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Hard to believe I bought my first block in Aug. 2004, talk about having patients:)
Two pics of Ewit on Twitter from the Photonic Integration Conf 2019...
Ewit Roos, PhotonDelta: strong integrated photonics Dutch-centred ecosystem set to grow to over 1bn EUR #PHIC2019 #PHAPPS2019
That is quite impressive, thank you for sharing inversor86. ML has got to be climbing the ladder of the most prolific inventors with this recent activity. An individual does not go through this kind of effort unless they are committed to an eventual outcome objective. I'm looking forward to the day when all the pieces of this puzzle fall into place. GLTA!
Did we get any info on the much anticipated 5k hr R/T?
I see ML's friend from PhotonDelta will be speaking at the Photonic Integration Conference in the Netherlands on Oct. 1st.....https://www.phiconference.com/program/
Thx Richard....https://www.photondelta.eu
Several more photos just posted to TWTR, I wish I could identify his companions:)
If I'm not mistaking, ML takes the podium at 6:30 am est
ML's presentation tomorrow am is sandwiched directly between Intel and HP....not a bad place to be:)
TUESDAY 24 SEPTEMBER – MORNING SESSION
Topic: Photonics integration and digital silicon photonics
Start Finish Title Presenter Company
10:20 10:50 The Market for High Speed Optical Communications Lisa Huff Ovum
10:55 11:25 Integrated Silicon Photonics for Future Datacenter Applications Thomas Liljeberg Intel
11:30 12:00 Polymer modulators with >50GHz performance for power consumption reduction at 400, 800, and 1600 Gbaud aggregated datarates Michael Lebby Lightwave Logic
12:05 12:35 Innovative integrated photonics for green supercomputing Di Liang Hewlett Packard Enterprise
12:40 13:10 Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems Martin Guy Ciena
13:15 13:45 Next Generation Coherent – Beyond transport networks Tom Williams Acacia Communications
ML's presentation tomorrow am is sandwiched directly between Intel and HP....not a bad place to be:)
TUESDAY 24 SEPTEMBER – MORNING SESSION
Topic: Photonics integration and digital silicon photonics
Start Finish Title Presenter Company
10:20 10:50 The Market for High Speed Optical Communications Lisa Huff Ovum
10:55 11:25 Integrated Silicon Photonics for Future Datacenter Applications Thomas Liljeberg Intel
11:30 12:00 Polymer modulators with >50GHz performance for power consumption reduction at 400, 800, and 1600 Gbaud aggregated datarates Michael Lebby Lightwave Logic
12:05 12:35 Innovative integrated photonics for green supercomputing Di Liang Hewlett Packard Enterprise
12:40 13:10 Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems Martin Guy Ciena
13:15 13:45 Next Generation Coherent – Beyond transport networks Tom Williams Acacia Communications
EPIC VIP Party at ECOC is a traditional event dedicated to stimulate networking among the EPIC members and invited guests. We expect 150 people to attend this event. The program features the fruitful networking time, snacks & drinks. Participation at the Party is by invitation only, so before registering please make sure you received the invitation from the EPIC staff.
"and you know it can have an impact with the big data center folks, this is exciting"....
So who are those "big data center folks"?
Here's about 275 of them....https://www.datacenters.com/providers
I particularly like this 4 min snippet from back in April, we have been actively engaged with customers for quite some time now. Twice ML stated "when you have something twice as fast as the competition that uses less energy, that's exciting".
We are getting close:))
×
Chair(s):
Room: Hall 7 (RDS)
Time: 14:00 - 17:30
Presentations
Polymer modulators enable the next generation of speeds and low power in optical networks
Michael Lebby , Lightwave Logic Inc. , USA
Advanced hybrid polymers for optical building blocks in PICs
Arne Schleunitz , Micro Resist Technology GmbH , Germany
Organic-inorganic hybrid materials for co-package
Hideyuki Nawata , Nissan Chemical Industries Ltd , Japan
Polymer optical waveguide for high-density optical packaging with PICs
Takaaki Ishigure , Keio University , Japan
Hybrid integration of silicon nitride: technology and scaling
Douwe Geuzebroek , LioniX International BV , Netherlands
Automating complex hybrid assembly processes for the PolyBoard requirements
Ignazio Piacentini , ficonTEC GmbH , Germany
PDK-enabled layout-aware circuit design and system validation
André Richter , VPIphotonics GmbH , Germany
Hybrid PolyBoard-on-TriPleX platform for remote ranging and sensing applications
Christos Kouloumentas , ICCS/NTUA , Greece
Quantum Labs on the Chip
Hannes Hübel , AIT Austrian Institute of Technology GmbH , Austria
Hybrid silicon photonics and plasmonics: From optical communications to THz signal processing
Christian Koos , Vanguard Photonics GmbH , Germany
Integrated Microwave Photonics: Advantages of a hybrid integration approach based on polymer
Guillermo Carpintero , Universidad Carlos III de Madrid , Spain
Scaling short-reach interconnects with hybrid PICs
Paraskevas Bakopoulos , Mellanox Technologies Ltd , Israel
ML to give his first presentation at 2:00 pm Dublin time, or 9:00 am EST
From LWLG's website...
