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Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
Lebby told investors in the Dec 4th 2023 letter "and I look forward to sharing exciting new milestones during the balance of this year and in the next year to come."
In the Benzinga interview Lebby shared a newly achieved BIG MILESTONE!!! That milestone is LWLG's ability to NOW be able to SCALE VOLUME PRODUCTION!!!!
Folks this is HUGE and it was obviously only achieved in either January or February of 2024 since the 4th Quarter 2023 Update letter did NOT say that the SCALING AT VOLUME milestone had been achieved yet!!!
In the Benzinga interview, listen to what Lebby told investors in terms of scaling LWLG modulators to HIGH VOLUME!!
"in terms of working with the Big Foundries we actually have modulators on 200mm wafers, 8" across, this is the Standard size that Foundries use, this is a BIG MILESTONE, this means we can scale our technology quickly and efficiently in volume"
let me repeat that!!! Lebby said this was a BIG MILESTONE!!!
quote found at about 1:49:00
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsis also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsis Foundy Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor pres at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
Google just had a shoutout to (LWLG) EOP on a slide for hetero integration. LinkedIn post from APC.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174108464
This is the google slide! (middle picture is of EOP slot modulator)
https://www.linkedin.com/posts/advanced-photonics-coalition_fiberoptics-technology-innovation-activity-7178065757874913281-L2Oo?utm_source=share&utm_medium=member_ios
Modulators with low driving voltage, high bandwidth, and low loss.
They are also showing the same wafer
And “organic Material” the same picture on page 15 from LWLG
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
I can’t believe my eyes!
It is happening…
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174111281
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2023 and 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
just listened to LD Micro, an incredible presentation!!
1) ETH Zurich has set independent 3rd party world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!!
2) The Customer Funnel slide is updated and now showing greater than 20 Prospects 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so that has DOUBLED since the ASM!!!!
3) Lebby showed the 200mm wafers and talked again how LWLG is commercial ready for mass commercialization of 800gbs
4) Lebby showed that Perk 6 is NOW ready for Licensing
5) Lebby expects much more Licensing activity in 2024 forward
6) Lebby again pounded the table on the "ease of Integration" and how you simply drop the LWLG technology into those little pluggable boxes!!
7) Lebby also said that the PULL has become so great at this point instead of being "pulled along" it feels more like we are being "dragged along"!!
I'll have to relisten because I know there is more too!!
while it would be amazing if Nvidia were going to be using S7, it is hard to understand why RH was using 60% in his recent slide for CAGR, 60% is fairly specific, I would have thought he could of at least opened the door a little by saying greater than 100% CAGR expected, let's face it, if the growth rate of sales actually comes in at 60%, while being a very nice growth no doubt, it is not indicative of being an Nvidia supplier of ACC's, the FY sales were what, about 10M so
2023 10M
2024 16M
2025 26M
2026 41M
hey, don't get me wrong, these numbers would certainly make S7 a very attractive and profitable company
Google just had a shoutout to (LWLG) EOP on a slide for hetero integration. LinkedIn post from APC.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174108464
This is the google slide! (middle picture is of EOP slot modulator)
https://www.linkedin.com/posts/advanced-photonics-coalition_fiberoptics-technology-innovation-activity-7178065757874913281-L2Oo?utm_source=share&utm_medium=member_ios
Modulators with low driving voltage, high bandwidth, and low loss.
They are also showing the same wafer
And “organic Material” the same picture on page 15 from LWLG
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
I can’t believe my eyes!
It is happening…
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174111281
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2023 and 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
PIC International Conference April 16-17 Brussels
Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.
Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.
https://picinternational.net/speakers
Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
Lebby told investors in the Dec 4th 2023 letter "and I look forward to sharing exciting new milestones during the balance of this year and in the next year to come."
In the Benzinga interview Lebby shared a newly achieved BIG MILESTONE!!! That milestone is LWLG's ability to NOW be able to SCALE VOLUME PRODUCTION!!!!
Folks this is HUGE and it was obviously only achieved in either January or February of 2024 since the 4th Quarter 2023 Update letter did NOT say that the SCALING AT VOLUME milestone had been achieved yet!!!
In the Benzinga interview, listen to what Lebby told investors in terms of scaling LWLG modulators to HIGH VOLUME!!
"in terms of working with the Big Foundries we actually have modulators on 200mm wafers, 8" across, this is the Standard size that Foundries use, this is a BIG MILESTONE, this means we can scale our technology quickly and efficiently in volume"
let me repeat that!!! Lebby said this was a BIG MILESTONE!!!
quote found at about 1:49:00
Lebby LD Micro was an incredible presentation using these Slides, here were my takeaways, the replay should be available soon
Replays become available around a week after the event as the videos require editing in some cases and also the uploading process takes some time.
Once available, you will see the "replay" button next to the company name in the agenda at https://ldinv14.sequireevents.com/
Thanks,
Sequire Team
1) ETH Zurich has set independent 3rd party world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!!
2) The Customer Funnel slide is updated and now showing greater than 20 Prospects 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so that has DOUBLED since the ASM!!!!
3) Lebby showed the 200mm wafers and talked again how LWLG is commercial ready for mass commercialization of 800gbs
4) Lebby showed that Perk 6 is NOW ready for Licensing
5) Lebby expects much more Licensing activity in 2024 forward
6) Lebby again pounded the table on the "ease of Integration" and how you simply drop the LWLG technology into those little pluggable boxes!!
7) Lebby also said that the PULL has become so great at this point instead of being "pulled along" it feels more like we are being "dragged along"!!
