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"If demand continues to rise GlobalFoundries could build a new plant adjacent to its Malta, New York, plant after securing a purchase option agreement for about 66 acres of undeveloped land last year."
https://www.thestar.com.my/business/business-news/2021/03/03/globalfoundries-pours-us14b-into-fab-expansion
Just trying to put the pieces of the puzzle together jeunke22, like everyone else.
Two Cents said "LWLG is working with a private company that will be huge in photonics" ...just tryin to put the pieces together.
Maybe we will learn something next month?
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AngelTech Virtual Online III Main Event: 12 April 2021. 10am BST (British Summer Time)
Photonics integration will become the future engine many of our products in the next decade
The drive to miniaturization, battery power, high speed, sensing, imaging, and advanced computational processing means that photonic integration will grow, and grow quickly. Cramming discrete, individual components in a small box is going away, in fact, just like lots of transistors in an IC. Integration is key, and with photonics, there are a number of engineering challenges that need to be addressed that range from efficiently working with light, to driving high speed data with very low power consumption.
This years Angeltech LIVE III is the place to be to make sure you are calibrated and knowledgable in the latest work, advancements, and designs in the field of PICs - photonic integrated circuits.
The Sessions
While PIC based photonic integration technologies have grown on the back of optical communications, fiber optics, telecommunications, data communications even data centers and high performance computing, this is only the beginning.
There are now many applications for PICs that go beyond just sending data quickly, with low power, and high integrity: These LIVE III sessions will gather in depth analysis of new growing arenas such as AI, automotive/LIDAR, sensing, bio-medical, industrial, consumer and many others. The expectation is that these new arenas will grow very quickly as they also require miniaturization, low power, high speeds, and of course batter power for portability.
https://onlinesummit.angel-tech.net
Lightwave Logic, Rockley Photonics, IBM, Google, Intel and Ayar Labs among others attending…
3 min video...Ayar Co Founder Mark Wade and Anthony Yu, VP of Silicon Photonics GlobalFoundries
https://ayarlabs.com/in-package-optical-i-o-on-the-cusp-of-high-volume-manufacturing/
We really need to get ML and AWG to sit down for a spot of tea...:)
https://ayarlabs.com/products/#teraphy
From the same paper...
Microsoft is already talking about the need for optical I/O. For example, at the DARPA ERI Summit 2020, Microsoft Azure Architect Doug Carmean made a case for co-packaged optics and resource disaggregation. He noted that a convergence of factors was driving the needs. On one side, he highlighted “divergent technology scaling trends, and reach and density limitations of copper.” On the other side he highlighted “increasing system density, increasing accelerator specialization, very large-scale system deployment, scale-driven cost pressure and higher power nodes.” Hyperscalers, including Facebook are noticing the same challenges. But whereas Facebook has focused on the Open Accelerator Infrastructure that uses board-level electrical interconnect solutions relying on retimers and pluggable optical interconnects, Microsoft is looking at co-packaged optical solutions that avoid the power, footprint and range restrictions of electrical retimers.
Systems vendors like NVIDIA are also on board. NVIDIA is publicly discussing the importance of accelerating AI systems with optics, noting that the cost-efficient bandwidth and low latency are critical to the success of scale-out systems as compute capabilities improve. In a recent paper, a team from NVIDIA noted that critical communication collectives in ML (such as All-Reduce) already take up 30% of the run-time, even on highly-optimized 16-GPU DGX-2 systems, and that as the GPUs grow more powerful in compute they become more sensitive to off-package bandwidth. NVIDIA believes optical interconnects are the key to overcoming challenges with weak scalability in certain types of workloads.17
Thx for posting Steve, she is one sharp cookie...
Unlocking the True Potential of AI with In-Package Optical I/O
Optimizing optical I/O bandwidth
Building on more than 10 years of research and development, Ayar Labs is a pioneer and the industry leader in optical I/O. Ayar Labs’ TeraPHYTM in- package optical I/O technology is the first solution to enable direct optical communications between key components in AI and ML machines, including GPUs, CPUs, APUs, HBM and pooled memory. The electro-optical approach eliminates bandwidth issues by driving a 100 – 1,000x improvement in interconnect bandwidth density as well as better latency and lower power requirements. With respect to latency, TeraPHY supports end-to-end off- package connections of ~10 ns plus time of flight versus ~100 ns plus time of flight for ethernet. From a power perspective, the technology requires roughly a 10th of the power needed to move a bit of data electrically. It also underpins more flexible systems by enabling innovative disaggregated and distributed architectures.
