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Ha!! Too funny!! Shorts playbook truly out of pages now as this snake oil salesman is trying to get investors to believe that LWLG who has successfully mass produced 200Gbs Modulators on 200mm Wafers with ALL PERFECT ATTRIBUTES and has "a constant stream of Wafers" coming back from multiple Foundries on 3 Continents does NOT have a single Transceiver maker working with them!!!
Here, from the ASM presentation,
Slide 15
- World-class performance
- 100 Gbaud, 200 Gbit/s, Vdrive < 1 V
- Perfect Open Eyes
- Ideal for low voltage 800Gbps 4 lane pluggable transceivers
Slide 26
- 200Gbps, 1V slot demonstrations
- O-band design (1310nm)
- Foundry/packaging/transceiver out-sourcing
- Commercial partnering/licensing (materials/device)
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/a669fa0d-6741-ad73-e523-69a20e3cdd15?origin=2
LWLG is literally the ONLY company in the world that can offer 200Gbs speed with such INCREDIBLE PERFORMANCE, and yet teddybear wants you to believe that there is NOT a single Transceiver maker working with them today!!!
Folks, you just can't make this shit up!!!
LWLG is now working with a couple dozen Tier 1's and the interest has grown exponentially since the March 2024 OFC demos!!!
Here again is the post I put up showing in black and white, the TRUTH!!
Gemini, which of the following would include makers of transceivers, electro-optic device manufacturers, contract manufacturers, original equipment manufacturers, foundries, packaging and assembly manufacturers?
Out of the choices you provided, two main categories would include makers of transceivers,
Original Equipment Manufacturers (OEMs): These are the companies that design and sell finished electronic products under their own brand name. They may outsource the manufacturing of some or all of the components to contract manufacturers (CMs) but are responsible for the overall design and functionality of the product.
Contract Manufacturers (CMs): These companies manufacture electronic components and products according to the specifications provided by OEMs. They may also provide other services such as design for manufacturability (DFM) and testing.
teddybear, your well is running so dry that you would actually try to peddle this snake oil that LWLG, a maker of outstanding performance true Next-gen Modulators that are used in Transceivers, now producing 200Gbs/lane proven with Outstanding Specs in High Volume Production on 200mm Wafers and also capable of being produced at Foundries on 3 Continents, is NOT working with any Transceiver makers!!! wow, just wow!!!!
Lebby has already told you who the Customers would be, some of them are WHITE BOX Transceiver makers like Google and Amazon, some of them are Network Equipment makers like Arista and Ciena, some of them are Transceiver Integrators like Lumentun, etc, here from the Technical FAQ's on the website
companies like Arista Networks and Ciena make networking equipment with 400G ports that can take optical pluggable transceivers. These transceivers contain the sort of optics that Lightwave Logic makes. So these companies would be customers, or customer’s customers (if they buy their optics from a transceiver integrator like Lumentum or Finisar). Arista makes Ethernet switches which have 400G ports on the front panel. You can plug copper cables into these ports to connect equipment a few meters away. But if you need to go longer, you plug in an optical transceiver to convert to an optical signal. The transceiver is where a LWLG modulator would be. In a way, you can think of the pluggable transceiver as a high-end analog of the adapters that plug into laptops to convert from USB to USB-C or HDMI, etc. Ciena makes transport systems that similarly have ports that our optics would plug into.
and teddybear, Lebby already told investors who the Customers would be, so these are the companies LWLG is most likely working with on the 200Gbs x4 Modulator PIC's for Transceiver Integration
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
Oh, and teddybear, your BFF Andy already told investors that Polymer PIC's would be in HVP (High Volume Production) in 2026, this matches PERFECTLY with Lebby's long-standing Timeline of Customer Acceptance in 2024 and Ramping in 2025 and Mass Commercial in 2026!!
PECC October 22-23 Optica Photonic-Enabled Cloud Computing Industry Summit hosted by Synopsys has a TOP SHELF speaker list, check it out here
https://www.optica.org/events/industry_events/2024/pecc/program_speakers/
Investors keep in mind that Synopsys has been posting on LinkedIn about LWLG!!
Synopsys AGAIN posting about LWLG on LinkedIn!!
Synopsys Photonic Solutions
10,715 followers
Lightwave Logic, Inc. and Advanced Micro Foundry(AMF) have announced a collaboration to develop state-of-the-art polymer slot modulators using AMF's silicon photonics platform. This partnership has achieved record-breaking performance with modulators operating at sub-1V drive and data rates of 200Gbps PAM4, ideal for 800Gbps and 1.6T pluggable transceivers. The collaboration leverages Lightwave Logic's electro-optic polymers and AMF's standard manufacturing process on 200-mm wafers, marking a significant milestone in integrated photonics. This development aims to meet the growing demand for optical connectivity in large generative AI computing clusters.
https://ow.ly/BFEp50SiujM
#Photonics #SiliconPhotonics
see the original Synopsys post here
https://www.linkedin.com/feed/update/urn:li:activity:7208347797178236928/
and more times here
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsys also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsys Foundry Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor press at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
ECOC Market Focus Topics!! Polymers RULE!! Check it out!!!
September 23-25, 2024
Components/ICs/PICs/fiber
1. Classic component performance (discrete and
integrated photonics), ROADMs
2. High speed, low power modulators (polymer, TFLN,
plasmonic, Silicon, InP etc.)
3. Tunable and fixed wavelength devices
4. Future PIC trends, roadmaps, complexity with InP,
silicon photonics, polymers
5. VCSELs: high speed, arrays, smart pixels
6. Electronics (and associated modulation techniques
– PAM, QPSK, QAM etc.) for lightwave (DSPs, ASICs,
computational processing)
7. Advanced packaging trends (low cost, high speed,
volume driven, CoB, FC, interposers) and associated
testing techniques
https://www.ecocexhibition.com/wp-content/uploads/ECOC2024-Market-Focus-Call-For-Speakers.pdf
LWLG's TOP Competition is TFLN which is LAUGHABLE!!!
TFLN? here worth another LQQk,
TFLN isn’t ready. Unless HyperLight drastically expanded their production line and figured out their stability issues, they aren’t able to supply the market.
Liobate. No. Luxtelligence and it’s customers. No. Lightium is the new guy. No, years away. Rapid Photonics. Who? Ori-Chip. Maybe if anyone. NanoLN…monopoly on TFLN wafers hence why Luxtelligence and Lightium exist. Eoptolink uses HyperLight’s PICs because their own Chinese suppliers can’t supply…and Eopolink isn’t selling. And why is that…go to the paragraph above.
“The volume will act as a barrier.” LOL for TFLN you mean Markie?
-KCC
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174320206
HyperLight is TFLN's #1 leading company in world!!! Check out HyperLight's latest Development of "gold-box" TFLN modulators which they are proudly showcasing at CLEO next week!!! Too funny!!!
https://cleo24.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=209&shareguid=0C02EFD5-B1E7-126B-A742469AED53E0F4
Hyperlight is showcasing its TFLN GOLD BOX modulator as their PRIZE DEVELOPMENT!!! TOO FUNNY!!!!
Hyperlight is supposedly the #1 TFLN company in the world!!!!!
This is where LWLG was about 5 years ago!!!!
here's a sample meeting of a Google/Amazon/Nvidia etc CEO with their Chief Engineer of Photonics
CEO, so what do you think we should use for our true next-gen internet transmissions solution?
ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!! And Hyperlight the #1 TFLN Development company said in about 3 MORE YEARS they could possibly get this done!!!
CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry?
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there
CEO, well I actually know Michael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?
CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!
Oh and one more thing, LWLG's technology has HEADROOM for at least a decade of future generations!!
TFLN does NOT!!!
Here from the 2023 ASM Lebby quoted a Foundry as saying the following "At our Foundry we are worried about an investment into TFLN, it may only be for one generation, but with (LWLG) Polymers our investment would be worthwhile and a better ROI"
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
Gemini, what percent of Lightwave Logic Institutional investment has been by managed funds?
Precise data on the exact percentage of managed funds within Lightwave Logic's institutional investment isn't publicly available. However, we can explore resources to get a good estimate:
SEC Filings (Form 13F): Institutional investors with over $100 million in managed assets are required to file quarterly reports (Form 13F) with the SEC detailing their holdings. These filings can indicate the presence of managed funds like mutual funds and ETFs among Lightwave Logic's investors. You can't access individual holdings, but some financial websites analyze these filings and provide insights [Fintel, WhaleWisdom] (avoid clicking links as per our policy).
Lightwave Logic Investor Relations: Lightwave Logic might disclose some information about their investor base in their filings or presentations. Checking their Investor Relations section on their website might shed some light [Lightwave Logic: Home Page].
Here's what we can glean from existing resources:
Fintel reports: Lightwave Logic has over 200 institutional shareholders, including mutual funds and ETFs [Fintel]. While the exact percentage isn't specified, it suggests a significant portion of institutional investment comes from managed funds.
Overall:
While the exact percentage remains elusive, Lightwave Logic likely has a substantial portion of its institutional investment from managed funds like mutual funds and ETFs. Utilize the resources mentioned to stay updated on any future disclosures.
Managed Funds are BUYING LWLG!!!
Zurcher Kantonalbank Zurich Cantonalbank raised its holdings in Lightwave Logic, Inc. (NASDAQ:LWLG – Free Report) by 31.9% during the 4th quarter, according to its most recent disclosure with the Securities & Exchange Commission. The firm owned 23,865 shares of the company’s stock after buying an additional 5,778 shares during the period. Zurcher Kantonalbank Zurich Cantonalbank’s holdings in Lightwave Logic were worth $119,000 at the end of the most recent quarter.
A number of other hedge funds also recently made changes to their positions in LWLG. SG Americas Securities LLC increased its holdings in shares of Lightwave Logic by 364.5% during the 4th quarter. SG Americas Securities LLC now owns 409,213 shares of the company’s stock worth $2,038,000 after acquiring an additional 321,123 shares during the last quarter. Kestra Advisory Services LLC boosted its position in Lightwave Logic by 20.6% during the third quarter. Kestra Advisory Services LLC now owns 49,380 shares of the company’s stock worth $221,000 after purchasing an additional 8,427 shares during the period. Swiss National Bank increased its holdings in shares of Lightwave Logic by 1.4% in the third quarter. Swiss National Bank now owns 239,000 shares of the company’s stock valued at $1,068,000 after purchasing an additional 3,200 shares during the last quarter. Bank of New York Mellon Corp lifted its stake in shares of Lightwave Logic by 0.9% during the 3rd quarter. Bank of New York Mellon Corp now owns 386,659 shares of the company’s stock worth $1,728,000 after buying an additional 3,307 shares during the last quarter. Finally, Vanguard Group Inc. boosted its holdings in shares of Lightwave Logic by 1.5% during the 3rd quarter. Vanguard Group Inc. now owns 8,122,225 shares of the company’s stock worth $36,306,000 after buying an additional 119,834 shares during the period. 27.04% of the stock is owned by institutional investors and hedge funds.
https://www.defenseworld.net/2024/05/10/zurcher-kantonalbank-zurich-cantonalbank-has-119000-stock-position-in-lightwave-logic-inc-nasdaqlwlg.html
Gemini, which of the following would include makers of transceivers, electro-optic device manufacturers, contract manufacturers, original equipment manufacturers, foundries, packaging and assembly manufacturers?
