is currently solvent and making every effort to stay that way.
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Ditto again today 🤔 (Ark bought more $ACHR )
$ACHR News: Cathie Wood Pours Millions Into These 2 Stocks, Analysts Say They Have Strong Upside Potential — Here’s Why You Should Pay Attention
"...
...In fact, Wood is not alone in thinking these are worthwhile additions to a portfolio. According to the TipRanks database, certain Street analysts see big gains ahead for the pair. Let’s see why investors should pay attention here.
Archer Aviation (ACHR)
Speaking of disruptive innovation, let’s delve into the realm of urban air mobility. Archer Aviation is an innovative electric vertical takeoff and landing (eVTOL) aircraft manufacturer and technology company. Archer is a key player in the emerging urban air mobility (UAM) industry, with a mission to revolutionize urban transportation by developing sustainable and efficient electric aircraft designed for short-distance, urban air travel.
It’s still early days for this pre-revenue firm, but Archer has some big backers behind it and recently obtained a $215 million investment from a consortium that featured Stellantis, Boeing, and United Airlines.
The backlog for its eVTOL vehicle, Midnight, includes U.S. airlines United and Mesa, both of which are considered strategic partners, and so is Stellantis, the auto giant responsible for being the exclusive contract manufacturer for the mass production of Midnight. Archer has set its sights on achieving certification in 2024 and launching commercial operations the following year.
More in the here and now, earlier this month, the company announced that the U.S. Air Force had delivered the company’s initial payment, totaling nearly $1 million for a mobile flight simulator. It amounts to the first payment of the recently disclosed contracts that have a value of up to $142 million.
The stock has been one of the year’s biggest success stories, even after a recent pullback, delivering year-to-date gains of 180%. Meanwhile, Wood has been loading up. She bought 6,005,798 shares over the past 2 months via her ARKK, ARKQ, and ARKX ETFs. These ETFs now hold 15,798,848 shares combined, which currently command a market value of more than $82 million.
While there are plenty of unknowns ahead for this disruptor, Raymond James analyst Savanthi Syth thinks the company offers a unique value proposition.
“Archer continue[s] to lead on certification among companies under coverage, albeit FAA timelines are far from certain, and the industry continues to move forward with certification-conforming aircraft coming in 2024 (with pilot-on-board flights likely at Archer and Joby in 1H24), which we believe should build momentum in sentiment among investors and the public,” Syth explained. “While we are generally constructive on the prospects and opportunity for the group, ACHR stands out as particularly compelling at current valuation combined with the progress to date and a balanced approach to commercialization.”
These comments underpin Syth’s Outperform (i.e., Buy) rating while her $9 price target implies shares will gain 71% over the coming year. (To watch Syth’s track record, click here)
Overall, the bulls are definitely running for ACHR, as the stock’s Strong Buy consensus rating shows – it is backed up by 4 unanimously positive analyst reviews. The shares are trading for $5.21 and the $9.5 average price target suggests a one-year upside potential of ~81%."
Today's action looks like a little covering taking place. (Spike on low volume)
Company is active on media all of a sudden- shorts smelling news?
Ark bought more $ACHR today too (#msg-172990353) 😉
News (from Atomera's website): Boosting Semiconductor Performance With Quantum-Engineered Materials
Atomera-a semiconductor materials and technology licensing company, is the newest member of the ESD Alliance. In welcoming Atomera to our membership, I spoke with Atomera CEO Scott Bibaud to learn more about its atomic-level technology that enhances transistors to improve performance in electronic products. We also discussed quantum-engineered materials and their impact on chip performance, recruiting and industry trends.
Smith: The Atomera website highlights quantum-engineered materials. Can you elaborate on what a quantum-engineered material is and why it is different than other materials?
Bibaud: We consider a material to be quantum-engineered when it is first designed using quantum-mechanical ab initio simulations that identify the required material properties. This is in contrast to most materials in use in the semiconductor industry, which are either known in nature or developed empirically. Atomera’s MST® (Mears Silicon Technology™) is an example of a bottoms-up quantum-engineered material as are others such as ReRAM/MRAM memory elements, quantum wells/dots, and high-K metal gate (HKMG) metal stacks.
Smith: How do quantum-engineered materials improve chip performance? What steps does a fab need to take to integrate quantum-engineered materials?
Bibaud: Quantum-engineered materials are used in a variety of applications and can provide benefits in chip power, performance, area, and cost (PPAC) and memory storage performance. Integration into the fabrication process depends on where the material is used. In each case, the overall system benefit must be assessed against the change in manufacturing cost – significant changes are only merited if they provide significant benefits.
HSIf the physical and electrical properties of the quantum-engineered material closely resemble the baseline semiconductor material such as silicon, there is often a straightforward integration path into conventional manufacturing processes. However, the quantum-engineered features may subtly alter the interactions with electrical dopants and semiconductor point-defects. In a material such as MST, this enables high-precision control of doping profiles and reduces surface roughness scattering at adjacent dielectric interfaces. The improved dielectric interface further facilitates improvement in wafer-level reliability.
