helps understand the delay between LWLG announcing its intent to work with foundries in 2021 (video with Global Foundry Anthony Yu) and starting commercialization in 2024: the ecosystem had to be built from scratch! from making sure the foundries could work with polymers (as a material (ASM22)), then back to the PIC design houses, then back to testing 3rd party designs at the foundries (ASM23), then defining high volume testing processes with the help of newly invented testing equipment (like Keysight equipment measuring past 110Ghz), etc...
We're at the heart of inventing a new industry here!!!

No wonder Michael Lebby was chosen to be the head of Optica next year: we're the engine to making photonics a high-volume manufacturing industry, following the path defined by electronics 50 years ago!
Polymers are the glue that brought Silicon Phonics and/or InP forward to the point it will be able to answer the market's most advanced performance demands in terms of speed and reduced power consumption to the point of being compatible with high-volume manufacturing (LWLG winner of the Most Innovative Hybrid PIC/Optical Integration Platform Award at ECOC2023)
We've been here a long time and for sure some have been caught on the wrong side of a head-fake trade, but make no mistake about it: we bet on the right solution to answer the next move forward of humanity's technological long march.
Electro-optics are the solution today and Lightwave Logic Polymer Photonic EO modulators-based ICs are the heart of this solution!
Commercialization has started and will gain speed in the coming years.

We're just about getting there. "It's happening!"

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Walter, to see how they do it, review the history in some Indian provinces last summer : let us all be aware. They are doing it already and any country involved in the Silk Road infrastructure buildup initiative is at risk...
AR.

Thank you Douginil,
I did the same on his X account last week as well...

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Stellantis and UAW agreement ratified... Time to move on to offtakes!
https://www.reuters.com/business/autos-transportation/uaw-workers-stellantis-ratify-labor-contract-with-automaker-2023-11-17/

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I guess we will have wait to see how fast the company goes from being a ~$500M non-commercial entity to being a >$10B juggernaut...
I have what it takes to wait 3-4 more years without whining at every change of the wind direction.
Take care,

AR.

Nrdc92,

I did not use these words:
"...he is in no way a (...) person who has sufficient industry gravitas..."
You did. There is no misinterpretation possible.
This is misplaced.

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