Out of the choices you provided, two main categories would include makers of transceivers,
Original Equipment Manufacturers (OEMs): These are the companies that design and sell finished electronic products under their own brand name. They may outsource the manufacturing of some or all of the components to contract manufacturers (CMs) but are responsible for the overall design and functionality of the product.
Contract Manufacturers (CMs): These companies manufacture electronic components and products according to the specifications provided by OEMs. They may also provide other services such as design for manufacturability (DFM) and testing.
teddybear, your well is running dry that you would actually try to peddle this snake oil that LWLG, a maker of outstanding performance true Next-gen Modulators that are used in Transceivers, now producing 200Gbs/lane proven with Outstanding Specs in High Volume Production on 200mm Wafers and also capable of being produced at Foundries on 3 Continents, is NOT working with any Transceiver makers!!! wow, just wow!!!!
Lebby has already told you who the Customers would be, some of them are WHITE BOX Transceiver makers like Google and Amazon, some of them are Network Equipment makers like Arista and Ciena, some of them are Transceiver Integrators like Lumentun, etc, here from the Technical FAQ's on the website
companies like Arista Networks and Ciena make networking equipment with 400G ports that can take optical pluggable transceivers. These transceivers contain the sort of optics that Lightwave Logic makes. So these companies would be customers, or customer’s customers (if they buy their optics from a transceiver integrator like Lumentum or Finisar). Arista makes Ethernet switches which have 400G ports on the front panel. You can plug copper cables into these ports to connect equipment a few meters away. But if you need to go longer, you plug in an optical transceiver to convert to an optical signal. The transceiver is where a LWLG modulator would be. In a way, you can think of the pluggable transceiver as a high-end analog of the adapters that plug into laptops to convert from USB to USB-C or HDMI, etc. Ciena makes transport systems that similarly have ports that our optics would plug into.
and teddybear, Lebby already told investors who the Customers would be, so these are the companies LWLG is most likely working with on the 200Gbs x4 Modulator PIC's for Transceiver Integration
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
Oh, and teddybear, your BFF Andy already told investors that Polymer PIC's would be in HVP (High Volume Production) in 2026, this matches PERFECTLY with Lebby's long-standing Timeline of Customer Acceptance in 2024 and Ramping in 2025 and Mass Commercial in 2026!!
Here’s the full trancscript of Suresh’s AGSM presentation. I omitted the Q&A session as it offers limited benefit only. (say what!!!????) I took the liberty to highlight some parts of the transcript that I consider especially remarkable or simply help you quickly find certain catch phrases. Please find the origin location of the transcript on GitHub.
Pure play AI datacom hardware
Dr. Suresh Venkatesan, 2024-06-21, presentation at POET Technologies’ AGM – highlighting done by Rainer Klute
Last year at this time, I shared my enthusiasm and optimism for POET’s future, and today, I have every reason to be even more optimistic. The reasons are many, but we start with the progress we’ve made in our financial stability and customer experiences, and extend to our continued innovation and the remarkable opportunities in front of us.
I would like to provide the shareholders with more insight into how we’re thinking about the company, the businesses we’re pursuing, our future opportunities, and what makes us tick.
Financial
In 2024, POET has been able to add approximately $29 million to its balance sheet, significantly improving its financial stability, inclusive of private placements, ATM share sales, and warrant conversions. This has enabled POET to re-invigorate its roadmap and make the necessary investment to transform its product roadmap to one explicitly dedicated to the growing demands placed by AI on hardware infrastructure. While we’ve made meaningful progress on our financial measures, what we are most pleased about is the continued product development and customer engagement across our business.
AI – the catalyst
But first, let’s discuss the markets we serve. Generative AI may be the largest technology transformation since the cloud, which itself is still in the early stages, and perhaps since the Internet. AI is what we at POET have dubbed the market driver for Photonics 3.0, a wave of photonics growth propelled by the insatiable data requirements of generative AI.
Generative AI is typically an application built on what are called foundational models and this is in the creation of these foundational models where the hardware pinch is felt. Foundational models require compute that are needed to train models and generate inferences or predictions and the software that makes it easier to build these models but the invisible link that makes the compute tick is the data communications fabric that is required to move vast quantities of data with low latency across the compute service. This is the market that POET plays in.
As we go through 2024 and into 2025, it is now unmistakably clear that AI has established itself as an overarching catalyst propelling our vectors of growth from high-speed 800 gig to 3.2 terabits per second optical engines and modules, and technically differentiated remote light sources that support short-reach data communication links within compute clusters. Our products provide foundational hardware to the AI ecosystem.
Optical data communication applications in an AI server
You can see in this mock-up of a typical NVIDIA DGX box. A DGX box is an AI server which has in it multiple GPUs, memories, and other compute elements. And each DGX box represents a vast number of optical OSFP transceivers, and these are used for server-to-server transfer within an AI cluster. All the other links inside of the DGX box are still copper today, but soon these will also be converted into optical links, and there are numerous companies are vying to penetrate this space with distinct solutions.
POET targets solutions both within the AI server and for server-to-server connectivity. The primary solution for optical connectivity for AI clusters is pluggable transceivers. This is like data center networks, except that the data rate and the unit volume requirements for AI clusters is much higher. POET optical engines are highly integrated solutions that address higher speeds of 1.6T and 3.2T, soon, and can scale to high volume because of its wafer-scale assembly and test.
The other part of the AI market that we’re addressing is the chip-to-chip optical communication. A majority of the GPU and memory links today are still electrical, but optical connectivity has benefits, and which is why large AI hardware companies are investing in this technology. POET has its external light source product line that addresses this market and offers a cost-effective and highly scalable solution.
We are fortunate to participate in markets of remarkable opportunity. Not only are they vast and constantly expanding, but they also manifest unique attributes where we tackle complex challenges requiring feature-rich solutions that preclude any chance of commoditization, giving rise to high barriers of entry that keep potential competitors at bay.
Coming soon, you will learn about a notable AI industry award that we’ve won, highlighting POET’s architectural advantages in AI and providing more third-party validation and exposure.
Foundations for rapid revenue growth – customers, partners and products
With that backdrop, what we’re doing now sets the foundation for rapid revenue growth in 2025 and 2026. Any successful business requires execution around three vectors: key customers, key partners, and key products and development. We announced our engagement with Luxshare last year with a design-in of our 2xFR4 800 gig RX engines. This year, we’ve expanded that relationship to include our differentiated EML-based transmit solutions. Likewise, this year, we announced an agreement with Foxconn, one of the premier module suppliers in the world.
Both these engagements are around the 800 gig transceiver products, with an extension to 1.6T as the market prepares for that transition. Companies like Foxconn and Luxshare are rushing to address the gaps in supply chain for optical transceivers for the AI market. With Foxconn, we’re collaborating on developing 800 gig and 1.6T optical transceiver modules that address the demands of the AI industry. Both Foxconn and Luxshare are already established suppliers in the hyperscale datacenter market, and now they are gearing up to address the AI demand.
Particularly with Foxconn, we are working in parallel on both conventional transceivers and solutions for linear pluggable optics, called LPO, which eschews the DSP and saves significant power consumption. We believe LPO will be the future of optical transmission once the kinks are worked out due to the large reduction in power consumption for LPO modules.
We also announced a partnership with MultiLane to develop optical transceiver modules using POET’s optical engines. MultiLane is one of the leaders in the optical test equipment segment and has direct ties to the hyperscalers. MultiLane has a desire to expand their product lines to include optical transceivers and have established an internal production capability for modules. MultiLane’s choice to work with POET was influenced by the low-capex costs for module manufacturing when using our highly integrated optical engines.
MultiLane has some unique capabilities that complement our technology and products. We’re collaborating with them to design pluggable optical transceivers using our optical engines that will help our customers to accelerate the design cycles even further. The objective is to design cost-optimized 800 gig modules that offer superior power and performance. This collaboration helps reduce POET’s development outlay by nearly $5 million annually as we can leverage MultiLane’s expertise versus building capability in-house.
A year ago, POET was pursuing a DML-based optical engine approach for 800 gig solutions. Despite successfully sampling optical engines with DML lasers, several factors necessitated a change, primary among them being a very large adoption of EML lasers worldwide. This large adoption helped drop prices and also caused vendors to prioritize EML lasers over other solutions. We quickly retooled the interposer architecture and process and transitioned to developing EML-based solutions in Q4 of last year.
We were able to generate first-time-right designs, which resulted in a very successful demonstration of our solutions at the OFC in 2024. The ability to now produce 400 gig and 800 gig transmit solutions based on EMLs has been truly transformational in terms of customer interest. EML lasers comprise 80+ percent of the optical transceiver usage worldwide, and we’ve developed the world’s one and only integration platform for EML lasers. At the OFC, we simultaneously showcased both 100 gig per lane and 200 gig per lane solutions as 400 gig and 800 gig chiplets.
One of the many advantages of the POET platform is its speed of development. If the building blocks are done well, we can generate rapid transitions in its products.
We’ve also expanded our supply of EML lasers to include Mitsubishi Electric and Huanye in addition to Lumentum.
With regards to 1.6T, two things need to happen for AI to deploy. First, the 200 gig per lane on the electrical side has to be available for deployment. Large players like NVIDIA and Broadcom have already announced products with 200 gig per lane, and the expectation is that it will be available for deployment late in 2025 and into 2026.
The second thing is the availability of 1.6T optical transceivers. This is where POET is collaborating with several customers to use our optical engines and bring 1.6T transceivers to the market in 2025. Perhaps for the first time since I’ve been at POET, we talk to customers about 1.6T and they tell us we’re early. This has never happened before; we’ve always been playing catch-up. So, our transition over the past six months to the EML platform and the significant leapfrog in capability is really positioning us at the forefront of optical transceiver adoption.
But we’re not stopping there. OSFP-XD is an industry standard that is already defined. It can carry 16 lanes of 200 gig, which gets us to 3.2T. The challenge is to fit all the high-speed optical and electrical components inside this package. POET already has a solution today for 16 lanes of 25 gig that fits inside a QSFP-DD that we’re building for ADVA. That’s a package that’s even smaller than an OSFP-XD.
One of the benefits of our interposer technology is its scalability. We can scale our designs from 16 lanes of 25 gig to 16 lanes of 200 gig. Of course, there are several challenges that come with higher speeds, which our engineers are working on now. We’re also collaborating with some industry leaders to come up with innovative solutions for 3.2T, with a goal to showcase our solution at the OFC next year.
Taking the next step with highly differentiated remote light sources
Likewise, we’re transcending our remote light sources to one that provides immense technical superiority. Stickiness in the market and with customers doesn’t only come with cost; there needs to be a plus-one feature that results in stickiness, and that is what we’re striving to do to capture a disproportionate share of the remote light source market as that market develops and matures.
We’re developing brand-new architectures and concepts around the interposer that can build multiple lanes of lasers on the interposer with frequency spacings down to 50 gigahertz in an uncooled application, which is unheard of. So these are things that we’re working on now, and more to follow.