https://ayarlabs.com/unlocking-the-true-potential-of-ai-with-in-package-optical-i-o/
Got it, thanks! Kinda thought seeing photonics being used in this application would get folks here excited about the potential of the industry and specifically the future prospects off LWLG. Cheers
Ok, I thought I was clear as to why is was correlated... "silicon Photonic chip platform"...oh well, I won't question and won't post again on the company. Thx Richard
Can someone explain to me why, how, who is responsible for deleting my posts from this morning regarding Aeva, Inc.? This is content that is correlated to LWLG as they have developed this tech. on silicon photonic chips. I've had similar posts removed in recent weeks re: this topic and specific company. Very strange? Thx
The reason I mention Avea...
Aeva Inc. ("Aeva") is the leading provider of comprehensive perception solutions developed on Silicon Photonics for mass scale applications in automotive, consumer electronics, consumer health, industrial and security markets.
https://www.aeva.ai
For those following the LiDAR story...
MOUNTAIN VIEW, Calif. --(BUSINESS WIRE)-- Aeva, Inc. (“Aeva”), a leader in next generation 4D LiDAR sensing and perception systems, and InterPrivate Acquisition Corp. , a publicly traded special purpose acquisition company (“ InterPrivate”) (NYSE: IPV), are releasing a webcast tomorrow, February 18, 2021 , at 11:00 a.m. EST for investors to learn more about Aeva’s unique FMCW 4D LiDAR on a chip technology and collaborations to bring 4D LiDAR to mass scale.
The webcast will be available on Aeva’s investor website, www.aeva.ai/investors/, and will remain on the page for future viewings.
Aeva remains on track to complete its previously announced business combination with InterPrivate in the first quarter of 2021. The business combination is expected to provide up to $563M in gross proceeds. The combined company is expected to be listed on the New York Stock Exchange under the ticker symbol “AEVA”.
InterPrivate will hold a Special Meeting of Stockholders on March 11, 2021 to approve the proposed business combination. Stockholders who own shares of InterPrivate as of January 25, 2021 , should submit their vote by 5:00 p.m. EST on March 10, 2021 . For more information on how to vote, please visit www.ipvspac.com/vote. InterPrivate stockholders who need assistance in completing the proxy card, need additional copies of the proxy materials, or have questions regarding the Special Meeting may contact InterPrivate’s proxy solicitor, Morrow Sodali LLC , by telephone at (800) 449-0910 or by email at IPV.info@investor.morrowsodali.com.
About Aeva
Founded in 2017 by former Apple engineers Soroush Salehian and Mina Rezk , and led by a multidisciplinary team of engineers and operators, Aeva is building the next-generation of sensing and perception for autonomous vehicles and beyond. Aeva is backed by Adage Capital , Porsche SE, Lux Capital and Canaan Partners , amongst others. For more information, visit www.aeva.com.
About InterPrivate Acquisition Corp.
InterPrivate is a blank check company organized for the purpose of effecting a merger, share exchange, asset acquisition, stock purchase, recapitalization, reorganization, or other similar business combination with one or more businesses or entities. InterPrivate is controlled by affiliates of Ahmed M. Fattouh , Chairman and Chief Executive Officer, and InterPrivate LLC , a private investment firm founded by Mr. Fattouh that invests on behalf of a consortium of family offices in partnership with independent sponsors from the private equity and venture capital industries. InterPrivate focused its efforts on evaluating business combination targets by leveraging InterPrivate’s network of independent sponsors, family offices and private equity and venture capital firms. InterPrivate is an emerging growth company as defined in the Jumpstart Our Business Startups Act of 2012. For more information, visit www.ipvspac.com.
It's not the length of time, it's quality of the content that can be conveyed in that 10 min's....:)
Feb. 18, 2021 Presentations
LIGHTWAVE LOGIC PHOTONICS. 13:20 - 13:30 (7:20 am EST...? Is that correct?)
Michael Lebby, CEO
Talk topic: Polymer Plus™: Upgrading your PIC with Ultrafast and Low Power Modulators
https://photonicsplus.com/speakers/
Good info, I have no evidence to suggest LWLG is connected to the AppleCar, just pointing out there may be a connection to AVEA's tech which involves Silicon Photonics and that I'm pleased to see the broader adoption of photonics. Can only help bring eyeballs to LWLG.
