Says the guy with a few hundred thousand reasons to remain positive on the omitted data. The lower threshold is increasing on the graph (-STDEV) and the material is showing signs of degradation at 2000 hrs. One can only assume the exponential nature of the curve at 3,000 or 5,000 hrs.
Thanks for responding. Any thoughts on where we go from here based on the presentation given by Lebby?
They seemed to focus on the New Material announced back in February 2019.
Some posters here have expressed the view previously that no one will swap out their existing 50 gbps legacy modulators, and so the focus will be the 100 gbps modulators. Do you agree, OR do you feel that they would be able to enter the market with 50 GBPS modulators?
Hey PG, “Ribbon bonds” at 40 GHz or more? I worked in the MMIC world for a number of years and we used multiple “wire bonds” in various configurations as well as ribbon bonds in certain areas. From that experience I can say that large loops kill performance. Bonding to far back from a substrate transition edge kills performance. From the picture in the presentation they could make some changes mechanically in their build to bolster performance. Any thoughts on this?