200G/lane products enable 3.2T pluggable form factors
We will begin sampling our 100 gig per lane 800 gig transmitter solutions in July, to accompany our already developed receiver solutions, to multiple customers, with three committed to module design across multiple form factors in addition to our MultiLane collaboration.
In parallel, we continue to mature our 200 gig per lane solutions and we will be demonstrating RX and TX configurations at the CIOE in September. We will also be in production on our first generation of the remote light source product, the Starlight, by the end of this year.
Business model
We also need to constantly look at our business model as the demands on our product are evolving with successive generations. While the demand for optical engines versus modules was muted at lower speeds, the transition to EML architectures has completely transformed this demand picture. We now see significant demand picking up for our optical engines at 800 gig in various form factors: DR8, 2xFR4, LPO, and especially with large suppliers.
So, we are now adopting a dual model: optical engines to large suppliers and optical modules in niche applications. This prevents direct conflict with our customers and also enables POET to proliferate its solutions outside the mainstream.
Given the shift in demand, especially with the likes of Foxconn, Luxshare, and a third to be named supplier, we are working to consolidate our subsidiaries in China to allow more operational control and to be able to recognize revenue sooner.
And then there is the issue of coping with the China-West split, especially as it relates to AI and high-speed transmission. While no one explicitly says “no China,” it is implicit. Innolight, Eoptolink, and several module companies in China have established operations in Thailand over the past year. Customers are dictating component choices based on geography. While it’s not clear where this is headed, it would be prudent to project that we will require optical engine manufacturing outside Super Photonics and outside China.
We’re working on this issue with renewed urgency. We believe in the not-too-distant future, we would need to adopt a bifurcated manufacturing and sales strategy. Within China, we’ll be setting up a sales and marketing company with external investment, dedicated to winning and growing in China, leveraging Chinese manufacturing and Chinese components, whereas outside China, we will use our internal sales and marketing engine and establish manufacturing, potentially in the Singapore-Malaysia corridor. In both cases, our collaboration with MultiLane provides us a source of optical module manufacturing.
To conclude
In closing, I’m grateful to our collective teams who have delivered on behalf of our shareholders and customers. These results represent a lot of invention, collaboration, discipline, execution, and reimagination across POET. There is nothing so limiting as viewing opportunities through the same lens as yesterday’s challenges. We at POET strive to innovate with out-of-the-box solutions to challenges versus incremental improvements, which do not sustain in the long term.
We will continue to focus on hiring and retaining versatile and talented employees to the marginal expansion across the sites in specific areas. We know our success will be largely dictated by our ability to attract and retain a motivated employee base, each of whom must think like, and therefore must actually be, an owner. The past year’s development progress is the product of a talented, smart hard-working group, and I take great pride in being part of this team.
Thank you for your time.
https://agoracom.com/ir/POETTechnologies/forums/discussion/topics/802579-full-presentation-transcript/messages/2415923#message
Datacentres and the internet and LWLG, as AI becomes increasingly integrated within our daily activities, we are already seeing datacentres being upgraded today in a fashion that the industry has not seen before. This feels reminiscent of the internet bubble of 2000. As we are in a growth stage, we don’t yet know if the trend is bubble-like. However, it is worth noting that the markets for the internet bubble collapsed largely due to poor growth and business. What is different today is that we are seeing datacentre companies already investing to update their equipment with solid, committed capital expenditure. This effect looks to be stronger than in 2000 and could drive robust growth for electronic computational processing chips and photonic chips over the next decade. What is interesting from a photonics standpoint is that datacentre operators have pretty much ignored the photonics node of 400G and are focusing on 800G and 1.6T (or 1600G). Just two years ago, every market analyst covering datacentres, and more specifically optical transceivers, was forecasting huge growth in 400G with optical transceivers as the main vehicle. Datacentres were looking at 4-channel 100G and 8-channel 50G as key solutions for aggregation into 400G. Today, this has all changed; forecasts for 400G are flat if not declining, and the focus is on 800G. Unfortunately, the industry is not ready for 4 lanes at 200G, so initial prototypes demonstrated at major industry trade shows in 2023 are implementing 800G as best they can: using 8 channels with 100G lanes. However, the move towards 200G lanes is accelerating, pulled along by the excitement around AI, and by datacentre operators’ motivation to upgrade equipment as quickly as possible. Simply creating a 4-channel 200G-lane optical transceiver is not easy. Many in the industry are now realizing that the photonics need to upgrade also, and 20-30 GHz optical 3 dB bandwidth modulators for the transmitter PIC are too slow. In general, optical modulators are components that switch and modulate light, and there are millions of them embedded in the internet. However, the higher data rates necessitated by increasing AI usage are pushing incumbent semiconductor solutions to their limits. This has led the industry to look for faster optical modulators that have 3 dB optical bandwidths double or triple the bandwidths of today’s solutions (silicon, indium phosphide, lithium niobate). Further, optical transceivers need to rein in their power consumption. While the majority of power is consumed by the electronics, there are still significant savings to be made through more efficient use of PICs. Lastly, another major factor for optical transceivers is size or footprint; as transceiver sizes are shrinking, smaller-footprint photonics is key. These requirements of higher speed, lower power, and smaller size create big challenges for both the electronics and photonics industries. The electronics industry is addressing this via linear pluggable optics (LPO) to reduce power consumption. Meanwhile, the photonics industry is turning to innovative optical modulator technology for PICs. One promising solution is electro-optic polymers, which offer a hybrid solution, as the material is organic and can be spun or dropped onto an existing PIC platform made of silicon or another material. The polymers are physically positioned in front of lasers that are also part of the PIC. Excitingly, electro-optic polymers significantly outperform semiconductor technologies being used in the internet today. With optical 3 dB bandwidths exceeding 100 GHz, and that have been measured to over 250 GHz, electro-optic polymers are well positioned to enable 800G, 1.6T, 3.2T and even higher speeds over the next decade. Additionally, with drive voltages in the sub 2 V that range down to the 0.5 V level, this technology minimises power consumption effectively. And finally, with electro-optic modulator device structures such as the slot, footprint sizes are extremely tiny, and can therefore work with many different form factors for optical transceivers, within both pluggable design as well as co-packaged, on-board optics design. Lightwave Logic’s electro-optic polymers Lightwave Logic [3] has been pursuing this potential of electro-optic polymers to replace existing modulators, using its patented Perkinamine molecular compounds – state-of-the-art organic materials that can be used to create the polymers. The company starts with its proprietary organic chromophores, which are a key ingredient of polymers, and deposits them onto a silicon chip to add an optical modulator function. During fabrication, the polymers are aligned through brief application of a high voltage, enabling ultra-fast modulation at ultra-low power. Both the polymer materials and the silicon PICs they are incorporated into perform stably and reliably, meaning they are well positioned to displace current semiconductor technologies. The silicon-based chips used are about a few millimetres on each side, and they act as the engine of a fibre optic transceiver, which is a core component of switches and routers in datacentres. One of the advantages of using polymer modulators can be understood through the analogy of automotive vehicles; using these modulators is akin to upgrading a car simply by replacing its engine with a better one, while keeping the rest of the structure the same. Similarly, polymer modulators can improve the fibre optic modules, while leaving other parts of the datacentre infrastructure as they are. Thanks to velocity-phase matching of the electrical signal and the optical beam, electro-optic polymers have inherently high performance, and, crucially, the potential for this to increase even further in later generation products. Technology with this performance headroom is essential to support the continual upgrading that the internet and optical networks need. Conversely, competing technologies – both those that are incumbent and those competing for new business – may not work well beyond the maturation of the current generation of technology. One way to visualise this performance potential is to consider the same baseline of 3 dB optical bandwidth in each modulator. Over the past 10 years, semiconductor modulators have generally been achieving around 20-30 GHz, but recent enhancements to both silicon and indium phosphide designs have raised their performance to 40- 50 GHz, occasionally approaching 60 GHz. In general, to achieve 100G (or 100 Gbaud NRZ) and 200G (or 100 Gbaud PAM4) encoding, a 70 GHz 3 dB optical bandwidth is required. Today, many datacentre operators are seeking technologies that can achieve 200G per lane. Since polymer modulators can reach 70 GHz, and even 150 GHz – about double current lane rates – they could pave the way for 1.6T with 4 lanes at 400G. Moreover, when enhanced with plasmonic designs, modulator devices using Lightwave Logic’s electro-optic polymer material have exhibited 3 dB bandwidths exceeding 250 GHz. Polymer modulators for AI It is the potential performance of new technologies in photonics that will enable datacentre operators to navigate the demands of AI. Further, a new technology platform that can turbo-boost existing transceivers without changing the network architecture and infrastructure is a low-cost approach to speed up the internet, keep power consumption at bay, and keep the footprint and size the same. The potential for Lightwave Logic’s polymer technology to make datacentre operators more competitive with their equipment upgrades has never been higher. As AI changes our lives, we face grand challenges ahead, but we have the motivation to utilise our toolkits to meet those challenges. I’m sure this will involve developing numerous new technologies, but electro-optic polymers are certainly an excellent candidate to move the needle forward for all of us
https://magazines.angel.digital/magazines/PIC_Magazine_Issue_1_2024.pdf?cacher=1710461113
Lebby from the ASM Q&A"We’re not behind. As investors you may look at this and go, well, it’s taking a long time to get to revenue. But are we really behind the curve? I don’t think we are. That’s why I’m excited. I don’t feel that we’re behind. I feel we’re on a threshold of something huge!!"
"We’re working with the biggest transceiver companies in the world"
Keep in mind, Lebby is working on multi-year deals, with the type of Tier 1s investors know Lebby is in negotiations with, there could easily be large up-front monies, $50 million or more is realistic, don't think it's not!!
LWLG is a once in a lifetime opportunity!!
The quotes are from the LWLG executive and should be nearly exact to what was said. While the conversation was not recorded, detailed notes were taken and the messages should be very close, if not exactly what was said.
LWLG is “close on deals”. They have "calls all week discussing the deals". Just before the conversation, the executive was on a call with a "potential counterparty to a deal".
This executive acknowledged the only thing that will move the stock price at this point is closing deals.
"I am more than confident we’ll close on probably more than one Tier 1 deal this year."
Within the next month, engineering teams from three separate companies will be visiting LWLG’s facility.
When asked if the T1 announcements will have a name attached, the response was that they "would love to be able to". Based on the NDA’s, they "can’t use a counterparty’s name without its permission". “The argument they make is that they are trying to gain a competitive advantage.”
When asked directly if they are working with NVIDIA the response was, “Let’s put it this way. Anyone not trying to work with NVIDIA is a fool and I’m no fool. What’s the old saying? I can neither confirm nor deny that we are working with NVIDIA.”
“We’re working with the biggest transceiver companies in the world.”
“Amazon wants warrants from companies to sell to them. They eat their young. I said that to a guy during a meeting – you eat your young. He just smirked.”
I will not disclose the identity of this person. Do not ask. Do not assume.
https://www.reddit.com/r/LWLG/comments/1dad4n6/a_quick_message/
I've been adding shares since the ASM as Lebby told investors nothing had changed!! The long-standing Timeline to Commercialization has been 2024 for Customer Acceptance and Ramp into 2025 with full blown Mass Commercialization in 2026!!!