I dream of the day LWLG announces they are working with the behemoth that is Applied Materials to "spin on" the Goo...the Masters of Deposition
"CVD is a process in which a substrate is exposed to one or more volatile precursors that react or decompose on the substrate surface to produce the desired thin film deposit. CVD processes are used for a broad spectrum of applications. These range from patterning films to insulation materials in transistor structures and between the layers of conducting metal that form the electrical circuit."
https://www.appliedmaterials.com/semiconductor/products/cvd
Dan Ives of Webush commented this morning that "with Jassy taking over (Amazon) it's clear that AMZN is doubling down on AWS (Amazon Web Services)".
My takeaway: a big increase in additional (more efficient) Data Centers, add in Google Cloud loosing billions, it becomes clear that they will be searching for ways to dramatically reduce costs.
Google Cloud lost $5.61 billion on $13.06 billion revenue last year
PUBLISHED TUE, FEB 2 20214:05 PM ESTUPDATED TUE, FEB 2 20215:21 PM EST
https://www.cnbc.com/2021/02/02/google-cloud-lost-5point61-billion-on-13point06-billion-revenue-last-year.html
Probably a safe bet that they are looking for ways to reduce costs...
I had no problems buying more on TDA
No, thank you for all that you do!
Heard about 4D LiDAR yet?
Combine the words Apple, Lockheed Martin, Porsche SE, Audi, photonics and you’ve got my undivided attention!
Think Apple Car (Apple will be watching Aeva very closely with the founders being former Apple engineers)
Apple targets car production by 2024 and eyes 'next level' battery technology. Apple is moving forward with self-driving car technology and is targeting 2024 to produce a passenger vehicle that could include its own breakthrough battery technology, people familiar with the matter told Reuters.
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November 2, 2020 09:35 AM ET (BZ Newswire) -- M&A
Aeva, Maker of the First 4D LiDAR on Chip, to Be Listed on NYSE through Business Combination with InterPrivate Acquisition Corp.
MOUNTAIN VIEW, Calif., Nov. 2, 2020 /PRNewswire/ --
Highlights
Aeva Inc. ("Aeva") is the leading provider of comprehensive perception solutions developed on Silicon Photonics for mass scale applications in automotive, consumer electronics, consumer health, industrial and security markets.
Aeva's groundbreaking 4D LiDAR on Chip combines instant velocity measurements and long-range performance at affordable costs for commercialization at silicon scale.
Aeva has received strategic investments from Porsche SE, the major shareholder of VW Group.
Aeva's commercial partners also include other top automotive OEMs and world's leading mobility and technology players.
In September, Aeva announced a production partnership with ZF to manufacture and distribute the first automotive grade 4D LiDAR to global OEM customers.
Business combination to provide up to $363M in gross proceeds, comprised of InterPrivate's $243M held in trust[1] and a $120M fully committed common stock PIPE at $10.00 per share, including investments from Adage Capital and Porsche SE.
Combined company expected to have an estimated post-transaction equity value of approximately $2.1B and is expected to be listed on the NYSE under the ticker symbol AEVA following anticipated transaction close in Q1 2021.
All Aeva stockholders, including Lux Capital, Canaan Partners, and Lockheed Martin, will retain their equity holdings through Aeva's transition into the publicly listed company.
Aeva plans to use 100% of the net proceeds from the transaction to accelerate its growth and commercialization.
InterPrivate Acquisition Corp ("InterPrivate") (NYSE:IPV), a special purpose acquisition company, announced today that it has entered into a definitive agreement for a business combination with Aeva, Inc. ("Aeva"), the first company to provide a perception platform built from the ground up on Silicon Photonics for mass scale application in automotive, consumer electronics and other sectors. Upon closing of the transaction, the combined company will be renamed "Aeva, Inc." and is expected to continue to be listed on the New York Stock Exchange and trade under the ticker symbol "AEVA."
Founded in 2017 by former Apple engineers Soroush Salehian and Mina Rezk and led by a multidisciplinary team of over 100 experienced leaders, engineers, and operators, Aeva is actively engaged with thirty of the top players in automated and autonomous driving across passenger, trucking and mobility.
In 2019, Aeva announced a partnership with Audi's Autonomous Intelligent Driving entity. Aeva has also partnered with multiple other passenger car, trucking and mobility platforms to further adoption of ADAS and autonomous applications.
Aeva is in a production partnership with ZF, one of the world's largest automotive Tier 1 manufacturers to top OEMs, to supply the first automotive grade 4D LiDAR from select ZF production plants. The partnership — Aeva's expertise in FMCW LiDAR technology combined with ZF's experience in industrialization of automotive grade sensors — represents a key commitment to accelerate mass production of safe and scalable 4D LiDAR technology.