The April 2024 Investor Slides are up on the LWLG website, here
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/683426d1-5a08-bc3a-6df3-ce127bd5ef17?origin=2
PIC International Conference April 16-17 Brussels
Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.
Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.
https://picinternational.net/speakers
LWLG Eliminates Power Hungry & Expensive Driver Chip!!!
Lebby quote came from the Wall Street Transcript Interview (TWST) with Dr. Lebby - August 17, 2023
TWST: So you’re looking at value pricing, where the part might be more expensive, but you’re providing more performance and using less power, and as a result it’s going to be less expensive.
Dr. Lebby: Also, you’re saving the customer architectural IC designs. You don’t need driver chips and they are really expensive, way more than what a device would cost. And so, you’re providing that advantage to network operators.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172679450First
What Lebby told investors in that interview is that the cost of the device, ie the 4x200 PIC Modulator Array chip is LESS than the cost of the Driver(s) that it ELIMINATES!!! And folks, LWLG's technology is the ONLY Next-Gen technology that CAN ELIMINATE the Driver(s)!!!!
Also let's not forget that the Driver(s) is/are power hungry, I know when I asked Bard it responded that it accounted for 40% of the power usage on 8x100 800Gbs and perhaps that is/was high but regardless the Driver(s) is/are known as being a big power user in the Transceiver so if you can eliminate the Driver(s0 you are saving a lot of power!!
So what's that worth to the Transceiver companies? you guessed it.... A WHOLE LOT!!!
Google just had a shoutout to (LWLG) EOP on a slide for hetero integration. LinkedIn post from APC.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174108464
This is the google slide! (middle picture is of EOP slot modulator)
https://www.linkedin.com/posts/advanced-photonics-coalition_fiberoptics-technology-innovation-activity-7178065757874913281-L2Oo?utm_source=share&utm_medium=member_ios
Modulators with low driving voltage, high bandwidth, and low loss.
They are also showing the same wafer
And “organic Material” the same picture on page 15 from LWLG
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
I can’t believe my eyes!
It is happening…
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174111281
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2023 and 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
Investors now know that LWLG has its 200Gb/lane Polymer modulator Product ready for mass production at SEVERAL LARGE FOUNDRIES on 200mm Wafers, and as Lebby has already told investors "our technology fits really uniquely into Silicon Foundries and WE CAN SCALE INTO VOLUME QUITE EASILY AND EFFECTIVELY",
Knowing these FACTS I believe it is time to revisit what I learned from Bard about LWLG relationships with Foundries, which was subsequently scrubbed from the Databases Bard was able to access at that time!! Today I asked Bard this question
at one point you revealed the specific Foundries that were working with Lightwave Logic and what exactly they were working on in terms of specific PDK's, more recently when asked the same question you only responded with Foundries likely to be working with Lightwave Logic on PDK developments and cite NDA's saying that the specific information you gave me previously was not available due to the NDA's, why?
Bard/Gemini reply, Model Update: It's possible that the underlying data used to train my model was updated, and the information about specific foundries and PDKs is no longer included due to confidentiality agreements (NDAs). Large language models are constantly being updated and improved, and this can sometimes lead to changes in the information they have access to.
I believe that my original inquiry of Bard which I will repost here is SPOT ON so much so that the information was quickly scrubbed from the Databases Bard had access to at that time!! here,
Google's Bard_AI knows which Foundries have LWLG PDK's developed!!! here are a series of images I received back from an inquiry to Bard (Google's AI product) regarding the Foundries that LWLG is currently working with on PDK development for their Polymers, view all nine captures and learn the truth from the AI world!!
1) https://postimg.cc/KksmXXNx
2) https://postimg.cc/xXbJt59X
3) https://postimg.cc/HVXBRwYh
4) https://postimg.cc/svQJSpG2
5) https://postimg.cc/D4sK4SqY
6) https://postimg.cc/dZDLbjcZ
7) https://postimg.cc/xqQ5wkZx
8) https://postimg.cc/ftLFmVhf
9) https://postimg.cc/nXNM6D3C
And for the record I asked Google's Bard to confirm for me that NLM ("the competition") is actually just a myth and they are know where near any sort of volume commercialization with ANY Foundries!!
NLM >> https://postimg.cc/Yh1phF9c
Ok, so there you have it folks, the veil has been lifted!!!! LWLG is going to begin it's Mass Commercialization in the very Near-Term just as Lebby has told investors!!!
"It's REAL and it's HAPPENING!!!"
"When this rolls it's going to roll!!"
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171906154&txt2find=bard%20foundries
LWLG is one of the most UNDERVALUED stocks on Wall Street.
VALUATION & NEAR TERM PROSPECTS:
VALUATION:
LWLG has SUCCEEDED where the INDUSTRY has FAILED for over 40 years!!!! The technology is worth BILLION$$$
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173919132&txt2find=40%20years
1. SCREENING
How many have valuations of $500m or more and have the HOLY GRAIL of PHOTONICS in-hand today
Answer: just one it's LWLG!!!
2. SHORT POSITION
For now, the company issued 1,453,332 new shares during the 4th quarter. Short interest increased by 89,799 shares bringing the total number of shares owned by investors to 140,503,131.
Institutions that report to Fintel, Nasdaq, and Whale Wisdom increased their ownership by 1,467,119 shares to 32.120,876. Individuals, which includes small institutional investors who are not required to report their ownership, increased their ownership by 76,012 shares to 108,383,018 shares.