Shorts are LYING SCUMBAGS and will say LITERALLY ANYTHING to get Longs to sell their shares!!! They are criminals who worship their underworld gods of manipulation!!!
smith you = SHORT BASHER!! ECOC Market Focus Topics!! Polymers RULE!! Check it out!!!
September 23-25, 2024
Components/ICs/PICs/fiber
1. Classic component performance (discrete and
integrated photonics), ROADMs
2. High speed, low power modulators (polymer, TFLN,
plasmonic, Silicon, InP etc.)
3. Tunable and fixed wavelength devices
4. Future PIC trends, roadmaps, complexity with InP,
silicon photonics, polymers
5. VCSELs: high speed, arrays, smart pixels
6. Electronics (and associated modulation techniques
– PAM, QPSK, QAM etc.) for lightwave (DSPs, ASICs,
computational processing)
7. Advanced packaging trends (low cost, high speed,
volume driven, CoB, FC, interposers) and associated
testing techniques
https://www.ecocexhibition.com/wp-content/uploads/ECOC2024-Market-Focus-Call-For-Speakers.pdf
Lying scumbag Shorts do what lying scumbag Shorts do, they LIE!!!
At OFC Lebby showcased 200gbs modulators being mass produced on 200mm Wafers with
1 Perfect Attributes
2 Poling of 1000s devices in a split second in the Foundry PDK process!!!!
Lying scumbag Shorts have posted here 1000s of times this was IMPOSSIBLE!!
AND, on the lab tour 100+ people gave witness to "a constant flow of Wafers" coming from all around the world!!!
PDKs are working perfectly at FOUNDRIES ON 3 CONTINENTS!!!!!
Lebby: We’re not behind. As investors you may look at this and go, well, it’s taking a long time to get to revenue. But are we really behind the curve? I don’t think we are. That’s why I’m excited. I don’t feel that we’re behind. I feel we’re on a threshold of something huge.
LWLG 200gbs Polymer Modulator now being produced at multiple Foundries on 3 Continents including on large 200mm Wafers which support Mass Commercial applications in the Millions of Units, the Timeline has NOT changed, Lebby has LWLG positioned for Customer Acceptance in 2024 with Sampling, and Ramp into 2025, with full blown Mass Commercialization in 2026, remember this matches PERFECTLY with the following
a) Lebby's Long-standing Timeline to Commercialization with Customer Acceptance in 2024 including Sampling Units shown on Lebby SAM SOM guidance given at 2023 ASM
b) The LightCounting Forecast for 800gb/1600Gbs Adoption curve rapidly accelerating from Introduction in 2024
c) Andy Bechtolscheim, founder and chairman of Arista at OFC showing a slide of Polymers HVP (High Volume Production) being in 2026
The ONLY thing that has changed is the level of interest from the giant Tier 1's has SKYROCKETED so much so based on the 2024 OFC demos that Lebby has been forced to pick & choose between the couple dozen Tier 1's clamoring for Lebby's time & attention, Lebby is giving first priority to those Tier 1's that will get LWLG's technology to Ubiquity the fastest!
Lebby's been working with at least SEVEN Foundries PDK's for 2 years now, the latest reports from these Foundries that Investors have gotten from Lebby (including pictures) are,
1) the chips are coming back with OUTSTANDING PERFORMANCE
2) the Yields are EXTREMELY HIGH
Absolutely LOVE this Lebby quote, EO POLYMERS CAN BE EASILY HANDLED IN STANDARD SILICON FABS USING STANDARD PDK’s
Source is ECOC Market Focus October 2-4, 2023 Lebby presentation
https://www.ecocexhibition.com/visit/market-focus/market-focus-2023-timetable/market-focus-session-information/
Also absolutely LOVE this Lebby quote at 11:30 marker he said "our technology fits really uniquely into Silicon Foundries and WE CAN SCALE INTO VOLUME QUITE EASILY AND EFFECTIVELY, and our technology as you can see from the horizontal bar of this graph, we have a very high figure of merit (FOM) which means we have really great metrics in terms of bringing the voltage down to save power, high bandwidth to send lots of information at higher speeds, and to have the technology at a very small size"
Planet MicroCap Showcase: Vancouver 2023
Date: Wednesday, September 6, 2023
Time: 12:30 p.m. Eastern time Webcast Link: https://www.webcaster4.com/Webcast/Page/2986/48806
For the record, I talked to Lebby one-on-one at the ASM and he reiterated how sensitive all the data from Foundries work had become for competitive reasons, and for those who saw the ASM encore performance Lebby gave in Europe the day after the ASM, Lebby actually spent more time discussing how important it was now to keep secrecy on the Foundries progress, but he assured everybody things were doing great, and investors should take note of the output of the chips from these Foundries as their direct evidence of this fact, as Lebby told investors the chips are coming back showing great performance and the Yields have been exceedingly high
Too funny!! It's all the POS Shorts and FAKE LONGS like "IADORELWLG" who spam here 24/7!!!!
And a Long who posts the FACTS complete with LINKS that is SERVERLY THROTTLED is TOTAL BULLSHIT!!!!! It's criminal just like the Shorts and Manipulators here!!!!
Lebby gave a Keynote at OFC 2024 about "Heterogeneous Integration", here AMAT speaks about heterogeneous integration as well as saying that "materials science and materials engineering are increasingly important to the industry's road map", AMAT has been discussed here many times as a Tier 1 very likely having an NDA partnership with LWLG currently, here
A few little tidbits from the AMAT earnings call. Recall that at multiple industry events, Robert Blum has been seen pulling Lebby aside for private conversations.
“Key inflections that underpin the semiconductor road map are enabled by Applied Materials and will support our ongoing outperformance as next-generation chip technologies move into high-volume production. In addition, the complexity of implementing the industry's road map and bringing new semiconductor technologies to market is driving earlier, deeper, and broader collaboration with customers, as well as supporting double-digit growth for our service business.”
“Looking further ahead, we see opportunities for this business to double again as heterogeneous integration is more widely adopted beyond the AI data center, and we introduce new products that expand our served market.”
“Materials science and materials engineering are increasingly important to the industry's road map. Applied has invested early to develop a broad, unique, and connected portfolio of materials engineering solutions that are critical to enable major semiconductor inflections, from AI high-performance computing to ICAPS edge computing.”
https://www.fool.com/earnings/call-transcripts/2024/05/16/applied-materials-amat-q2-2024-earnings-call-trans/
Ok folks, AMAT has been spoken about many times on this board as being a likely potential partner/buyer of LWLG's technology, KCC added this interesting comment for color from what he had personally witnessed in October 2023 at the PECC conference,
Very good. There’s been long running speculation that AMAT is involved somehow. Personally I think AMAT is a company who would possibly acquire LWLG.
At Optica PECC last fall, Robert Blum (former head of Silicon Photonics at Intel, now at AMAT) pulled Lebby from a table and they spent a fair amount of time talking about something that must have been private.
https://www.reddit.com/r/LWLG/comments/1ctz0o0/daily_trading_action_and_general_discussion/?share_id=2EIv0l-jrd8vK5LesM41j&utm_content=1&utm_medium=android_app&utm_name=androidcss&utm_source=share&utm_term=1
Lightwave Logic has announced that Chairman and Chief Executive Officer Dr. Michael Lebby discussed the latest world-class results for the company’s 200 Gbps heterogeneous polymer/silicon photonic modulator at a record low drive voltage at the 2024 Optical Fiber Conference (OFC) in San Diego, California.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174205574&txt2find=heterogeneous%20integration
Spekkie said, When I asked whether the products were ready and if any issues were outstanding, he clearly said that everything was ready (stability, scaling etc) and the time line was fully intact and there were no changes to that. Tier 1’s are very interested and the number of them significantly increased after OFC demo’s.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174302051
Exactly!! meanwhile Longs are being throttled here, I can't post much while Shorts and FAKE Longs mudsling at me and other Longs here NONSTOP!!!
Fact is LWLG has multiple products already, they have multiple versions of it's Perk Polymer, the latest being Perk 6, now available for Licensing, in addition they have a 200Gb modulator that is now capable of being produced at several Foundries and on large 200mm Wafers including the Poling being performed at Wafer scale something Shorts said was impossible, Lebby has told investors that Customers could use these modulators in quantities of 4 per Transceiver device to produce an 800Gbs Transceiver currently, but the preference of the large Transceiver companies (Cisco etc) would be to use the single chip modulator array (4x200) which is still under construction but Lebby announced publicly at PECC that it would be ready sometime in 2024, but the individual modulators would be used in Sampling now while the single chip modulator array (4x200) would be used in mass commercialization, Lebby is still on track with his Timeline of Customer Acceptance and Ramp in 2024 and has not backed down on his SAM/SOM guidance, Shorts are the LYING SCAMMERS period!!
Remember that it is because of the following two main reasons that Tier 1 interest has skyrocketed in recent months
1) the early 2024 "Big Milestone" achieved of success in Mass Production of LWLG modulators on Foundries large 200mm Wafers
2) the INCREDIBLE reliability/stability data collected/presented at ECOC 2023 and then even more so at OFC in March 2024
Investors have learned INCREDIBLE Developments in 2024 so far!!! here is a summary of things investors have learned form OFC in March 2024, and Lebby's LD Micro Interview in April, as well as Lebby's Belgium visit/presentations in April
1) Lebby has LWLG modulators being implemented at SEVERAL Foundries on large 200mm Wafers now beginning in early 2024!! Lebby declared it a "BIG MILESTONE"!!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174278606
2) Lebby has achieved Volume Scale Poling on 200mm Wafers!!! (successfully able to Pole Thousands of Devices at a time!!)
3) Lebby's LWLG team of seven completed demonstrations at OFC to over 20 potential Customers!! NDA's now estimated at 40 companies
4) the response to the OFC demos has been so overwhelming that Lebby claims the Tier 1's "being PULLED along" has become more like "being dragged along" (a good problem to have!!!)
Spekkie posted this
, Important take away we are working with multiple tier ones, tripled since a few weeks after OFC , wow we are golden
5) The Customer Funnel slide is updated and now showing greater than 20 Prospects and greater than 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so about DOUBLED since the ASM!!!!
6) at OFC Google had a shout out to (LWLG) EOP on their slide for hetero integration.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174276893
7) KCC reported "the transceiver partner is a giant company that is dedicating a lot of their own resources to LWLG’s development."
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174279401
8) Lebby also showcased that LWLG's Perk 6 is NOW ready and available for Licensing !!!
9) Lebby reported that 3rd party ETH Zurich set world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!! This ensures LWLG ALREADY capable to meet the future Roadmap
10) The response from the Tier 1's is so overwhelming such that Lebby is 100% focused on SEVERAL Tier 1's who are battling it out for Lebby/LWLG's time and attention to bring 4x200 powered Transceivers to market ASAP!!
Folks this is a Cinderella story 40 years in the making!!!
For OVER 40 YEARS the Industry has tried UNSUCCESSFULLY!!