With its powerful software stack, Aeva plans to bring its perception platform to a range of industries beyond automotive, including consumer electronics, consumer health, industrial robotics, and security.
Unlike legacy LiDAR, which relies on Time of Flight (ToF) technology and measures only depth and reflectivity, Aeva's groundbreaking solution uses a unique Frequency Modulated Continuous Wave (FMCW) technology to measure velocity in addition to depth, reflectivity and inertial motion. Aeva's innovative FMCW technology draws on significantly less power than other available technologies, including ToF, to bring perception to broad applications at an industry-leading cost.
"From the beginning our vision has been to create a fundamentally new sensing system to enable perception across all devices. This milestone accelerates our journey toward delivering the next paradigm in perception to mass market applications, not just in automotive but consumer and beyond," said Soroush Salehian, Co-founder and CEO at Aeva.
Mina Rezk, Co-founder and CTO at Aeva, said, "From the beginning, we believed that the only way to achieve the holy grail of LiDAR is to be integrated on a chip.Over the last four years, we did it by leveraging Aeva's unique coherent FMCW approach. With today's announcement, we can use our development efforts to expand into new markets that were simply not possible before."
Ahmed Fattouh, Chairman and Chief Executive Officer of InterPrivate said, "We look forward to our combination with Aeva, which was the clear stand-out amongst the 100+ merger targets we evaluated. The Company's breakthrough technology combines the key advantages of LiDAR, Radar, Motion Sensing, and Vision in a single compact chip. As a result of this transaction, including the upsized PIPE private placement, Aeva is not expected to require any additional funding to achieve significant cash flow through its commercial partnerships with world class customers. Soroush, Mina and their team are revolutionizing sensing solutions not only for the automotive industry, but ultimately across all devices."
Transaction overview
The combined company will have an implied pro forma equity value of approximately $2.1 billion at closing, and Aeva's existing stockholders will hold approximately 80% of the issued and outstanding shares of common stock of the combined company immediately following the closing.
Cash proceeds in connection with the transaction will be funded through a combination of (i) the issuance of approximately $120 million of common stock through a fully committed private placement at $10.00 per share, including investments from Adage Capital and Porsche SE, (ii) the issuance of $ 1.7 billion of new common stock of InterPrivate to current stockholders of Aeva subject to customary adjustments and (iii) $243 million of cash held in trust assuming no redemptions by InterPrivate's existing public stockholders.
The boards of directors of both InterPrivate and Aeva have unanimously approved the proposed business combination. Completion of the proposed business combination is subject to, among other things, the approval by InterPrivate and Aeva stockholders and the satisfaction or waiver of other customary closing conditions, including a registration statement being declared effective by the Securities and Exchange Commission (the "SEC"), and is expected to occur in the first quarter of 2021.
Following completion of the transaction, Aeva will retain its experienced management team. Soroush Salehian will continue to serve as Chief Executive Officer, Mina Rezk will continue to serve as Chief Technology Officer and Saurabh Sinha will continue to serve as Chief Financial Officer.
Advisors
Morgan Stanley & Co. LLC is serving as financial advisor and lead private placement agent on the PIPE offering, and Greenberg Traurig is serving as legal advisor to InterPrivate. Credit Suisse Securities (USA) LLC is acting as capital markets advisor, and Latham & Watkins LLP is serving as legal advisor to Aeva. Credit Suisse Securities (USA) LLC also served as placement agent on the PIPE offering for InterPrivate. Additionally, Davis Polk & Wardwell LLP is serving as legal counsel to Morgan Stanley & Co. LLC and Credit Suisse Securities (USA) LLC.
Investor Conference Call To listen to the investor conference call, click here.
About Aeva
Aeva was founded in 2017 by Soroush Salehian and Mina Rezk, both of whom are former engineering leaders at Apple & Nikon.Headquartered in Mountain View, California, Aeva is building the next-generation of sensing and perception for autonomous vehicles and beyond. Aeva is backed by Adage Capital, Porsche SE, Lux Capital and Canaan Partners, amongst others. For more information, visit www.aeva.com.
About InterPrivate Acquisition Corp.