In percentage terms, individuals own 92.91%, institutions own 26.17%, and short sellers have supplied 19.08% equaling 100%. In other words, there was very little change in ownership in the 4th quarter.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173954156
3. THE EVIDENCE
1) There are deals under negotiation, and investors now know that these are BIG DEALS because of the additional requirements disclosed of the potential Customers wanted to be assured of
a) Financial strength for a LT relationship
b) ability to not have only a single source for the Perk supply, ie, perhaps another site will be opened by LWLG or perhaps some other arrangements will be made to accommodate these big players!!
2) Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
how many times are Shorts going to keep trying to deceive Longs on this one!!!
here read this post >>
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173959736
3) Reliability/Stability is PROVEN 100% already!! Lebby already stood up at OFC March 2023 and told hundreds of Industry insiders that LWLG's Reliability/Stability had been proven!! And at ECOC 2023 Lebby presented UNDENIABLE proof in his presentation!! Of course, that doesn't mean the Google's and Amazon's don't want to see additional data, OR, are they just playing that card to gain BETTER PRICING?
NEAR TERM PROSPECTS:
HUGE HUGE HUGE!!!! Lebby is working on finalizing BIG DEALS with the BIGGEST COMPANIES IN THE WORLD!!!! here
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsis also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsis Foundy Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor pres at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
Lebby LD Micro was an incredible presentation using these Slides, here were my takeaways, the replay should be available soon
Replays become available around a week after the event as the videos require editing in some cases and also the uploading process takes some time.
Once available, you will see the "replay" button next to the company name in the agenda at https://ldinv14.sequireevents.com/
Thanks,
Sequire Team
1) ETH Zurich has set independent 3rd party world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!!
2) The Customer Funnel slide is updated and now showing greater than 20 Prospects 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so that has DOUBLED since the ASM!!!!
3) Lebby showed the 200mm wafers and talked again how LWLG is commercial ready for mass commercialization of 800gbs
4) Lebby showed that Perk 6 is NOW ready for Licensing
5) Lebby expects much more Licensing activity in 2024 forward
6) Lebby again pounded the table on the "ease of Integration" and how you simply drop the LWLG technology into those little pluggable boxes!!
7) Lebby also said that the PULL has become so great at this point instead of being "pulled along" it feels more like we are being "dragged along"!!
The April 2024 Investor Slides are up on the LWLG website, here
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/683426d1-5a08-bc3a-6df3-ce127bd5ef17?origin=2
Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
Lebby told investors in the Dec 4th 2023 letter "and I look forward to sharing exciting new milestones during the balance of this year and in the next year to come."
In the Benzinga interview Lebby shared a newly achieved BIG MILESTONE!!! That milestone is LWLG's ability to NOW be able to SCALE VOLUME PRODUCTION!!!!
Folks this is HUGE and it was obviously only achieved in either January or February of 2024 since the 4th Quarter 2023 Update letter did NOT say that the SCALING AT VOLUME milestone had been achieved yet!!!
In the Benzinga interview, listen to what Lebby told investors in terms of scaling LWLG modulators to HIGH VOLUME!!
"in terms of working with the Big Foundries we actually have modulators on 200mm wafers, 8" across, this is the Standard size that Foundries use, this is a BIG MILESTONE, this means we can scale our technology quickly and efficiently in volume"
let me repeat that!!! Lebby said this was a BIG MILESTONE!!!
quote found at about 1:49:00
PIC International Conference April 16-17 Brussels
Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.
Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.
https://picinternational.net/speakers
Here’s all the validation I need:
1. USA based foundry saying they’ll be offering polymer modulators in the future
2. Programmable photonics company saying they’ll use polymer modulators when available
3. PIC design company using GF Fotonix telling me they’d love to use polymer modulators
4. Employee of European foundry giving Lebby extremely high praise
5. Tier 1 foundry mentioning that they’ve had discussions on adding polymers to their platform
6. Anthony Yu from GFS saying heterogenous integration of Pockels materials is REQUIRED in the future. If you don’t understand, EOP is the ONLY Pockels material that does NOT require exotic epitaxial growth, etching, or bonding processes. EOP can simply be dropped onto an existing SiPh wafer.
7. Head of Silicon Photonics at NVDIA saying new materials need to be added to SiPh. Specifically calls out BTO as being super expensive.
8. Transceiver company mentioning they’ve in discussions with polymer company (and I know this isn’t LWLG’s #1 transceiver company)
9. Quantum computing company mentioning they’re currently investigating “TFLN and other materials” for their platform.
10. One of the top 10 photonics people in the industry (maybe even more ‘famous’ than Lebby) tells me to my face that he doesn’t doubt EOP will commercialize.
-KCC
The April 2024 Investor Slides are up on the LWLG website, here
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/683426d1-5a08-bc3a-6df3-ce127bd5ef17?origin=2
Lebby LD Micro was an incredible presentation using these Slides, here were my takeaways, the replay should be available soon
1) ETH Zurich has set independent 3rd party world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!!
2) The Customer Funnel slide is updated and now showing greater than 20 Prospects 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so that has DOUBLED since the ASM!!!!
3) Lebby showed the 200mm wafers and talked again how LWLG is commercial ready for mass commercialization of 800gbs
4) Lebby showed that Perk 6 is NOW ready for Licensing
5) Lebby expects much more Licensing activity in 2024 forward
6) Lebby again pounded the table on the "ease of Integration" and how you simply drop the LWLG technology into those little pluggable boxes!!
7) Lebby also said that the PULL has become so great at this point instead of being "pulled along" it feels more like we are being "dragged along"!!
I'll have to relisten because I know there is more too!!