To take advantage of these parametric benefits, an epitaxial* step must be inserted into the flow, either as a blanket deposition on the starting substrate (for a restricted set of flows) or selectively during the front-end process steps. Typically, implants also need to be re-optimized.
Smith: Design and fabrication have been unconnected parts of the semiconductor flow. Do you see that changing or evolving?
Bibaud: This has been changing for several years now. Nearly all FinFET nodes were designed using a DTCO (Design and Technology Co-Optimization) technique whereby design experts work in parallel with the process development team to determine the PPAC benefits of the process and suggest critical optimizations to improve this metric.
The introduction of quantum-engineered materials such as Atomera’s MST works in a similar way in that it requires close collaboration between the material vendor and the customer’s process development team. This ensures that the customer can derive the maximum benefits and ROI by employing quantum-engineered materials.
Smith: Staffing shortages are a huge problem for the semiconductor industry. How are you addressing the recruiting and hiring challenges?
ImageBibaud: Since our material is applicable to a wide variety of processes from legacy 180nm to the latest gate-all-around and DRAM, we seek people who are experienced with both the intricacies of semiconductor processing as well as the impacts on the device and the end products. Therefore, we typically hire extremely experienced people from the major IC companies as well as from the EDA and IP companies focused on transistor-level design. Like the rest of the semiconductor industry, we see the critical need for workforce development to support our industry.
Smith: What technology trends are you seeing?
Bibaud: The major trend we see is the enormous power needs of AI running up against the slowdown in device scaling.
The rate of AI adoption is accelerating the proliferation of expensive, power-hungry GPUs, high-bandwidth DRAMs, and other data center devices. Unfortunately, this is coupled with the end of the easy scaling era of Moore’s Law, whereby PPAC improvements are becoming much more difficult and expensive to achieve. This is especially true in gate-all-around (GAA) devices, which have become so difficult to develop that an ecosystem of suppliers is emerging to provide tools, materials, and process modules to enable these devices. The result is that AI-based workloads are consuming a measurable part of the world’s total electric production.
HSThis would be (marginally) acceptable if this power consumption was all doing useful work. But it isn’t – there is a lot of waste. And one of the primary causes of the waste is the little-understood issue of random dopant fluctuation, or RDF. RDF is the primary cause of transistor variability, and this variability determines how much voltage scaling can be applied to GPUs, CPUs, and nearly all other processors. It also degrades the refresh interval in DRAMs. DRAM refresh accounts for 10%-15% of total server power today and is increasing; halving the RDF in the sense amps could cut refresh power by more than 2x.
A relatively easy solution for RDF-caused power waste might be to make device sizes larger. This would reduce mismatch but it is the opposite of scaling.
The industry needs a better solution to minimize RDF. Currently, alternative methods such as carbon pinning, counter-doping, and lower-temperature processing steps are being deployed to mitigate the issue. While they do offer some improvements, these approaches aren’t effective enough. The good news is that advanced quantum-engineered materials are showing very promising results in addressing RDF.
*Epitaxy is a type of material deposition in which the deposited layers maintain the same orientation as the crystalline seed layer.
About Scott Bibaud
Scott Bibaud is President, Chief Executive Officer and a director of Atomera, a role he assumed in 2015. Bibaud has been active in the semiconductor industry for more than 25 years and successfully built a number of businesses in his career that grew to generate over $1 Billion in revenue at some of the largest semiconductor companies. Most recently, he was Senior Vice President and General Manager of Altera’s Communications and Broadcast Division. Prior to that, he was Executive Vice President and General Manager of the Mobile Platforms Group at Broadcom. Bibaud holds a B.S. degree in Electrical Engineering from Rensselaer Polytechnic Institute and an MBA from Harvard Business School.
Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community.
Topics: Atomera , ESD Alliance , semiconductors , semiconductor design , quantum engineered materials , Workforce Development , talent , FinFET , Design and Technology Co-Optimization , Atomera Mears Silicon Technology , Atomera MST , AI , Artificial Intelligence , gate-all-around devices
Today's (10/09/23) latest blog post- Atomera joins SEMI, SOI Consortium, and ESD Alliance
ARK bought even more $ACHR yesterday (#msg-172979404)
Sorry for the double post- I know I cancelled the first one, and confirmed it was cancelled, before replying to a previous post of my own. (It was the reason I cancelled it because I wanted to make sure I was referencing a post of the same topic instead of simply a new post).
I'm tellin ya, Ihub is NOT running smooth on my 'puter the past few weeks...
I'd be concerned it was me 'cept, I haven't had a problem with any other website...(at least that I'm aware of)
Cathie still buying $ACHR (#msg-172972239)
Cathie still buying $ACHR (#msg-172972239)
$ATOM LD Micro webcast replay from 10/3 is now available.
Recommend if you are in, or, interested in $ATOM
LD Micro Virtual event The RePlay of Scott's presentation this past Tuesday is now available.
Sign up like you would for any webcast-
ST integration "Imminent" (Scott's word 😉)
and is now getting bigger, perhaps inflamed
probably COVID which is running rampant here
I was pretty sure your question was more rhetorical in nature 🧐😁
What should it be called?