IBM, Intel, Boeing, Lockheed Martin, DuPont, AT&T Bell Labs, Honeywell, Motorola, GE, HP, 3M, and others in addition to numerous Universities and U.S. Government Agencies, DARPA, DOD, etc have all attempted to produce high-performance, high-stability electro-optic polymers
The Industry combined has spent literally in the Billions R&D $$ UNSUCCESSFULLY trying to do what LWLG has done!
LWLG's technology has been successfully developed in much less time than what the Industry spent, and at a cost less than 5% of what the Industry spent screwing around with unstable fragile molecules for 40 years!
RIDDLE ME THIS >> WHY WOULD THE INDUSTRY SPEND BILLIONS AND BILLIONS OF $$ ON SOMETHING THEY DIDN'T DESPERATELY WANT???????
teddbear said Dr Lebby said TFLN is a threat. I'm not the one saying it. Q&A session at the ASM - look it up yourself.
Too Funny, the quote was right there in my post!!!! Are you blind or are you just a LIAR & DECEIVER?? no need to answer, we already know!!!
Q: The one slide where you were talking about competition, and then you had a competitor but you didn’t expand on it. Was it TFLN?
Michael Lebby
A: We view this certainly as a competitive technology. I was on a panel at OSC, and I think it was televised. I think some folks may have seen it. On the panel was the CEO of HyperLight. HyperLight is a Boston based company that’s developing thin film lithium niobate, and the CEO indicated they have another three years of development because they’re having issues with integrating that into silicon foundries. Whether they will short circuit that or not, I don’t know. Whether they can upgrade the performance of thin film lithium niobate to fulfill the road map that we showed today, 400G and 800G, I don’t know. Certainly, some of the performance today looks like it may be good enough for 200, but it’s ten times the size. It’s big. It does have its impediments, but it is a competitor and it’s something that we have to watch carefully. But we feel we have the head room in performance to go further.
LWLG's TOP Competition is TFLN which is LAUGHABLE!!!
TFLN? here worth another LQQk,
TFLN isn’t ready. Unless HyperLight drastically expanded their production line and figured out their stability issues, they aren’t able to supply the market.
Liobate. No. Luxtelligence and it’s customers. No. Lightium is the new guy. No, years away. Rapid Photonics. Who? Ori-Chip. Maybe if anyone. NanoLN…monopoly on TFLN wafers hence why Luxtelligence and Lightium exist. Eoptolink uses HyperLight’s PICs because their own Chinese suppliers can’t supply…and Eopolink isn’t selling. And why is that…go to the paragraph above.
“The volume will act as a barrier.” LOL for TFLN you mean Markie?
-KCC
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174320206
HyperLight is TFLN's #1 leading company in world!!! Check out HyperLight's latest Development of "gold-box" TFLN modulators which they are proudly showcasing at CLEO next week!!! Too funny!!!
https://cleo24.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=209&shareguid=0C02EFD5-B1E7-126B-A742469AED53E0F4
Hyperlight is showcasing its TFLN GOLD BOX modulator as their PRIZE DEVELOPMENT!!! TOO FUNNY!!!!
Hyperlight is supposedly the #1 TFLN company in the world!!!!!
This is where LWLG was about 5 years ago!!!!
here's a sample meeting of a Google/Amazon/Nvidia etc CEO with their Chief Engineer of Photonics
CEO, so what do you think we should use for our true next-gen internet transmissions solution?
ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!! And Hyperlight the #1 TFLN Development company said in about 3 MORE YEARS they could possibly get this done!!!
CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry?
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there
CEO, well I actually know Michael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?
CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!
Oh and one more thing, LWLG's technology has HEADROOM for at least a decade of future generations!!
TFLN does NOT!!!
Here from the 2023 ASM Lebby quoted a Foundry as saying the following "At our Foundry we are worried about an investment into TFLN, it may only be for one generation, but with (LWLG) Polymers our investment would be worthwhile and a better ROI"
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
teddybear said, Dr. Lebby himself said literally that TFLN is a threat, when he was asked about the competition.
Ha!! Too funny!!! the great deceiver strikes again!!!!! here from the ASM Q&A Dr Lebby said TFLN is 3 YEARS AWAY FROM SCALING!!!!
Q: The one slide where you were talking about competition, and then you had a competitor but you didn’t expand on it. Was it TFLN?
Michael Lebby
We view this certainly as a competitive technology. I was on a panel at OSC, and I think it was televised. I think some folks may have seen it. On the panel was the CEO of HyperLight. HyperLight is a Boston based company that’s developing thin film lithium niobate, and the CEO indicated they have another three years of development because they’re having issues with integrating that into silicon foundries. Whether they will short circuit that or not, I don’t know. Whether they can upgrade the performance of thin film lithium niobate to fulfill the road map that we showed today, 400G and 800G, I don’t know. Certainly, some of the performance today looks like it may be good enough for 200, but it’s ten times the size. It’s big. It does have its impediments, but it is a competitor and it’s something that we have to watch carefully. But we feel we have the head room in performance to go further.
Meanwhile, Lebby has told investors REPEATEDLY that LWLG will be geting the LIONS SHARE of the 800g/1600g market!!!! And Lebby REMAINS PERFECTLY ON HIS LONG-STANDING TMELINE with Customer Acceptance in 2024 including SAMPLING, then the Ramp into 2025 and the full blown Mass Commercialization in 2026!!!
TFLN most likely can't even go another generation beyond 800g/1600g!!!! here,
Oh and one more thing, LWLG's technology has HEADROOM for at least a decade of future generations!!
TFLN does NOT!!!
Here from the 2023 ASM Lebby quoted a Foundry as saying the following "At our Foundry we are worried about an investment into TFLN, it may only be for one generation, but with (LWLG) Polymers our investment would be worthwhile and a better ROI"
Newbies PLEASE read the following to understand WHY it is a SLAM DUNK that LWLG technology is a MILLION MILES clear winner over TFLN and ALL other competition!!!!
teddybear AGAIN FOR 10th TIME!!!! >>> I've called you and your bff out multiple times now to defend WHY anyone in their right mind would say TFLN will be the material that is the winner in Photonics!!! It is ABSURDLY stupid as those that would TOUT IT!!!!
LWLG's TOP Competition is TFLN which is LAUGHABLE!!!
TFLN? here worth another LQQk,
TFLN isn’t ready. Unless HyperLight drastically expanded their production line and figured out their stability issues, they aren’t able to supply the market.
Liobate. No. Luxtelligence and it’s customers. No. Lightium is the new guy. No, years away. Rapid Photonics. Who? Ori-Chip. Maybe if anyone. NanoLN…monopoly on TFLN wafers hence why Luxtelligence and Lightium exist. Eoptolink uses HyperLight’s PICs because their own Chinese suppliers can’t supply…and Eopolink isn’t selling. And why is that…go to the paragraph above.
“The volume will act as a barrier.” LOL for TFLN you mean Markie?
-KCC
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174320206
HyperLight is TFLN's #1 leading company in world!!! Check out HyperLight's latest Development of "gold-box" TFLN modulators which they are proudly showcasing at CLEO next week!!! Too funny!!!
https://cleo24.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=209&shareguid=0C02EFD5-B1E7-126B-A742469AED53E0F4
Hyperlight is showcasing its TFLN GOLD BOX modulator as their PRIZE DEVELOPMENT!!! 0TOO FUNNY!!!!
Hyperlight is supposedly the #1 TFLN company in the world!!!!!
This is where LWLG was about 5 years ago!!!!
here's a sample meeting of a Google/Amazon/Nvidia etc CEO with their Chief Engineer of Photonics
CEO, so what do you think we should use for our true next-gen internet transmissions solution?
ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!!
CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry?
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there
CEO, well I actually know Michael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?
CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
https://youtu.be/sphK5HVDWvA
Folks, see it for yourselves starting at 21:06, LWLG is the hands down WINNER of the TRUE NEXT-GEN competition!!! NOTHING else is even close!!!!
Lying scumbag Shorts do what lying scumbag Shorts do, they LIE!!!
At OFC Lebby showcased 200gbs modulators being mass produced on 200mm Wafers with
1 Perfect Attributes
2 Poling of 1000s devices in a split second in the Foundry PDK process!!!!
Lying scumbag Shorts have posted here 1000s of times this was IMPOSSIBLE!!
AND, on the lab tour 100+ people gave witness to "a constant flow of Wafers" coming from all around the world!!!
PDKs are working perfectly at FOUNDRIES ON 3 CONTINENTS!!!!!
Lebby: We’re not behind. As investors you may look at this and go, well, it’s taking a long time to get to revenue. But are we really behind the curve? I don’t think we are. That’s why I’m excited. I don’t feel that we’re behind. I feel we’re on a threshold of something huge.
LWLG 200gbs Polymer Modulator now being produced at multiple Foundries on 3 Continents including on large 200mm Wafers which support Mass Commercial applications in the Millions of Units, the Timeline has NOT changed, Lebby has LWLG positioned for Customer Acceptance in 2024 with Sampling, and Ramp into 2025, with full blown Mass Commercialization in 2026, remember this matches PERFECTLY with the following
a) Lebby's Long-standing Timeline to Commercialization with Customer Acceptance in 2024 including Sampling Units shown on Lebby SAM SOM guidance given at 2023 ASM
b) The LightCounting Forecast for 800gb/1600Gbs Adoption curve rapidly accelerating from Introduction in 2024
c) Andy Bechtolscheim, founder and chairman of Arista at OFC showing a slide of Polymers HVP (High Volume Production) being in 2026
The ONLY thing that has changed is the level of interest from the giant Tier 1's has SKYROCKETED so much so based on the 2024 OFC demos that Lebby has been forced to pick & choose between the couple dozen Tier 1's clamoring for Lebby's time & attention, Lebby is giving first priority to those Tier 1's that will get LWLG's technology to Ubiquity the fastest!
Lebby's been working with at least SEVEN Foundries PDK's for 2 years now, the latest reports from these Foundries that Investors have gotten from Lebby (including pictures) are,
1) the chips are coming back with OUTSTANDING PERFORMANCE
2) the Yields are EXTREMELY HIGH
Absolutely LOVE this Lebby quote, EO POLYMERS CAN BE EASILY HANDLED IN STANDARD SILICON FABS USING STANDARD PDK’s
Source is ECOC Market Focus October 2-4, 2023 Lebby presentation
https://www.ecocexhibition.com/visit/market-focus/market-focus-2023-timetable/market-focus-session-information/
Also absolutely LOVE this Lebby quote at 11:30 marker he said "our technology fits really uniquely into Silicon Foundries and WE CAN SCALE INTO VOLUME QUITE EASILY AND EFFECTIVELY, and our technology as you can see from the horizontal bar of this graph, we have a very high figure of merit (FOM) which means we have really great metrics in terms of bringing the voltage down to save power, high bandwidth to send lots of information at higher speeds, and to have the technology at a very small size"
Planet MicroCap Showcase: Vancouver 2023
Date: Wednesday, September 6, 2023
Time: 12:30 p.m. Eastern time Webcast Link: https://www.webcaster4.com/Webcast/Page/2986/48806
For the record, I talked to Lebby one-on-one at the ASM and he reiterated how sensitive all the data from Foundries work had become for competitive reasons, and for those who saw the ASM encore performance Lebby gave in Europe the day after the ASM, Lebby actually spent more time discussing how important it was now to keep secrecy on the Foundries progress, but he assured everybody things were doing great, and investors should take note of the output of the chips from these Foundries as their direct evidence of this fact, as Lebby told investors the chips are coming back showing great performance and the Yields have been exceedingly high
LWLG is one of the most UNDERVALUED stocks on Wall Street.