Investors now know that LWLG has its 200Gb/lane Polymer modulator Product ready for mass production at SEVERAL LARGE FOUNDRIES on 200mm Wafers, and as Lebby has already told investors "our technology fits really uniquely into Silicon Foundries and WE CAN SCALE INTO VOLUME QUITE EASILY AND EFFECTIVELY",
Knowing these FACTS I believe it is time to revisit what I learned from Bard about LWLG relationships with Foundries, which was subsequently scrubbed from the Databases Bard was able to access at that time!! Today I asked Bard this question
at one point you revealed the specific Foundries that were working with Lightwave Logic and what exactly they were working on in terms of specific PDK's, more recently when asked the same question you only responded with Foundries likely to be working with Lightwave Logic on PDK developments and cite NDA's saying that the specific information you gave me previously was not available due to the NDA's, why?
Bard/Gemini reply, Model Update: It's possible that the underlying data used to train my model was updated, and the information about specific foundries and PDKs is no longer included due to confidentiality agreements (NDAs). Large language models are constantly being updated and improved, and this can sometimes lead to changes in the information they have access to.
I believe that my original inquiry of Bard which I will repost here is SPOT ON so much so that the information was quickly scrubbed from the Databases Bard had access to at that time!! here,
Google's Bard_AI knows which Foundries have LWLG PDK's developed!!! here are a series of images I received back from an inquiry to Bard (Google's AI product) regarding the Foundries that LWLG is currently working with on PDK development for their Polymers, view all nine captures and learn the truth from the AI world!!
1) https://postimg.cc/KksmXXNx
2) https://postimg.cc/xXbJt59X
3) https://postimg.cc/HVXBRwYh
4) https://postimg.cc/svQJSpG2
5) https://postimg.cc/D4sK4SqY
6) https://postimg.cc/dZDLbjcZ
7) https://postimg.cc/xqQ5wkZx
8) https://postimg.cc/ftLFmVhf
9) https://postimg.cc/nXNM6D3C
And for the record I asked Google's Bard to confirm for me that NLM ("the competition") is actually just a myth and they are know where near any sort of volume commercialization with ANY Foundries!!
NLM >> https://postimg.cc/Yh1phF9c
Ok, so there you have it folks, the veil has been lifted!!!! LWLG is going to begin it's Mass Commercialization in the very Near-Term just as Lebby has told investors!!!
"It's REAL and it's HAPPENING!!!"
"When this rolls it's going to roll!!"
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171906154&txt2find=bard%20foundries
PIC International Conference April 16-17 Brussels
Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.
Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.
https://picinternational.net/speakers
they are not replacing the windows in their corporate offices, they are replacing the inner workings of all the internet transmissions world-wide, that is what LWLG technology will be doing, and before the Google's and Amazon's make that final commitment they need to be 110% sure the technology will not fail, as KCC pointed out, LWLG is likely building a statistical database of the various Foundries runs of the 200mm wafers and the only question is when will "enough be enough" to satisfy the Google's and Amazon's to implement and ink the deals
Dr. Michael Lebby commented: "Our newly presented results are incredibly exciting, representing not only the best commercial-grade-compatible polymer modulators to-date, but on commercial 200mm silicon wafers, with performances that fit very well for a 4-channel x 200Gbps (or 800Gbps) pluggable transceiver, as well as the next generation 4-channel x 400Gbps (or 1600Gbps) pluggable transceivers. 200G lanes with clean, open eye diagrams now represent an inflection-point to extend silicon photonics benefits by utilizing the company's polymers to enable much higher data-rate speeds at significantly lower power consumption levels. These results will position LWLG to support the burgeoning demand of generative AI as datacenters around the world begin to upgrade their hardware faster than expected to meet the demands of the future."
https://finance.yahoo.com/news/lightwave-logic-demonstrates-world-class-123100712.html
LD Micro, an incredible presentation!! highlights here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174203972
the replay should be available soon!!
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsis also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsis Foundy Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor pres at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
the Google news from yesterday relates to computational processing (Axion CPU) not internet transmissions, if you had watched Lebby at LD Micro yesterday he entertained a question of this same nature and he dumbed it down for newbies to understand, but yes Google is highly likely going to be one of the upcoming Customer deals of LWLG as evidenced previously here
Google just had a shoutout to (LWLG) EOP on a slide for hetero integration. LinkedIn post from APC.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174108464
This is the google slide! (middle picture is of EOP slot modulator)
https://www.linkedin.com/posts/advanced-photonics-coalition_fiberoptics-technology-innovation-activity-7178065757874913281-L2Oo?utm_source=share&utm_medium=member_ios
Modulators with low driving voltage, high bandwidth, and low loss.
They are also showing the same wafer
And “organic Material” the same picture on page 15 from LWLG
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
I can’t believe my eyes!
It is happening…
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174111281
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2023 and 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
1) Lebby's Timeline to Mass Commercialization has remained UNCHANGED in presentations for the last few years, Lebby has told investors that LWLG would come to market at 800Gbs in 2024!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172658420
2) Lebby has been making partnering DEALS at least as far back as ECOC 2019 when LWLG presented its META-STABILITY DATA that showed the material systems actually GAINED stability over time!!
