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Tuesday, 02/06/2024 5:08:38 PM

Tuesday, February 06, 2024 5:08:38 PM

Post# of 189438
Great News: For the 1st time in company history, our CEO is invited to share his knowledge about hybrid integration at OFC!
See: https://www.ofcconference.org/en-us/home/program-speakers/workshops/will-heterogeneous-integration-meet-the-needs/
Sunday, 24 March, 16:00 – 18:30

Room 2

Heterogeneous Integration opens new capabilities for technologies, use cases, and market participants. Integrating devices developed separately and often on different substrates (as, for example, III-V semiconductors and Silicon Photonics) into a single composite device that enables miniaturization, simplifies interconnection, saves materials, and reduces energy consumption. It fosters the creation of new optical products that serve new applications with more demanding performance requirements. In this session, we explore how well (and when) the various approaches to heterogeneous integration will meet these challenging needs., and the status and challenges for the service providers (e.g., type of integration platforms, process/tools maturity, and how to handle non-traditional Si materials).

Organizers
Lukas Chrostowski, University of British Columbia, Canada

Patrick Lo, Advanced Micro Foundry, Singapore

Dan Pitt, Palo Alto Innovation Advisors, United States

Mengjie Yu, University of Southern California, United States

Speakers
Alex Chikhaoui, X-Celeprint, Ireland

Ivan Huang, Avicena Tech, United States

Michael Lebby, Lightwave Logic, United States

Sylvie Menezo, Scintil, France

Edward Preisler, Tower Semiconductor, United States

Jing Zhang, IMEC AND Ghent University, Belgium

Mian Zhang, Hyperlight, United States

Now, will the cherry on top be a participation in the DemoZone, where the following subjects are centers of focus: The 2024 OFC Demo Zone showcases various aspects of optical physical layer transmission, hardware, and network orchestration/intelligence. These aspects include, but are not restricted to:

(…)
Systems, sub-systems, and devices for free-space, microwave, or optical fiber transmission and switching;
Server systems and wide bandwidth optical interconnects for data center and high-performance computing; (…)

Looking forward to additional company communication as they approach their scale-up phase :
Reminder from the 2023 ASM (LWLG transceiver shipments, initial forecast):
2024: 800G: 7,000 + 1600G: 900
2025: 61,000 + 17,000
2026: 196,000 + 174,000
which , based on forecasts that were detailed on this board, could result, with a very conservative 50x PE, to the share price overtaking the $100 mark?!?
Will 2024 prove to be the year photonic integration takes a new step closer on it's way towards all-optical computing?

I'm looking forward to finding out.

GLTAL
AR.
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