VALUATION & NEAR TERM PROSPECTS:
VALUATION:
LWLG has SUCCEEDED where the INDUSTRY has FAILED for over 40 years!!!! The technology is worth BILLION$$$
If you look at the VWAPS LWLG is undervalued, and based on Developments and IP to-date TODAY the fair valuation should be $1-$2 Billion which is roughly $8 to $17 range
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173919132&txt2find=40%20years
1. SCREENING
How many have valuations of $500m or more and have the HOLY GRAIL of PHOTONICS in-hand today
Answer: just one it's LWLG!!!
2. SHORT POSITION
For now, the company issued 1,453,332 new shares during the 4th quarter. Short interest increased by 89,799 shares bringing the total number of shares owned by investors to 140,503,131.
Institutions that report to Fintel, Nasdaq, and Whale Wisdom increased their ownership by 1,467,119 shares to 32.120,876. Individuals, which includes small institutional investors who are not required to report their ownership, increased their ownership by 76,012 shares to 108,383,018 shares.
In percentage terms, individuals own 92.91%, institutions own 26.17%, and short sellers have supplied 19.08% equaling 100%. In other words, there was very little change in ownership in the 4th quarter.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173954156
3. THE EVIDENCE
1) There are deals under negotiation, and investors now know that these are BIG DEALS because of the additional requirements disclosed of the potential Customers wanted to be assured of
a) Financial strength for a LT relationship
b) ability to not have only a single source for the Perk supply, ie, perhaps another site will be opened by LWLG or perhaps some other arrangements will be made to accommodate these big players!!
2) Foundries Volume Scaling Achieved!! Lebby said "BIG MILESTONE!!"
how many times are Shorts going to keep trying to deceive Longs on this one!!!
here read this post >>
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173959736
3) Reliability/Stability is PROVEN 100% already!! Lebby already stood up at OFC March 2023 and told hundreds of Industry insiders that LWLG's Reliability/Stability had been proven!! And at ECOC 2023 Lebby presented UNDENIABLE proof in his presentation!! And at OFC 2024 Lebby presented the proof of LWLG devices on 200mm large Foundry wafers!!! The data has been absolutely ASTOUNDING!!! here see for yourselves,
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
Of course, that doesn't mean the Google's and Amazon's don't want to see additional data, OR, are they just playing that card to gain BETTER PRICING?
NEAR TERM PROSPECTS:
HUGE HUGE HUGE!!!! Lebby is working on finalizing BIG DEALS with the BIGGEST COMPANIES IN THE WORLD!!!! here
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2024!!
there are 22 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
TFLN the closet competitor (laughable!!!) to-date has NOT been able to scale to volume production at 200gbs in a Foundry, and the #1 TFLN Development company Hyperlight recently told the Industry that it may take 3 more years for TFLN to be scaled to volume in a Foundry
Why LWLG Polymers are the ONLY true Next-Gen SOLUTION!!!
1) the Industry need for a true next-gen internet transmissions solution is great because the growth rate of Data is on a parabolic curve and the TAM today is about $10 Billion growing to about $30 Billion in 2030
2) the Industry has already decided that the next-gen products to for 800gb/1600gb will be delivered using 200gb per lane
3) the ONLY incumbent technology that can deliver 200gbs per lane is InP but it is a major struggle to get there for InP and the power usage is extremely high to do it, and it cannot be extended for generations beyond 800gb/1600gb
4) there are only these several contenders as the next-gen solution, they are Polymers, TFLN, BTO, and InP
5) to-date only LWLG Polymers have proven the ability to scale volume on a 200gbs that has INCREDIBLE attributes and garnished tons of interest from all of the Tier 1's, so much so that Lebby is picking and choosing which Tier 1's to be working with first (limited resources) to get LWLG Polymers to Ubiquity the fastest
6) TFLN is thought to be the only other real contender as a next-gen solution BUT is has many issues which I'll summarize for you here,
a) TFLN is MUCH larger in size than LWG Polymers, and real estate in those tiny little Transceiver boxes is at a PREMIUM)
b) TFLN uses MUCH more power than LWG Polymers, in fact LWLG at sub 1 volt runs directly from CMOS which eliminates the power hungry and expensive Driver chip from the Transceiver (note: The Driver chip can actually cost MORE than the Modulator chip!!)
c) TFLN has MUCH HIGHER Optical losses than LWLG Polymers
d) TFLN needs to be "shoehorned" into an SiPh Foundry, LWLG has "Ease of Integration" into an SiPh Foundry
e) TFLN to-date has NOT been able to scale to volume production at 200gbs in a Foundry, and the #1 TFLN Development company Hyperlight recently told the Industry that it may take 3 more years for TFLN to be scaled to volume in a Foundry
f) TFLN likely cannot be extended for generations beyond 800/1600 while LWLG Polymers have headroom for next generations for at least the next DECADE
7) LWLG 200gbs Polymer Modulator now being produced at multiple Foundries on 3 Continents including on large 200mm Wafers which support Mass Commercial applications in the Millions of Units, the Timeline has NOT changed, Lebby has LWLG positioned for Customer Acceptance in 2024 with Sampling, and Ramp into 2025, with full blown Mass Commercialization in 2026, remember this matches PERFECTLY with the following
a) Lebby's Long-standing Timeline to Commercialization with Customer Acceptance in 2024 including Sampling Units shown on Lebby SAM SOM guidance given at 2023 ASM
b) The LightCounting Forecast for 800gb/1600Gbs Adoption curve rapidly accelerating from Introduction in 2024
c) Andy Bechtolscheim, founder and chairman of Arista at OFC showing a slide of Polymers HVP (High Volume Production) being in 2026
The ONLY thing that has changed is the level of interest from the giant Tier 1's has SKYROCKETED so much so based on the 2024 OFC demos that Lebby has been forced to pick & choose between the couple dozen Tier 1's clamoring for Lebby's time & attention, Lebby is giving first priority to those Tier 1's that will get LWLG's technology to Ubiquity the fastest!!
Here are relevant Q&A from the 2024 ASM,
ASM Q&A: Is the current state of the technology, of the Company’s technology enough for commercialization of product polymer modulators?
Lebby: Well, our current performance is suitable for live trials with the data centers. Another way of saying data centers is what people use today as hyper scaling. I don’t know where that word came from, but yes, our performance is suitable for those companies. We engage with these companies today.
ASM Q&A: Are we achieving an industry average with this brand new technology to displace incumbents?
Lebby:I think we are. We’re not behind. As investors you may look at this and go, well, it’s taking a long time to get to revenue. But are we really behind the curve? I don’t think we are. That’s why I’m excited. I don’t feel that we’re behind. I feel we’re on a threshold of something huge.
Jeunke posted this about Lebby's pivot to slides showing Nvidia's Infiniband on Slides 13 and 14, Lebby is quite calculated in what he presents as being extremely relevant and as Jeunke points out in a recent presentation Nvidia said they would NOT wait for Standards to develop and if you had a Solution to bring it to their attention and they would work with you or buy you out!! here,
In fact if you look at the X axis ( timing) of the NVIDIA roadmap than ( slides 13/14) than it would appear Lightwaves 800 G ( 4 lane x 200G) is clearly positioned in 2024. You may also like to reflect on the fact why Lebby changed his previous ETHERNET slides and used the NVIDIA roadmap and the InfiniBand market requirements? Some will say that this is another carrot. Personally I don’t think so, just look at the comment alongside the Nvidia graph. I participated in a Photondelta event a few years ago where I heard the NVIDIA VP for R&D challenging the audience to come up with more bandwidth. In fact he said:” if you have a solution contact me after the meeting. If you have a solution we may even buy out your company “, That was in 2018. I think listen to Lebby and BOD, these are some of the most experienced people in the industry. I don’t think there is any messenger here with similar reputation, know how or experience. So, just listen to the company.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174511230
Conclusion: There is NO competition that comes even close to LWLG Polymers as the solution to true next-generation and future generations of Internet transmissions!!
Ayars Lab, The company manufactured approximately 10,000 optical chiplets in 2023 and expects similar volumes this year.
sound familiar? sounds much like the volumes LWLG is projecting as Samples in 2024 of 7900 Modulators as it Ramps in 2025 and is set for its Mass Commercialization 2026, now if LWLG also has Ayar project under NDA, just imagine what happens to LWLG's ramp in 2025/2026!!
https://www.gazettabyte.com/home/2024/5/18/has-the-era-of-co-packaged-optics-finally-arrived.html
Direct evidence connection between GlobalFoundries, (Intel)Ayar Labs, LWLG EO polymers. Note that LWLG is not referenced, however Carsten Eschenbaum, CTO of SilOriX, and Christian Koos are listed authors on the paper. We all know the connection to LWLG and SilOriX and Christian Koos.
White Paper - Hybrid Integration of Exotic Materials in CMOS Platform
Deniz Onural is at Boston University in their Silicon Photonics Lab. Hayk Gevorgyan is a Senior Photonics Device Engineer at Ayar Labs. Milos Popovic is also at Boston University and a co-founder at Ayar Labs.
This paper describes the BEOL process for integrating EO polymers in ring modulators on wafers supplied by GlobalFoundries.
Title: “Towards Hybrid Integration of Exotic Materials in an Electronic-Photonic CMOS Platform via Substrate Removal”
Abstract: “We demonstrate direct access to the silicon device layer of a monolithic CMOS electronics-photonics platform with a full-digital back-end-metal stack, in post-fabrication at die level, allowing the integration of functional materials (e.g. into slot waveguides).”
Paper requires payment to view. For those extra curious who want to read the details, go ahead and support Optica by purchasing the white paper.
-KCC
https://opg.optica.org/abstract.cfm?uri=CLEO_SI-2023-STh3H.4
Reddit link >> https://www.reddit.com/r/LWLG/comments/154a4rw/white_paper_hybrid_integration_of_exotic/
LWLG to the rescue of Intel/Ayar/GF!!! Today, silicon microring modulators are perceived as promising to implement such links; however, they provide limited bandwidth and need thermal stabilization systems.
LWLG has NO COMPETITION!!!!
NOTHING EVEN CLOSE!!!!
Intel/Ayar MRR fatal issues solved by LWLG Polymers, just read posts #133274_#133275_#133276 and understand the following about the position LWLG is currently in, here to summarize for you,
#133274 Intel/Ayar for many years now have focused on their Next-Gen Photonics solution using silicon based MRR's, but there is an inherent problem with this technology, temperature control, which cannot be solved, at least not economically, read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251782
#122275 LWLG Polymers CAN solve the issues that Intel/Ayars cannot, therefore it is a strong probability that Intel/Ayar and LWLG are working together under NDA's currently, read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251787
#133276 Intel in 2022 after a handful of years selling Photonics devices achieved RECORD unit volume of about 2 million units!! Here KCC points out that LWLG can achieve these same volumes, perhaps even more, with one small Foundry & one Customer!! read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251790
worth another LQQk, slides 13/14. There is NVIDIA written all over it. InfiniBand is 90% NVIDIA. NVIDIA is currently driving future industry hardware choices and all the big guys are in ‘catch up’ mode.
Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”.
Let me add. You believe Lebby and we are on the runway to the moon, or Lebby is the biggest con man in the world, My choice: I believe Lebby
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174518590
The 800X Quantum switch of 115.2 Tbps announced in March 2024 will have 200 G electrical lanes and would be able to connected to 4x 200 G transceivers ( 800 G) or eventually 8x 200G ( 1600G). I know only one company being able to deliver such 200G per lane option. NVIDIA would leapfrog the competition and be the first to offer a full 800G/1600 G all encompassing solution from GPU into the datacenter and combine its monopolistic world class GPU’s with far the best AI datacenter solution in the world, leaving the rest scratching their heads.No doubt a similar Spectrum solution will be planned for the 2025 and I assume the rest of the ‘ Ethernet industry cooperation’ which is still defining it ‘ standard’ will need to follow soon after.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174537948
I believe anyone with half a brain, so this excludes teddybear, punkipoo, and the "fake Longs" who are such big liars they try to make their user ID's "sound like" they would be Longs, would see that the quote on Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”. was from Nvidia, very likely from Ashkan Seyedi NVIDIA, Principal Silicon Photonics Products who is connected on LinkedIn to Atikem of LWLG presumably working on the upcoming LWLG Customer Agreement with Nvidia
PECC October 22-23 Optica Photonic-Enabled Cloud Computing Industry Summit hosted by Synopsys has a TOP SHELF speaker list, check it out here
https://www.optica.org/events/industry_events/2024/pecc/program_speakers/
Investors keep in mind that Synopsys has been posting on LinkedIn about LWLG!!
Synopsys AGAIN posting about LWLG on LinkedIn!!
Synopsys Photonic Solutions
10,715 followers
Lightwave Logic, Inc. and Advanced Micro Foundry(AMF) have announced a collaboration to develop state-of-the-art polymer slot modulators using AMF's silicon photonics platform. This partnership has achieved record-breaking performance with modulators operating at sub-1V drive and data rates of 200Gbps PAM4, ideal for 800Gbps and 1.6T pluggable transceivers. The collaboration leverages Lightwave Logic's electro-optic polymers and AMF's standard manufacturing process on 200-mm wafers, marking a significant milestone in integrated photonics. This development aims to meet the growing demand for optical connectivity in large generative AI computing clusters.
https://ow.ly/BFEp50SiujM
#Photonics #SiliconPhotonics
see the original Synopsys post here
https://www.linkedin.com/feed/update/urn:li:activity:7208347797178236928/
and more times here
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsys also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsys Foundry Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor press at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
Don’t forget Lebby working on "Multi-Level & Cross Functional Engagements"
most people do NOT understand how deeply embedded Lebby is throughout the entire Photonics Industry Food Chain, what this slide is telling investors that when the "Big Silicon Foundries" LWLG is working with (see SNN interview) there is PULL from the End Users which are the Amazon, Google, etc of the world, and the Packaging partners are likely the large Tier 1 Networkers, so when don't be surprised when the market halts news pending and there are SEVERAL large players involved including Foundries & Tier 1 Networkers
Here are some of the "Big Silicon Foundries" that produce on 200mm wafers:
(the bolded Foundries are the most likely as they have been linked to LWLG already)
GlobalFoundries
Hua Hong Semiconductor
Samsung
SK Hynix
SkyWater Technology
SMIC (Semiconductor Manufacturing International Corporation)
Tower Semiconductor
TSMC (Taiwan Semiconductor Manufacturing Company)
UMC (United Microelectronics Corporation)
Vanguard International Semiconductor
X-Fab
Lebby gave a Keynote at OFC 2024 about "Heterogeneous Integration", here AMAT speaks about heterogeneous integration as well as saying that "materials science and materials engineering are increasingly important to the industry's road map", AMAT has been discussed here many times as a Tier 1 very likely having an NDA partnership with LWLG currently, here
A few little tidbits from the AMAT earnings call. Recall that at multiple industry events, Robert Blum has been seen pulling Lebby aside for private conversations.
“Key inflections that underpin the semiconductor road map are enabled by Applied Materials and will support our ongoing outperformance as next-generation chip technologies move into high-volume production. In addition, the complexity of implementing the industry's road map and bringing new semiconductor technologies to market is driving earlier, deeper, and broader collaboration with customers, as well as supporting double-digit growth for our service business.”
“Looking further ahead, we see opportunities for this business to double again as heterogeneous integration is more widely adopted beyond the AI data center, and we introduce new products that expand our served market.”
“Materials science and materials engineering are increasingly important to the industry's road map. Applied has invested early to develop a broad, unique, and connected portfolio of materials engineering solutions that are critical to enable major semiconductor inflections, from AI high-performance computing to ICAPS edge computing.”
https://www.fool.com/earnings/call-transcripts/2024/05/16/applied-materials-amat-q2-2024-earnings-call-trans/
Ok folks, AMAT has been spoken about many times on this board as being a likely potential partner/buyer of LWLG's technology, KCC added this interesting comment for color from what he had personally witnessed in October 2023 at the PECC conference,
Very good. There’s been long running speculation that AMAT is involved somehow. Personally I think AMAT is a company who would possibly acquire LWLG.
At Optica PECC last fall, Robert Blum (former head of Silicon Photonics at Intel, now at AMAT) pulled Lebby from a table and they spent a fair amount of time talking about something that must have been private.
https://www.reddit.com/r/LWLG/comments/1ctz0o0/daily_trading_action_and_general_discussion/?share_id=2EIv0l-jrd8vK5LesM41j&utm_content=1&utm_medium=android_app&utm_name=androidcss&utm_source=share&utm_term=1
Lightwave Logic has announced that Chairman and Chief Executive Officer Dr. Michael Lebby discussed the latest world-class results for the company’s 200 Gbps heterogeneous polymer/silicon photonic modulator at a record low drive voltage at the 2024 Optical Fiber Conference (OFC) in San Diego, California.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174205574&txt2find=heterogeneous%20integration
LWLG's TOP Competition is TFLN which is LAUGHABLE!!!
TFLN? here worth another LQQk,
TFLN isn’t ready. Unless HyperLight drastically expanded their production line and figured out their stability issues, they aren’t able to supply the market.
Liobate. No. Luxtelligence and it’s customers. No. Lightium is the new guy. No, years away. Rapid Photonics. Who? Ori-Chip. Maybe if anyone. NanoLN…monopoly on TFLN wafers hence why Luxtelligence and Lightium exist. Eoptolink uses HyperLight’s PICs because their own Chinese suppliers can’t supply…and Eopolink isn’t selling. And why is that…go to the paragraph above.
“The volume will act as a barrier.” LOL for TFLN you mean Markie?
-KCC
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174320206
HyperLight is TFLN's #1 leading company in world!!! Check out HyperLight's latest Development of "gold-box" TFLN modulators which they are proudly showcasing at CLEO next week!!! Too funny!!!
https://cleo24.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=209&shareguid=0C02EFD5-B1E7-126B-A742469AED53E0F4
Hyperlight is showcasing its TFLN GOLD BOX modulator as their PRIZE DEVELOPMENT!!! TOO FUNNY!!!!
Hyperlight is supposedly the #1 TFLN company in the world!!!!!
This is where LWLG was about 5 years ago!!!!
here's a sample meeting of a Google/Amazon/Nvidia etc CEO with their Chief Engineer of Photonics
CEO, so what do you think we should use for our true next-gen internet transmissions solution?
ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!! And Hyperlight the #1 TFLN Development company said in about 3 MORE YEARS they could possibly get this done!!!
CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry?
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there
CEO, well I actually know Michael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?
CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!
Oh and one more thing, LWLG's technology has HEADROOM for at least a decade of future generations!!
TFLN does NOT!!!
Here from the 2023 ASM Lebby quoted a Foundry as saying the following "At our Foundry we are worried about an investment into TFLN, it may only be for one generation, but with (LWLG) Polymers our investment would be worthwhile and a better ROI"
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
Spekkie said, When I asked whether the products were ready and if any issues were outstanding, he clearly said that everything was ready (stability, scaling etc) and the time line was fully intact and there were no changes to that. Tier 1’s are very interested and the number of them significantly increased after OFC demo’s.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174302051
Exactly!! meanwhile Longs are being throttled here, I can't post much while Shorts and FAKE Longs mudsling at me and other Longs here NONSTOP!!!
Fact is LWLG has multiple products already, they have multiple versions of it's Perk Polymer, the latest being Perk 6, now available for Licensing, in addition they have a 200Gb modulator that is now capable of being produced at several Foundries and on large 200mm Wafers including the Poling being performed at Wafer scale something Shorts said was impossible, Lebby has told investors that Customers could use these modulators in quantities of 4 per Transceiver device to produce an 800Gbs Transceiver currently, but the preference of the large Transceiver companies (Cisco etc) would be to use the single chip modulator array (4x200) which is still under construction but Lebby announced publicly at PECC that it would be ready sometime in 2024, but the individual modulators would be used in Sampling now while the single chip modulator array (4x200) would be used in mass commercialization, Lebby is still on track with his Timeline of Customer Acceptance and Ramp in 2024 and has not backed down on his SAM/SOM guidance, Shorts are the LYING SCAMMERS period!!
Remember that it is because of the following two main reasons that Tier 1 interest has skyrocketed in recent months
1) the early 2024 "Big Milestone" achieved of success in Mass Production of LWLG modulators on Foundries large 200mm Wafers
2) the INCREDIBLE reliability/stability data collected/presented at ECOC 2023 and then even more so at OFC in March 2024
Investors have learned INCREDIBLE Developments in 2024 so far!!! here is a summary of things investors have learned form OFC in March 2024, and Lebby's LD Micro Interview in April, as well as Lebby's Belgium visit/presentations in April
1) Lebby has LWLG modulators being implemented at SEVERAL Foundries on large 200mm Wafers now beginning in early 2024!! Lebby declared it a "BIG MILESTONE"!!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174278606
2) Lebby has achieved Volume Scale Poling on 200mm Wafers!!! (successfully able to Pole Thousands of Devices at a time!!)
3) Lebby's LWLG team of seven completed demonstrations at OFC to over 20 potential Customers!! NDA's now estimated at 40 companies
4) the response to the OFC demos has been so overwhelming that Lebby claims the Tier 1's "being PULLED along" has become more like "being dragged along" (a good problem to have!!!)
Spekkie posted this
, Important take away we are working with multiple tier ones, tripled since a few weeks after OFC , wow we are golden
5) The Customer Funnel slide is updated and now showing greater than 20 Prospects and greater than 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so about DOUBLED since the ASM!!!!
6) at OFC Google had a shout out to (LWLG) EOP on their slide for hetero integration.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174276893
7) KCC reported "the transceiver partner is a giant company that is dedicating a lot of their own resources to LWLG’s development."