3) Lebby's Timeline of 2024 is a PERFECT MATCH to what the industry is now showing to be the FASTEST ADOPTION EVER of a Next-Gen Node Implementation at 800Gbs set for, you guessed it, 2024!!! Check out this chart showing 800Gb adoption to be HUGE at $2 Billion starting in 2024!!! (note 800Gbs is the BLUE SHADED area)
https://investorshub.advfn.com/uimage/uploads/2023/8/19/wwenqIMG_7963.png
4) Lebby in the latest Wall Street Transcript just flat out told investors who the Customers are going to be when this thing ROLLS, which will undoubtably be in 2024 because that is what the INDUSTRY is saying will be the HUGE rollout of 800Gbs, and make NO MISTAKE when you read below who LWLG's Customers are going to be (all under NDA now!!)
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
As I see the business model, you need to be flexible, because some of these guys will want to buy from you direct. And other ones who will say, go work with our contract manufacturer or go work with our foundry, get qualified there, and then we’ll give you the business.
And so, we have to be flexible with these large guys, because they have different working models.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Ok folks, so Investors now now that the Intel's and Cisco's and Google's ARE THE CUSTOMERS that the Foundries PDK's HAVE BEEN DEVELOPED to serve!!!! Lebby has already told investors that there are PRODUCTION TRIALS in progress for at least the last 6 months but more likely a year or more!!!
PRODUCTION TRIALS!!! Nothing makes short sellers more nervous than finding out that Lightwave Logic’s foundry partners are currently running PRODUCTION TRIALS Why would they do that? “We” were convinced their technology would never scale and the fact that Lightwave Logic has never produced a product in 20 years was proof positive that they would never ever produce any revenue. We even talked to an ex employee who told us there were issues five years ago.
The worst news possible is learning about production runs because reaching that step means both parties want to produce and market this technology. In order to reach agreement on the terms of a license, both parties must be comfortable with the production economics. What level of upfront cash payment is appropriate? What percentage of gross modulator sales makes sense?
One thing is clear to me, the foundries want this technology and are already devoting machine time to be able to price the agreements. If I were short this stock, I would be fargin nervous as hell.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171355567
. This expansion of our IP moat, paired with our acquisition of the mission-critical IP assets of Chromosol Ltd (UK) to strengthen foundry PDK design capabilities with extremely low temperature ALD Processes, is a part of our ability to advance initial production trials with our foundry partners and secure our first licensing agreements in the near-term.
Corporate Update March 2, 2023
LD Micro, an incredible presentation!! highlights here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174203972
the replay should be available soon!!
Lewrock said, I don't believe I have ever seen a partner of Global Foundries post an article praising Lightwave Logic's performance results of their polymer PICs on their LinkedIn page. I wonder why they did that?
I agree! The veil is beginning to lift!!
here for those who missed it, (and link to LinkedIn post at bottom)
Lightwave Logic has announced that Chairman and Chief Executive Officer Dr. Michael Lebby discussed the latest world-class results for the company’s 200 Gbps heterogeneous polymer/silicon photonic modulator at a record low drive voltage at the 2024 Optical Fiber Conference (OFC) in San Diego, California.
The latest results for 200 Gbps heterogeneous polymer/silicon photonic modulator were shown in a presentation on March 24, 2024 during an industry workshop entitled “Will Heterogeneous Integration Meet the Needs of Future Applications?”, featuring co-panelists and speakers from six other companies. The panel focused on opportunities for heterogeneous integration of various materials including polymers and silicon — providing a roadmap for very high-performance optical polymer modulators that can operate with very low power consumption (via low voltage) and are very small in size — making them suitable for pluggable optical transceivers as well as on-board optics.
In the presentation, Dr. Lebby discussed the company’s latest world-class results based on a novel packaged heterogeneous polymer EO modulator design leveraging silicon photonics devices from a 200mm production foundry process and Lightwave Logic’s proprietary high temperature, high performance EO Polymer material. Each modulator was operated at 100 GBaud PAM4 and achieved all drive voltages below 2-V, and as low as 1-V which is excellent for low power operation. Dr. Lebby discussed the test set-up for the high-speed results, and how electro-optic polymer-based modulators based on 200mm silicon foundry wafers are ideal for 4 channel 200 Gbps per lane 800 Gbps pluggable optical transceivers for datacenter applications. He also shared updated lifetime and reliability data for both the electro-optic polymer materials and electro-optic polymer devices.
By leveraging the mature semiconductor ecosystem, silicon photonics has historically afforded unparalleled cost reduction and a deep level of integration, though due to fundamental physics limitations, silicon photonics are reaching the performance limit to reach the bandwidth and power requirements necessary in the modern era. This announcement demonstrates that a hybrid approach, leveraging the cost and integration benefits of silicon photonics along with the unparalleled bandwidth and low power advantages of Lightwave Logic’s proprietary EO polymers, lays a clear path for competitive performance and integration for current and future optical pluggable transceivers.
Dr. Michael Lebby commented: “Our newly presented results are incredibly exciting, representing not only the best commercial-grade-compatible polymer modulators to-date, but on commercial 200mm silicon wafers, with performances that fit very well for a 4-channel x 200 Gbps (or 800 Gbps) pluggable transceiver, as well as the next generation 4-channel x 400 Gbps (or 1600 Gbps) pluggable transceivers. 200G lanes with clean, open eye diagrams now represent an inflection-point to extend silicon photonics benefits by utilizing the company’s polymers to enable much higher data-rate speeds at significantly lower power consumption levels. These results will position Lightwave Logic to support the burgeoning demand of generative AI as datacenters around the world begin to upgrade their hardware faster than expected to meet the demands of the future.”
https://www.eenewseurope.com/en/200-gbps-heterogeneous-polymer-silicon-photonic-modulator-presented/
linked from this LinkedIn post by Synopsis (a Global Foundries partner)
https://www.linkedin.com/company/synopsysphotonicsolutions/
LD Micro, an incredible presentation!! highlights here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174203972
the replay should be available soon!!