InterPrivate is a blank check company organized for the purpose of effecting a merger, share exchange, asset acquisition, stock purchase, recapitalization, reorganization, or other similar business combination with one or more businesses or entities. InterPrivate is controlled by affiliates of Ahmed M. Fattouh, Chairman and Chief Executive Officer, and InterPrivate LLC, a private investment firm founded by Mr. Fattouh that invests on behalf of a consortium of family offices in partnership with independent sponsors from the private equity and venture capital industries. InterPrivate focused its efforts on evaluating business combination targets by leveraging InterPrivate's network of independent sponsors, family offices and private equity and venture capital firms. InterPrivate is an emerging growth company as defined in the Jumpstart Our Business Startups Act of 2012.
***********************************************************
Mina Rezk, Co-founder and CTO at Aeva, said, "From the beginning, we believed that the only way to achieve the holy grail of LiDAR is to be integrated on a chip.
https://finance.yahoo.com/news/aeva-maker-first-4d-lidar-143300370.html
************************************************************
Overview Note: Avea HQ and Apple HQ only 8 minutes apart…
Aeva develops a sensing and perception paradigm for autonomous machines.
Mountain View, California, United States, North America
Categories: Automotive, Autonomous Vehicles, Computer Vision, Navigation, Sensor
Founded Date: 2017
Founders: Mina Rezk, Soroush Salehian
Funding Status: Private Equity
Number of Employees: 51-100
Last Funding Round
Announced Date: Jan 4, 2021
Funding Type: Private Equity
Money Raised: $200,000,000
Total Investors: 1
Lead Investors: Sylebra Capital
Just posted by ARK Invest....
3. Silicon Innovation Is Moving from The Chip to the Package
Now that semiconductor manufacturers are having difficulty cramming more transistors into computer chips, innovation seems to be evolving from bigger chips to advanced packaging technologies that glue chips together.
Typically, computer chips sit on a plastic module called a package that connects to a printed circuit board. While traditionally packages provided an interface to mount chips onto boards, today advanced packaging connects multiple chips together.
This week Chief Architect Raja Koduri tweeted a picture of Intel’s upcoming data center Xe GPU. Instead of a large monolithic chip, the Xe GPU binds two GPUs and ten supporting chips together on a single package. Tightly integrated at the package level, chips can communicate with each other with lower latency, higher bandwidth, and lower power consumption. Thanks to package level integration, chips snap together both horizontally and vertically. While not as effective as chip level integration, package level integration is much better than circuit board connections.
We expect that Intel and TSMC will adopt advanced packaging technologies in the coming years. As a result, computer architectures will look less like standalone houses in suburbs and more like the densely populated streets of Manhattan.
https://ark-invest.com/newsletters/issue-256/?utm_content=153155421&utm_medium=social&utm_source=twitter&hss_channel=tw-2398137084
I read it as
our IP is so valuable, we can now (at the time of our choosing) come to a financial arrangement, shall we say, for the rights to market/license etc. the technology to willing players. I don't know maybe I'm reading too much into it?
From yesterday's release...
"As we continue to generate strong interest from industry players, our IP portfolio will enable us to consider complementary revenue opportunities as we progress with potential partners in 2021 to address the telecommunications and datacenter segments of the market."
Hmm...thoughts?
A good read
1/26/21 ARK Invest Big Ideas 2021
Section2 Page 13
The Re-Invention Of The Data Center
Data Centers—The Power Plants Of Computation— Are Going Through A Revolution
• Cheaper, faster, and more power efficient processors are starting to displace Intel—which traditionally had captured over 90% of all processor revenue.
• For cloud computing, we believe ARM, RISC-V, and graphics processing units (GPUs) are likely to emerge as the new powerhouse processors. Together they could scale at a 45% annual rate to $19 billion in revenue by 2030.
• In the data center, we believe accelerators, dominated by GPUs, will become the dominant processors for new workloads, growing 21% at an annual rate to $41 billion by 2030.
New Architectures Re-Invent
The Data Center Every Few Decades...
https://ark-invest.com/big-ideas-2021/
Agree TCW, the fastest market I've ever seen, hesitate and your left in the dust.
My thinking is more in line with raising cash for another transformative acquisition, a la Mobileye....they need to do something bold to get back in favor with the big $$$...just speculating.
A little surprised to see this from INTC
04:31 AM EST, 01/25/2021 (MT Newswires) -- Intel (INTC) on Friday filed a registration statement covering the potential sale of an indeterminate amount of securities.
The securities, which may be offered from time to time, include debt securities, common shares, preferred shares, warrants, depositary shares, purchase contracts, guarantees, and units, according to a filing with the US Securities and Exchange Commission.
Price: 56.95, Change: +0.29, Percent Change: +0.51
Can patents and IP be applied to the assets column...)?
