Lightwave Logic Inc (LWLG)

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Just posted by ARK Invest....

3. Silicon Innovation Is Moving from The Chip to the Package

Now that semiconductor manufacturers are having difficulty cramming more transistors into computer chips, innovation seems to be evolving from bigger chips to advanced packaging technologies that glue chips together.

Typically, computer chips sit on a plastic module called a package that connects to a printed circuit board. While traditionally packages provided an interface to mount chips onto boards, today advanced packaging connects multiple chips together.

This week Chief Architect Raja Koduri tweeted a picture of Intel’s upcoming data center Xe GPU. Instead of a large monolithic chip, the Xe GPU binds two GPUs and ten supporting chips together on a single package. Tightly integrated at the package level, chips can communicate with each other with lower latency, higher bandwidth, and lower power consumption. Thanks to package level integration, chips snap together both horizontally and vertically. While not as effective as chip level integration, package level integration is much better than circuit board connections.

We expect that Intel and TSMC will adopt advanced packaging technologies in the coming years. As a result, computer architectures will look less like standalone houses in suburbs and more like the densely populated streets of Manhattan.

https://ark-invest.com/newsletters/issue-256/?utm_content=153155421&utm_medium=social&utm_source=twitter&hss_channel=tw-2398137084