Sounds like an attack from spaceships in orbit
Another is Joe Biden and Hillary both confirmed. With possible Pelosi, Bill Clinton, and many more. Just those were not confirmed yet. And don't forget FETTERMAN is also dead
That would be a great name for a metal band............'Injurious Wedgie'
that hidden message is ''member level''
Yeah, I thought so to, at first. I've tried to match it to other words in the post to see where it's truncated and sometimes there's no such words ending with some of those letters. It's been intermittent and it seems to affect newly posted content. It never lasts. But it can be on there for several minutes even after refreshing the page.
I also see it on my phone so it doesn't seem logical to be a browser issue...????
Lol, THAT, I can relate to 😁
Kudos! Very well handled. I admire your tact.
A trait I do NOT possess 😏
$ATOM New white paper
New Whitepaper “MST® Benefits for DRAM Sense Amplifiers”
Below is a prelude from Atomera's site and NOT the paper itself. Follow the link above to read the actual paper:
White Paper: “MST® Benefits for DRAM Sense Amplifiers”
By Jeff Lewis, SVP Business Devt. and Marketing
Atomera’s previous white papers have focused on advanced logic, especially gate-all-around (GAA) and nanosheets, and on BCD power devices. Today’s white paper, “MST Benefits for DRAM Sense Amplifiers” is our first paper to describe how MST can also improve memory devices. As many people consider the sense amplifier the “heart” of a DRAM chip, any improvement here can reap significant benefits.
The white paper describes recent learnings about Atomera’s MST® technology and how it can improve the mismatch inherent in DRAM sense amplifiers. This is becoming a critical issue for the latest DRAMs because bitcell capacitors are hitting their scaling limits and the total stored charge is now declining. Reducing mismatch enables numerous cost- and power-reduction benefits that are becoming critical with the huge use of DRAM in AI-focused datacenters.
The paper first describes how DRAM sense amplifiers work; goes into detail on what causes sense amp mismatch, especially random dopant fluctuation (RDF); how MST enables device designers to create the near-ideal dopant profile to minimize RDF; and concludes with a description of the DRAM product benefits of reduced mismatch.
...about a FOX Business News blurb...
"....media attention apparently,.."
{$ATOM} ST site going nuts over yesterday's move- lot's of interesting news tidbits from our friend Joe among others. Volume was decent for a change as well. Conviction or FOMO?
Craig Hallum update: #msg-172875416
Craig Hallum Update: Craig Hallum Note on 8/3/23 Buy Rating and $17 Target
Atomera to Present at SISPAD 2023
September 20, 2023--(BUSINESS WIRE)--Atomera Incorporated (Nasdaq: ATOM):
WHO:
Professor Hiu Yung Wong of San Jose University, Robert J. Mears, CTO, and Hideki Takeuchi, Vice President of Engineering of Atomera Incorporated (Nasdaq: ATOM), a semiconductor materials and technology licensing company
WHAT:
In-person presentation of San Jose State’s and Atomera’s joint poster, entitled
"Cryogenic Electron Mobility and Subthreshold Slope of Oxygen-Inserted (OI) Si Channel nMOSFETs"
WHEN:
Wednesday, September 27 from 11 p.m. – Thursday, September 28 12:30 a.m. PDT
Thursday, September 28 from 3 p.m. – 4:30 p.m. JST
WHERE:
Kobe Chamber of Commerce and Industry (KCCI), Meeting Room 1
6-1 Minatojimanakamachi, Chuo-ku,
Kobe-shi, Hyogo 650-8543, Japan
This poster presentation will discuss the new findings of the physical mechanism of why MST® (also referred to as "Oxygen-inserted", or "OI Si", in nMOSFETs channel) provides higher inversion-layer carrier mobility than a regular silicon channel, thus enabling higher ON-state current of CMOS devices compared to the baseline devices. Cryogenic-temperature electron-mobility measurement at San Jose State University revealed that Atomera’s MST film improves surface-roughness scattering by 53% compared to a regular Si channel – a significant result because surface-roughness scattering is typically the dominant mobility barrier in high vertical effective field. In addition, MST improves Coulomb scattering, which is significant at low vertical effective field, by reducing ionized dopant impurities near the gate dielectric. A simple analytical formula to describe the observed mobility behaviors of the MST film has been established for compact modeling.
Maybe for those margined, but for me? It'll be a second chance opportunity ...😏
I was late to the first round.
Remains to be seen but she did buy another 250K shares yesterday... she's obviously not shorting it at the moment.
I take these articles with a grain of salt but still interesting reading to know what’s out there…
$ACHR Bought again today- (Cathie Wood & Ark Invest's)
Wish they'd buy some $ATOM as long as they're at it...😏
Just saw a blurb on CNBC here in Germany about $ACHR (and ARK investment involvement).
Just saw a CNBC blurb about Archer Aviation here in Germany.
"Not Detroit! Anything but that... no...no..."
Lol. Tx!
Thanks. I'm counting on it 🙂