If my math is correct, we would need $1.64 pps to meet $160m mc min.
correction...mc stands at $141.64m
Standard No. 4: Assets With Equity
Companies can eliminate the cash flow and revenue requirements, and decrease its marketing capitalization requirements to $160 million if their total assets total at least $80 million and their stockholders' equity is at least $55 million.
we're very close to MC min.... $146m
maybe others can speak to total assets and stockholders equity?
Standard No. 1: Earnings
The company must have aggregate pre-tax earnings in the prior three years of at least $11 million, in the previous two years at least $2.2 million, and no single year in the prior three years can have a net loss.
Standard No. 2: Capitalization With Cash Flow
The company must have a minimum aggregate cash flow of at least $27.5 million for the past three fiscal years, with no negative cash flow in any of those three years. Also, its average market capitalization over the prior 12 months must be at least $550 million, and revenues in the previous fiscal year must be $110 million, minimum.
Standard No. 3: Capitalization With Revenue
Companies can be removed from the cash flow requirement of the second standard if its average market capitalization over the past 12 months is at least $850 million and revenues over the prior fiscal year are at least $90 million.
Standard No. 4: Assets With Equity
Companies can eliminate the cash flow and revenue requirements, and decrease its marketing capitalization requirements to $160 million if their total assets total at least $80 million and their stockholders' equity is at least $55 million.
KEY TAKEAWAYS
Major stock exchanges, like the NASDAQ, are exclusive clubs—their reputations rest on the companies they trade.
The NASDAQ has four sets of listing requirements.
Each company must meet at least one of the four requirement sets, as well as the main rules for all companies.
In addition to these requirements, companies must meet all of the criteria under at least one of the following standards.
A company has four ways to get listed on the NASDAQ, depending on the underlying fundamentals of the company.
************
The regular bid price of shares of the company's stock at the time of listing must be at least $4.00. However, a company may qualify under a closing price alternative of $3.00 or $2.00 if the company meets varying requirements.
There must be at least three (or four depending on the criteria) market makers for the stock. For companies using the $3 or $2 criteria, only two market makers may be required. Each listing firm is also required to follow NASDAQ corporate governance rules 4350, 4351, and 4360.
https://www.investopedia.com/ask/answers/nasdaq-listing-requirements/
Haven't got a clue, but if LWLG can sell enough of them I think they'll turn a profit...:)
"why 100G? Well everybody today is looking at 50G and we have an optical device that goes faster, it's a natural ability through velocity phase matching characteristics can go a lot faster, in fact it probably can go a lot faster than 100 but let's just say a 100 for the time being and that's the next major node for the networks.......if you have a faster device you don't need as many lanes, you don't need 4 channels......the next generation is 100G......scaleable in increased performance and decreased cost and it's that scalability that customers are looking for".
6 mos ago...https://vimeo.com/435835584
Hard to believe we are approaching 10 yrs of LPC ...
https://www.lightwaveonline.com/business/article/16661451/lightwave-logic-inc-secures-20-million-in-funding-from-lincoln-park-capital-fund-llc
BE READY FOR A BRAND NEW EXPERIENCE
PHOTONICS+ Virtual Exhibition and Conference, in partnership with EPIC, is a new, efficient networking event for the photonics industry due to take place for the first time on 17 + 18 February 2021. The innovative live, digital event brings stakeholders in the photonics industry together with relevant user areas. The organiser is FLEET Events – which also arranges the W3+ Fair high-tech trade fair. The company has developed the innovative digital event together with EPIC – European Photonics Industry Consortium, the largest association in the photonics sector.
https://photonicsplus.com
What a great company for LWLG to have a meeting with...
Locations:
Pasadena, CA
234 E Colorado Blvd.
Suite 600
Pasadena, CA 91101
Phone: +1 626 304 9960
San Jose, CA
333 W San Carlos Street
Suite 850
San Jose, CA 95110
Phone: +1 408 579 9210
Oxford, England
Clarendon Business Centre
57 Woodstock Road
Oxford, OX2 6HJ
Phone: +44 (0) 1865 292017
Helsinki, Finland
Tietotie 3
02150 Espoo
Finland
Phone: +358 40 410 2515
Newport, Wales
Cork, Ireland
https://rockleyphotonics.com/contact/
An Applied Ventures company... https://rockleyphotonics.com/platform/
https://www.appliedmaterials.com/company/applied-ventures/portfolio?theme=2566
I love that AMAT is investing in photonics!
Very encouraging that Lumentum sees the future potential of Coherent's photonics business!