Lightwave Logic has announced that Chairman and Chief Executive Officer Dr. Michael Lebby discussed the latest world-class results for the company’s 200 Gbps heterogeneous polymer/silicon photonic modulator at a record low drive voltage at the 2024 Optical Fiber Conference (OFC) in San Diego, California.
The latest results for 200 Gbps heterogeneous polymer/silicon photonic modulator were shown in a presentation on March 24, 2024 during an industry workshop entitled “Will Heterogeneous Integration Meet the Needs of Future Applications?”, featuring co-panelists and speakers from six other companies. The panel focused on opportunities for heterogeneous integration of various materials including polymers and silicon — providing a roadmap for very high-performance optical polymer modulators that can operate with very low power consumption (via low voltage) and are very small in size — making them suitable for pluggable optical transceivers as well as on-board optics.
In the presentation, Dr. Lebby discussed the company’s latest world-class results based on a novel packaged heterogeneous polymer EO modulator design leveraging silicon photonics devices from a 200mm production foundry process and Lightwave Logic’s proprietary high temperature, high performance EO Polymer material. Each modulator was operated at 100 GBaud PAM4 and achieved all drive voltages below 2-V, and as low as 1-V which is excellent for low power operation. Dr. Lebby discussed the test set-up for the high-speed results, and how electro-optic polymer-based modulators based on 200mm silicon foundry wafers are ideal for 4 channel 200 Gbps per lane 800 Gbps pluggable optical transceivers for datacenter applications. He also shared updated lifetime and reliability data for both the electro-optic polymer materials and electro-optic polymer devices.
By leveraging the mature semiconductor ecosystem, silicon photonics has historically afforded unparalleled cost reduction and a deep level of integration, though due to fundamental physics limitations, silicon photonics are reaching the performance limit to reach the bandwidth and power requirements necessary in the modern era. This announcement demonstrates that a hybrid approach, leveraging the cost and integration benefits of silicon photonics along with the unparalleled bandwidth and low power advantages of Lightwave Logic’s proprietary EO polymers, lays a clear path for competitive performance and integration for current and future optical pluggable transceivers.
Dr. Michael Lebby commented: “Our newly presented results are incredibly exciting, representing not only the best commercial-grade-compatible polymer modulators to-date, but on commercial 200mm silicon wafers, with performances that fit very well for a 4-channel x 200 Gbps (or 800 Gbps) pluggable transceiver, as well as the next generation 4-channel x 400 Gbps (or 1600 Gbps) pluggable transceivers. 200G lanes with clean, open eye diagrams now represent an inflection-point to extend silicon photonics benefits by utilizing the company’s polymers to enable much higher data-rate speeds at significantly lower power consumption levels. These results will position Lightwave Logic to support the burgeoning demand of generative AI as datacenters around the world begin to upgrade their hardware faster than expected to meet the demands of the future.”
https://www.eenewseurope.com/en/200-gbps-heterogeneous-polymer-silicon-photonic-modulator-presented/
linked from this LinkedIn post by Synopsis (a Global Foundries partner)
https://www.linkedin.com/company/synopsysphotonicsolutions/
LD Micro, an incredible presentation!! highlights here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174203972
the replay should be available soon!!
just listened to LD Micro, an incredible presentation!!
1) ETH Zurich has set independent 3rd party world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!!
2) The Customer Funnel slide is updated and now showing greater than 20 Prospects 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so that has DOUBLED since the ASM!!!!
3) Lebby showed the 200mm wafers and talked again how LWLG is commercial ready for mass commercialization of 800gbs
4) Lebby showed that Perk 6 is NOW ready for Licensing
5) Lebby expects much more Licensing activity in 2024 forward
6) Lebby again pounded the table on the "ease of Integration" and how you simply drop the LWLG technology into those little pluggable boxes!!
7) Lebby also said that the PULL has become so great at this point instead of being "pulled along" it feels more like we are being "dragged along"!!
I'll have to relisten because I know there is more too!!
oh teddybear, always trying another angle to sow seeds of doubt despite being proven wrong on ALL your claims over the past 2 years!!! and now you want to question Polymer next-node when Lebby already in OFC Slide 29 said 1600gb in 4 lanes was doable AND MORE!!!, here
•Our heterogeneous polymer/silicon
platform is poised to become
ubiquitous (just like OLED polymer material)
•We are open to license our material,
do technology transfer, and to
leverage your position in the market-place…
•EO polymers continue to show
technical progress with polymer
reliability and stability…200G lanes
and performance head-room to go
400G lanes and more
Slide 29
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
1) Lebby's Timeline to Mass Commercialization has remained UNCHANGED in presentations for the last few years, Lebby has told investors that LWLG would come to market at 800Gbs in 2024!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172658420
2) Lebby has been making partnering DEALS at least as far back as ECOC 2019 when LWLG presented its META-STABILITY DATA that showed the material systems actually GAINED stability over time!!
3) Lebby's Timeline of 2024 is a PERFECT MATCH to what the industry is now showing to be the FASTEST ADOPTION EVER of a Next-Gen Node Implementation at 800Gbs set for, you guessed it, 2024!!! Check out this chart showing 800Gb adoption to be HUGE at $2 Billion starting in 2024!!! (note 800Gbs is the BLUE SHADED area)
https://investorshub.advfn.com/uimage/uploads/2023/8/19/wwenqIMG_7963.png
4) Lebby in the latest Wall Street Transcript just flat out told investors who the Customers are going to be when this thing ROLLS, which will undoubtably be in 2024 because that is what the INDUSTRY is saying will be the HUGE rollout of 800Gbs, and make NO MISTAKE when you read below who LWLG's Customers are going to be (all under NDA now!!)
