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Sunday, September 22, 2019 8:41:35 AM
Chair(s):
Room: Hall 7 (RDS)
Time: 14:00 - 17:30
Presentations
Polymer modulators enable the next generation of speeds and low power in optical networks
Michael Lebby , Lightwave Logic Inc. , USA
Advanced hybrid polymers for optical building blocks in PICs
Arne Schleunitz , Micro Resist Technology GmbH , Germany
Organic-inorganic hybrid materials for co-package
Hideyuki Nawata , Nissan Chemical Industries Ltd , Japan
Polymer optical waveguide for high-density optical packaging with PICs
Takaaki Ishigure , Keio University , Japan
Hybrid integration of silicon nitride: technology and scaling
Douwe Geuzebroek , LioniX International BV , Netherlands
Automating complex hybrid assembly processes for the PolyBoard requirements
Ignazio Piacentini , ficonTEC GmbH , Germany
PDK-enabled layout-aware circuit design and system validation
André Richter , VPIphotonics GmbH , Germany
Hybrid PolyBoard-on-TriPleX platform for remote ranging and sensing applications
Christos Kouloumentas , ICCS/NTUA , Greece
Quantum Labs on the Chip
Hannes Hübel , AIT Austrian Institute of Technology GmbH , Austria
Hybrid silicon photonics and plasmonics: From optical communications to THz signal processing
Christian Koos , Vanguard Photonics GmbH , Germany
Integrated Microwave Photonics: Advantages of a hybrid integration approach based on polymer
Guillermo Carpintero , Universidad Carlos III de Madrid , Spain
Scaling short-reach interconnects with hybrid PICs
Paraskevas Bakopoulos , Mellanox Technologies Ltd , Israel
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