Friday, March 01, 2024 3:38:49 PM
If the seedy one knew what he was speaking about, his comment may have raised eyebrows: but we all know him and his history well enough on this board, to not pay attention.
And to further exemplify his lack of knowledge, those who spend a little time doing real DD, educating themselves, will have noticed the following paragraph in the 10K released last night:
"PIC technologies are based upon semiconductor wafers (such as III-V compound semiconductors – InP, GaAs etc.) as well as silicon wafers (which can be tailored to become SiGe heterogeneous, SOI, etc.). As these platforms are semiconductor based, the wafers are processed in fabs or fabrication facilities to produce devices. As a general rule, silicon has the largest wafers with 8” (200mm) and 12” (300mm) format discs. GaAs typically is running 3” (75mm), 4” (100mm) and 6” (150mm) wafers in production fabs or fabrication plants around the world. There is an expectation that GaAs will eventually move to 8” (200mm) wafers in the next 5 years. InP is in production today on 2” (50mm), 3” (75mm) and 4” (100mm) wafers with an expectation to move to 6” (150mm) in the next 5 years. Heterogeneous solutions with silicon photonics that utilize materials such as SiGe and InP are typically 8” (200mm) and 12” (300mm) format wafers. Polymer photonics can be deposited on either III-V compound semiconductor wafers as well as silicon wafers which makes it suitable for the next generation of PIC based technological platforms for the fiber communications industry."
Those with enough background knowledge and industry connections may even get a clearer idea of the type of leading-edge customers / partners $LWLG is working with when referring to qualifying / testing modulators coming from 200mm wafers runs...
It's friday. If you're serious about your investment here, take some time this weekend and read the 10K: it definitely is time well spent. And it gives me the serenity that 2024 will bear wonderful harvests by the Fall.
GLTAL
AR.
10K: https://s3.amazonaws.com/sec.irpass.cc/2586/0001079973-24-000315.pdf
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