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
As I see the business model, you need to be flexible, because some of these guys will want to buy from you direct. And other ones who will say, go work with our contract manufacturer or go work with our foundry, get qualified there, and then we’ll give you the business.
And so, we have to be flexible with these large guys, because they have different working models.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Ok folks, so Investors now now that the Intel's and Cisco's and Google's ARE THE CUSTOMERS that the Foundries PDK's HAVE BEEN DEVELOPED to serve!!!! Lebby has already told investors that there are PRODUCTION TRIALS in progress for at least the last 6 months but more likely a year or more!!!
PRODUCTION TRIALS!!! Nothing makes short sellers more nervous than finding out that Lightwave Logic’s foundry partners are currently running PRODUCTION TRIALS Why would they do that? “We” were convinced their technology would never scale and the fact that Lightwave Logic has never produced a product in 20 years was proof positive that they would never ever produce any revenue. We even talked to an ex employee who told us there were issues five years ago.
The worst news possible is learning about production runs because reaching that step means both parties want to produce and market this technology. In order to reach agreement on the terms of a license, both parties must be comfortable with the production economics. What level of upfront cash payment is appropriate? What percentage of gross modulator sales makes sense?
One thing is clear to me, the foundries want this technology and are already devoting machine time to be able to price the agreements. If I were short this stock, I would be fargin nervous as hell.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171355567
. This expansion of our IP moat, paired with our acquisition of the mission-critical IP assets of Chromosol Ltd (UK) to strengthen foundry PDK design capabilities with extremely low temperature ALD Processes, is a part of our ability to advance initial production trials with our foundry partners and secure our first licensing agreements in the near-term.
Corporate Update March 2, 2023
LD Micro Tuesday, April 9, 2024
LD Micro New York Invitational XIV
Date: Tuesday, April 9, 2024
Location: Sofitel New York - New York, NY
Time: 10:30 a.m. Eastern time
Webcast Link: https://ldinv14.sequireevents.com
Investor Slide deck update today??
LWLG is one of the most UNDERVALUED stocks on Wall Street.
VALUATION & NEAR TERM PROSPECTS:
VALUATION:
LWLG has SUCCEEDED where the INDUSTRY has FAILED for over 40 years!!!! The technology is worth BILLION$$$
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173919132&txt2find=40%20years
1. SCREENING
How many have valuations of $500m or more and have the HOLY GRAIL of PHOTONICS in-hand today
Answer: just one it's LWLG!!!
2. SHORT POSITION
For now, the company issued 1,453,332 new shares during the 4th quarter. Short interest increased by 89,799 shares bringing the total number of shares owned by investors to 140,503,131.
Institutions that report to Fintel, Nasdaq, and Whale Wisdom increased their ownership by 1,467,119 shares to 32.120,876. Individuals, which includes small institutional investors who are not required to report their ownership, increased their ownership by 76,012 shares to 108,383,018 shares.
In percentage terms, individuals own 92.91%, institutions own 26.17%, and short sellers have supplied 19.08% equaling 100%. In other words, there was very little change in ownership in the 4th quarter.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173954156
3. THE EVIDENCE
1) There are deals under negotiation, and investors now know that these are BIG DEALS because of the additional requirements disclosed of the potential Customers wanted to be assured of
a) Financial strength for a LT relationship
b) ability to not have only a single source for the Perk supply, ie, perhaps another site will be opened by LWLG or perhaps some other arrangements will be made to accommodate these big players!!
2) Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
how many times are Shorts going to keep trying to deceive Longs on this one!!!
here read this post >>
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173959736
3) Reliability/Stability is PROVEN 100% already!! Lebby already stood up at OFC March 2023 and told hundreds of Industry insiders that LWLG's Reliability/Stability had been proven!! And at ECOC 2023 Lebby presented UNDENIABLE proof in his presentation!! Of course, that doesn't mean the Google's and Amazon's don't want to see additional data, OR, are they just playing that card to gain BETTER PRICING?
NEAR TERM PROSPECTS:
HUGE HUGE HUGE!!!! Lebby is working on finalizing BIG DEALS with the BIGGEST COMPANIES IN THE WORLD!!!! here
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
PIC International Conference April 16-17 Brussels
Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.
Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.
Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.
https://picinternational.net/speakers
Dr. Michael Lebby commented: "Our newly presented results are incredibly exciting, representing not only the best commercial-grade-compatible polymer modulators to-date, but on commercial 200mm silicon wafers, with performances that fit very well for a 4-channel x 200Gbps (or 800Gbps) pluggable transceiver, as well as the next generation 4-channel x 400Gbps (or 1600Gbps) pluggable transceivers. 200G lanes with clean, open eye diagrams now represent an inflection-point to extend silicon photonics benefits by utilizing the company's polymers to enable much higher data-rate speeds at significantly lower power consumption levels. These results will position LWLG to support the burgeoning demand of generative AI as datacenters around the world begin to upgrade their hardware faster than expected to meet the demands of the future."
https://finance.yahoo.com/news/lightwave-logic-demonstrates-world-class-123100712.html
the interest in implementing LWLG's technology has been skyrocketing over the past few years since it has come to the forefront of attention in the Industry, at OFC even the Google presentation featured a slide showing EOP, look at Slide 11 to see the progression Lebby has made over the past handful of years, it's INCREDIBLE, everything is PERFECT now!! And there is NO COMPETITION even close!! And LWLG is now MASS PRODUCING at SEVERAL LARGE FOUNDRIES on 200mm Wafers!! Lebby is working to close multiple deals with multiple Tier 1's and these are long, complicated Agreements for Multi-years, and some may be Multi-party Agreements as well (ie Foundry/Customer)
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
LWLG Eliminates Power Hungry & Expensive Driver Chip!!!