"It is estimated that of the $43B photonics market that is forecasted by 2025, over 69% of this market will be PIC based. This means that PICs are forecasted to reach over $30B in revenue by 2025. It is clear that PIC based technologies will become de facto by 2025. Deeper analysis has shown the fiber optic transceiver segments within the photonics market to grow to $25B by 2025 representing 50% of the $43B total photonics market. This indicates that not only PICs will grow significantly, but PICs will be built into transceivers as transceivers are forecasted to be the key vehicle to support the fiber communications market over the next decade."
We are well positioned!
Outstanding post proto!
Well Jim, were getting something, not NOTHING, very first sentence.....
ENGLEWOOD, Colo., Sept. 19, 2019 /PRNewswire/ -- Lightwave Logic, Inc. (OTCQB: LWLG) announced today that it will be providing the first technical results following its prior announcement of a materials breakthrough in February.
Weather it is what we are hoping for is TBD...
GLTA!
If you haven't taken the time to watch this presentation by Applied Materials CEO Gary Dickerson on the $10 Trillion dollar economic opportunity in AI, it's worth your time I assure you.
Right off the bat, he goes into the biggest challenge that could be encountered, that being the ENERGY that will be needed to power this revolution. If LWLG's tech can help to reduce the transmission of that ocean of data, then we will all be smiling before this is over:))
http://blog.appliedmaterials.com/ai-paradox
"The improved material doubles the speed and halves the devices' voltage requirements compared to the company's existing material and industry-wide conventional materials."
That's darn sure worth more than .68 a share!
I'm glad your here proto, you have an impressive understanding of this technology.
Industry related...
NeoPhotonics Announces General Availability of 30-40 mW CW Laser Sources for Silicon Photonics Based 400G Data Center Transceivers
8:45 am ET September 19, 2019 (PR Newswire) Print
NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of advanced hybrid photonic integrated circuit based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced general availability (GA) of its non-hermetic 30-40 mW DFB laser sources for use in Silicon Photonics 100G per wavelength CWDM4 FR4 and 1310 nm DR1 and DR4 transceivers. These lasers are available with and without integral Spot Size Converters (SSC).
https://mma.prnewswire.com/media/825869/NeoPhotonics_Corp_Logo.jpg
NeoPhotonics low-loss SSC technology enables direct attachment of the Indium Phosphide laser to a Silicon Photonics waveguide, increasing manufacturing scalability and reducing costs. These efficient, high power DFB lasers can operate at up to 75 degrees C and are compliant with Telcordia GR-468-CORE, making them well suited for use in non-hermetic Silicon Photonics based small form factor pluggable modules, such as 400G QSFP-DD.
Silicon Photonics (SiPho) has emerged as a promising technology for optical data transmission over intermediate reaches of approximately 500 meters (DR) to 2 kilometers (FR) inside data centers. A Silicon Photonics photonic integrated circuit can combine four different high speed modulators on a single chip, but it requires a light source to be modulated. A separate laser, or laser array, generating sufficient optical power at the specified wavelength(s) to overcome losses in the Silicon modulator and waveguides, must be coupled to the SiPho chip. NeoPhotonics family of high power DFB lasers are designed to efficiently couple to the SiPho modulator chip and do not require hermetic packaging making them an ideal choice for next generation transceiver modules.
A high-speed SiPho modulator chip, due to its high "Vpi", generally requires a driver amplifier with a large voltage swing, which is also supplied by NeoPhotonics. NeoPhotonics Gallium Arsenide based Quad Driver chip combines four separate drivers in a single compact, low power chip designed to support compact pluggable modules such as OSFP and QSFP-DD.
"We are pleased to announce GA of our family of high power DFB lasers for next generation SiPho based 100G to 400G transceivers," said Tim Jenks, Chairman and CEO of NeoPhotonics. "Silicon Photonics is rapidly transforming the data center transceiver marketplace by bringing the scale and cost structure of semiconductor electronics to optics, and our laser sources and drivers are helping to unleash the potential of Silicon Photonics," concluded Mr. Jenks.
About NeoPhotonics
NeoPhotonics is a leading designer and manufacturer of optoelectronic solutions for the highest speed communications networks in telecom and data center applications. The Company's products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2015 certified engineering and manufacturing facilities in Silicon Valley (USA), Japan and China. For additional information visit www.neophotonics.com.
