Lightwave Logic Inc (LWLG)

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Chair(s):

Room: Hall 7 (RDS)

Time: 14:00 - 17:30

Presentations

Polymer modulators enable the next generation of speeds and low power in optical networks
Michael Lebby , Lightwave Logic Inc. , USA

Advanced hybrid polymers for optical building blocks in PICs

Arne Schleunitz , Micro Resist Technology GmbH , Germany
Organic-inorganic hybrid materials for co-package

Hideyuki Nawata , Nissan Chemical Industries Ltd , Japan
Polymer optical waveguide for high-density optical packaging with PICs

Takaaki Ishigure , Keio University , Japan
Hybrid integration of silicon nitride: technology and scaling

Douwe Geuzebroek , LioniX International BV , Netherlands
Automating complex hybrid assembly processes for the PolyBoard requirements

Ignazio Piacentini , ficonTEC GmbH , Germany
PDK-enabled layout-aware circuit design and system validation

André Richter , VPIphotonics GmbH , Germany
Hybrid PolyBoard-on-TriPleX platform for remote ranging and sensing applications

Christos Kouloumentas , ICCS/NTUA , Greece
Quantum Labs on the Chip
Hannes Hübel , AIT Austrian Institute of Technology GmbH , Austria
Hybrid silicon photonics and plasmonics: From optical communications to THz signal processing

Christian Koos , Vanguard Photonics GmbH , Germany
Integrated Microwave Photonics: Advantages of a hybrid integration approach based on polymer

Guillermo Carpintero , Universidad Carlos III de Madrid , Spain
Scaling short-reach interconnects with hybrid PICs

Paraskevas Bakopoulos , Mellanox Technologies Ltd , Israel