Lebby quote came from the Wall Street Transcript Interview (TWST) with Dr. Lebby - August 17, 2023
TWST: So you’re looking at value pricing, where the part might be more expensive, but you’re providing more performance and using less power, and as a result it’s going to be less expensive.
Dr. Lebby: Also, you’re saving the customer architectural IC designs. You don’t need driver chips and they are really expensive, way more than what a device would cost. And so, you’re providing that advantage to network operators.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172679450First
What Lebby told investors in that interview is that the cost of the device, ie the 4x200 PIC Modulator Array chip is LESS than the cost of the Driver(s) that it ELIMINATES!!! And folks, LWLG's technology is the ONLY Next-Gen technology that CAN ELIMINATE the Driver(s)!!!!
Also let's not forget that the Driver(s) is/are power hungry, I know when I asked Bard it responded that it accounted for 40% of the power usage on 8x100 800Gbs and perhaps that is/was high but regardless the Driver(s) is/are known as being a big power user in the Transceiver so if you can eliminate the Driver(s0 you are saving a lot of power!!
So what's that worth to the Transceiver companies? you guessed it.... A WHOLE LOT!!!
KCC said, I received confirmation by the company that both statements were accurate. Several foundries “ARE” versus “PLANNING TO”. Same difference! Oh and guess what…look at the picture of the 200mm wafer and you can even see the multi-channel modulator PICs!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174194505
This is the highlight of your post KCC, on Slide 14 investors are shown the 200mm wafer with LWLG modulators and other devices, the 4x200 is the pinnacle product that Transceiver builders will "drop in those little boxes" (pluggable Transceivers) as Lebby told investors at Wainwright
OFC Slide 14 here
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
Lebby at Wainwright, in fact, we are enabling network equipment upgrades without changing the network. You don't have to change the fiber, you don't have to change the equipment. You just put our technology, which is like putting a V8 into a four-cylinder car, and you put it into those little boxes. I don't know if there's a point that works here. And those boxes all fit into the network switches and routers, and that upgrades the equipment without changing the equipment, which is really powerful.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172839745
Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
Lebby told investors in the Dec 4th 2023 letter "and I look forward to sharing exciting new milestones during the balance of this year and in the next year to come."
In the Benzinga interview Lebby shared a newly achieved BIG MILESTONE!!! That milestone is LWLG's ability to NOW be able to SCALE VOLUME PRODUCTION!!!!
Folks this is HUGE and it was obviously only achieved in either January or February of 2024 since the 4th Quarter 2023 Update letter did NOT say that the SCALING AT VOLUME milestone had been achieved yet!!!
In the Benzinga interview, listen to what Lebby told investors in terms of scaling LWLG modulators to HIGH VOLUME!!
"in terms of working with the Big Foundries we actually have modulators on 200mm wafers, 8" across, this is the Standard size that Foundries use, this is a BIG MILESTONE, this means we can scale our technology quickly and efficiently in volume"
let me repeat that!!! Lebby said this was a BIG MILESTONE!!!
quote found at about 1:49:00
KCC said, I received confirmation by the company that both statements were accurate. Several foundries “ARE” versus “PLANNING TO”. Same difference! Oh and guess what…look at the picture of the 200mm wafer and you can even see the multi-channel modulator PICs!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174194505
This is the highlight of your post KCC, on Slide 14 investors are shown the 200mm wafer with LWLG modulators and other devices, the 4x200 is the pinnacle product that Transceiver builders will "drop in those little boxes" (pluggable Transceivers) as Lebby told investors at Wainwright
OFC Slide 14 here
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
Lebby at Wainwright, in fact, we are enabling network equipment upgrades without changing the network. You don't have to change the fiber, you don't have to change the equipment. You just put our technology, which is like putting a V8 into a four-cylinder car, and you put it into those little boxes. I don't know if there's a point that works here. And those boxes all fit into the network switches and routers, and that upgrades the equipment without changing the equipment, which is really powerful.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172839745
Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
Lebby told investors in the Dec 4th 2023 letter "and I look forward to sharing exciting new milestones during the balance of this year and in the next year to come."
In the Benzinga interview Lebby shared a newly achieved BIG MILESTONE!!! That milestone is LWLG's ability to NOW be able to SCALE VOLUME PRODUCTION!!!!
Folks this is HUGE and it was obviously only achieved in either January or February of 2024 since the 4th Quarter 2023 Update letter did NOT say that the SCALING AT VOLUME milestone had been achieved yet!!!
In the Benzinga interview, listen to what Lebby told investors in terms of scaling LWLG modulators to HIGH VOLUME!!
"in terms of working with the Big Foundries we actually have modulators on 200mm wafers, 8" across, this is the Standard size that Foundries use, this is a BIG MILESTONE, this means we can scale our technology quickly and efficiently in volume"
let me repeat that!!! Lebby said this was a BIG MILESTONE!!!
quote found at about 1:49:00
Slide 10 is IMPRESSIVE!! LWLG vs Competition we see LWLG is a 10 on all 6 categories, the competition is a far cry away!!!
Newbies, Slide 35 LWLG vs Competition for Dummies
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2