Thx for posting that Pro, I've been meaning to go back to check, you saved me some time!
Good things take time, I keep telling myself:)
Good stuff, you are "on the ball" proto!!
ARM predicts that 1T devices will be connected by 2030, we are talking serious amounts of data and data centers to power that kind of number.
At the 21:53 min mark, GD brings up a slide of their newest platform machine, the Enura-Clover MRAM PVD platform, the engineering complexity of these machines blow my mind, yet they make it look easy. I swear they have direct communication lines open with extra terrestrials piping down their technology to Earth:)
Kidding aside, these guys are impressive and their engineers make everything possible that will be coming down the road!
Here is an EXCELLENT 30 min presentation by CEO of Applied Materials on the $10T economic opportunity that AI will bring in the next decade, as well as the mind boggling energy demand that will come along with it.
The AI Paradox
by Applied Blog
Aug 21, 2019
http://blog.appliedmaterials.com/ai-paradox
Nice find jssdmm, thanks for sharing!
A good read, I've been saying for years , Applied Materials is the powerhouse company we need to bring LWLG to legitimacy and to the worlds stage...
http://www.appliedmaterials.com/nanochip/nanochip-fab-solutions/july-2019/the-future-of-power-needs-to-be-exotic
From March 19' but worth reposting....
"We are anxious to get this material into a test device within the next 6 months while we continue developing existing polymer device prototypes for evaluation by potential customers. Our team’s recent success demonstrates that we are the premier company on the verge of engineering commercially viable, advanced electrooptic materials and devices beyond what has been achieved before.”
https://www.equities.com/news/this-company-might-be-able-to-help-with-the-rollout-of-5g?utm_medium=Twitter&utm_source=AD&utm_campaign=Article
rest of article....https://www.patreon.com/posts/iot-goes-via-li-28967549
"While radio spectrum is densely populated, communication via light can use vast amounts unlicensed optical spectrum. This, in addition to the ability to steer laser light beams precisely the location of the client devices, excellently positions optical communication to connect the IoT of the future."
AUGUST 7, 2019 BY W. MASTER IoT communication goes Photonic, via Li-Fi....
https://iotevent.eu/internet-of-things-2/iot-photonic-li-fi-linnartz/
From the Pozo article::
Michael Lebby, renowned entrepreneur, academic, and inventor with more than 450 utility patents to his name,...
___________
"During this period Michael brought VCSELs to full production and became Motorola’s all time lead inventor with over 150 issued utility patents issued in his name. Particularly noteworthy is his patent for the oxide VCSEL – the same type of VCSEL used in the iPhone today."...
__________
At the end of the 90s, Motorola decided to pull out of the photonics business and Michael joined Intel Cap-ital as a corporate investor responsible for sourcing and negotiating private equity deals in optical networking, components, and semiconductors. He also served as Intel’s board observer on a number of photonics-based start-ups and was one of the co-founders of Intel’s photonics division in 2000.....
Every time I read about ML's credentials I think about how this guy really is the perfect individual to run this company, we could not ask for a more qualified CEO. IMHO
Nice find vein, thx for posting! Sounds like it is related to the packaging?
I suddenly have the urge to take a trip to DUBLIN!
Thank you for the very thorough reply, I appreciate you sharing your work!
Proto, what is your best guess as to when the 5k hr testing would be complete? That appears to be the one critical piece of the puzzle that will (if positive) unleash a flurry of game changing headlines!!!
Your absolutely correct, I misheard his comment, Thx for clarifying. Even better!
Great read, Thx for sharing Steve...
...
"The one thing consistent across all the hyperscalers from the start has been and continues to be a laser-like focus on squeezing out every penny of unnecessary cost.
“It’s hard as a silicon provider to really understand the scale of the operations we work at,” said Booth, who worked for Intel, Applied Micro, and Dell before joining Microsoft six years ago. “Things that seem small, a half-watt per part, explode at the hyperscale where you are burning megawatts of power.”
...
"At Semicon West, a Google engineer said that the search giant has reinvented everything from accelerators to interconnects and floating-point formats in its quest for more AI performance. He invited chipmakers to join its search for what will drive its fourth-generation TPU — perhaps a whole new transistor. "
As far as an up listing to the NASDAQ, I personally believe that is several years away as M.L. stated that he wants the company to get up listed "organically" and I get the sense he does not want to rush it. That doesn't mean we can't see meaningful upside in share price in the mean time:)). "Several NDA's in the last 12 months" M.L. knows that one mention of a big player showing interest and the share price goes parabolic, he will issue that pr when the time is right and in a strange way I admire his calm and restrained demeanor, I think just listening to him lowers my blood pressure:))