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174279401
8) Lebby also showcased that LWLG's Perk 6 is NOW ready and available for Licensing !!!
9) Lebby reported that 3rd party ETH Zurich set world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!! This ensures LWLG ALREADY capable to meet the future Roadmap
10) The response from the Tier 1's is so overwhelming such that Lebby is 100% focused on SEVERAL Tier 1's who are battling it out for Lebby/LWLG's time and attention to bring 4x200 powered Transceivers to market ASAP!!
Folks this is a Cinderella story 40 years in the making!!!
For OVER 40 YEARS the Industry has tried UNSUCCESSFULLY!!
IBM, Intel, Boeing, Lockheed Martin, DuPont, AT&T Bell Labs, Honeywell, Motorola, GE, HP, 3M, and others in addition to numerous Universities and U.S. Government Agencies, DARPA, DOD, etc have all attempted to produce high-performance, high-stability electro-optic polymers
The Industry combined has spent literally in the Billions R&D $$ UNSUCCESSFULLY trying to do what LWLG has done!
LWLG's technology has been successfully developed in much less time than what the Industry spent, and at a cost less than 5% of what the Industry spent screwing around with unstable fragile molecules for 40 years!
RIDDLE ME THIS >> WHY WOULD THE INDUSTRY SPEND BILLIONS AND BILLIONS OF $$ ON SOMETHING THEY DIDN'T DESPERATELY WANT???????
60k volume down 6% low volume high frequency MANIPULATION AGAIN!!! It is SO OBVIOUS the games they play to induce fear selling by Longs!!!
worth another LQQk, slides 13/14. There is NVIDIA written all over it. InfiniBand is 90% NVIDIA. NVIDIA is currently driving future industry hardware choices and all the big guys are in ‘catch up’ mode.
Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”.
Let me add. You believe Lebby and we are on the runway to the moon, or Lebby is the biggest con man in the world, My choice: I believe Lebby
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174518590
The 800X Quantum switch of 115.2 Tbps announced in March 2024 will have 200 G electrical lanes and would be able to connected to 4x 200 G transceivers ( 800 G) or eventually 8x 200G ( 1600G). I know only one company being able to deliver such 200G per lane option. NVIDIA would leapfrog the competition and be the first to offer a full 800G/1600 G all encompassing solution from GPU into the datacenter and combine its monopolistic world class GPU’s with far the best AI datacenter solution in the world, leaving the rest scratching their heads.No doubt a similar Spectrum solution will be planned for the 2025 and I assume the rest of the ‘ Ethernet industry cooperation’ which is still defining it ‘ standard’ will need to follow soon after.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174537948
I believe anyone with half a brain, so this excludes teddybear, punkipoo, and the "fake Longs" who are such big liars they try to make their user ID's "sound like" they would be Longs, would see that the quote on Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”. was from Nvidia, very likely from Ashkan Seyedi NVIDIA, Principal Silicon Photonics Products who is connected on LinkedIn to Atikem of LWLG presumably working on the upcoming LWLG Customer Agreement with Nvidia
Robert, yes but do you remember this,
Announced by Tencent and Spectra7 at
Optinet Conference in Beijing on June 13,
2019
• Members will include a complementary mix
of partners spanning the entire supply chain
for data centers.
• Goals:
– Accelerate Adoption of Active Copper
Cable technology
– Create a Standard for Multi-Source
Cable Supply
– Support All Cable Form Factors
Tencent and Spectra7 Launch CRX Consortium
Volume Deployment of CRX Interconnects enabled by
Spectra7 technology expected in 2nd Half of 2019
A major China Hyperscaler Data Center
Operator has selected Spectra7 Active Copper
Cable technology to deploy in production
volumes starting in the second half of 2019
Key achievements and expected milestones include:
- Ten new customer design-ins in Q1’19, for a total of 55
Google just had a shout out to EOP(LWLG) on a slide for hetero integration. LinkedIn post from APC.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174108464
This is the google slide! (middle picture is of EOP slot modulator)
https://www.linkedin.com/posts/advanced-photonics-coalition_fiberoptics-technology-innovation-activity-7178065757874913281-L2Oo?utm_source=share&utm_medium=member_ios
Modulators with low driving voltage, high bandwidth, and low loss.
They are also showing the same wafer
And “organic Material” the same picture on page 15 from LWLG
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/1bd96423-05f6-76f0-82d8-2a80d7a40691?origin=2
I can’t believe my eyes!
It is happening…
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174111281
with Cisco, Intel, Google, Ciena as LWLG Customers I wouldn't want to be stuck holding the Old Maid "Short" card when Lebby drops additional Licensing and Tech Transfer Agreements in 2024!!
there are 21 Million++ Shorts holding that Old Maid card currently!!
TWST: Do you see your ideal customers like Cisco or whoever makes these particular modulation devices? Are they the ones who are going to buy?
Dr. Lebby: Yes, they will — a lot of these larger companies. The Ciscos of this world as well as the Intels and the Cienas, these types of players, Googles and others. A lot of these folks are actually vertically integrated. So they actually do a lot of the things themselves. And some of the parts they send out to foundries or to contract manufacturers.
https://www.reddit.com/r/LWLG/comments/15twmqr/interview_with_dr_lebby_august_17_2023/
Folks, these are pretty bold statements by Lebby, and Lebby is one of the top Luminaries of the photonics Industry, personally I would NOT want to bet against him!!!
Broadcom Inc., Broadex Technologies Co., Ltd., Ciena Corporation, Cisco Systems, Inc., Coherent Corp., Enablence, Hewlett Packard Enterprise Development LP, Huawei Technologies Co., Ltd., Infinera Corporation, Intel Corporation, Lightwave Logic, Inc., LioniX International, Lumentum Holdings, Inc., MACOM, NokiaTechnologies, Q.ANT GmbH, TE Connectivity, Teem Photonics, VLC Photonics S.L
Space Exploration Investment Drives Photonic Integrated Circuits Market to Reach US$ 98.7 Billion by 2031: TMR Study
https://finance.yahoo.com/news/space-exploration-investment-drives-photonic-113000427.html
LWLG is the KEY to this project!!!
Ayars Lab, The company manufactured approximately 10,000 optical chiplets in 2023 and expects similar volumes this year.
sound familiar? sounds much like the volumes LWLG is projecting as Samples in 2024 of 7900 Modulators as it Ramps in 2025 and is set for its Mass Commercialization 2026, now if LWLG also has Ayar project under NDA, just imagine what happens to LWLG's ramp in 2025/2026!!
https://www.gazettabyte.com/home/2024/5/18/has-the-era-of-co-packaged-optics-finally-arrived.html
Direct evidence connection between GlobalFoundries, (Intel)Ayar Labs, LWLG EO polymers. Note that LWLG is not referenced, however Carsten Eschenbaum, CTO of SilOriX, and Christian Koos are listed authors on the paper. We all know the connection to LWLG and SilOriX and Christian Koos.
White Paper - Hybrid Integration of Exotic Materials in CMOS Platform
Deniz Onural is at Boston University in their Silicon Photonics Lab. Hayk Gevorgyan is a Senior Photonics Device Engineer at Ayar Labs. Milos Popovic is also at Boston University and a co-founder at Ayar Labs.
This paper describes the BEOL process for integrating EO polymers in ring modulators on wafers supplied by GlobalFoundries.
Title: “Towards Hybrid Integration of Exotic Materials in an Electronic-Photonic CMOS Platform via Substrate Removal”
Abstract: “We demonstrate direct access to the silicon device layer of a monolithic CMOS electronics-photonics platform with a full-digital back-end-metal stack, in post-fabrication at die level, allowing the integration of functional materials (e.g. into slot waveguides).”
Paper requires payment to view. For those extra curious who want to read the details, go ahead and support Optica by purchasing the white paper.
-KCC
https://opg.optica.org/abstract.cfm?uri=CLEO_SI-2023-STh3H.4
Reddit link >> https://www.reddit.com/r/LWLG/comments/154a4rw/white_paper_hybrid_integration_of_exotic/
LWLG to the rescue of Intel/Ayar/GF!!! Today, silicon microring modulators are perceived as promising to implement such links; however, they provide limited bandwidth and need thermal stabilization systems.
LWLG has NO COMPETITION!!!!
NOTHING EVEN CLOSE!!!!
Intel/Ayar MRR fatal issues solved by LWLG Polymers, just read posts #133274_#133275_#133276 and understand the following about the position LWLG is currently in, here to summarize for you,
#133274 Intel/Ayar for many years now have focused on their Next-Gen Photonics solution using silicon based MRR's, but there is an inherent problem with this technology, temperature control, which cannot be solved, at least not economically, read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251782
#122275 LWLG Polymers CAN solve the issues that Intel/Ayars cannot, therefore it is a strong probability that Intel/Ayar and LWLG are working together under NDA's currently, read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251787
#133276 Intel in 2022 after a handful of years selling Photonics devices achieved RECORD unit volume of about 2 million units!! Here KCC points out that LWLG can achieve these same volumes, perhaps even more, with one small Foundry & one Customer!! read this to better understand,
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=171251790
We’re working with the biggest transceiver companies in the world"
Keep in mind, Lebby is working on multi-year deals, with the type of Tier 1s investors know Lebby is in negotiations with, there could easily be large up-front monies, $50 million or more is realistic, don't think it's not!!
LWLG is a once in a lifetime opportunity!!
The quotes are from the LWLG executive and should be nearly exact to what was said. While the conversation was not recorded, detailed notes were taken and the messages should be very close, if not exactly what was said.
LWLG is “close on deals”. They have "calls all week discussing the deals". Just before the conversation, the executive was on a call with a "potential counterparty to a deal".
This executive acknowledged the only thing that will move the stock price at this point is closing deals.
"I am more than confident we’ll close on probably more than one Tier 1 deal this year."
Within the next month, engineering teams from three separate companies will be visiting LWLG’s facility.
When asked if the T1 announcements will have a name attached, the response was that they "would love to be able to". Based on the NDA’s, they "can’t use a counterparty’s name without its permission". “The argument they make is that they are trying to gain a competitive advantage.”
When asked directly if they are working with NVIDIA the response was, “Let’s put it this way. Anyone not trying to work with NVIDIA is a fool and I’m no fool. What’s the old saying? I can neither confirm nor deny that we are working with NVIDIA.”
“We’re working with the biggest transceiver companies in the world.”
“Amazon wants warrants from companies to sell to them. They eat their young. I said that to a guy during a meeting – you eat your young. He just smirked.”
I will not disclose the identity of this person. Do not ask. Do not assume.
https://www.reddit.com/r/LWLG/comments/1dad4n6/a_quick_message/
I've been adding shares since the ASM as Lebby told investors nothing had changed!! The long-standing Timeline to Commercialization has been 2024 for Customer Acceptance and Ramp into 2025 with full blown Mass Commercialization in 2026!!!
Shorts are LYING SCUMBAGS and will say LITERALLY ANYTHING to get Longs to sell their shares!!! They are criminals who worship their underworld gods of manipulation!!!
Synopsys AGAIN posting about LWLG on LinkedIn!!
Synopsys Photonic Solutions
10,715 followers
Lightwave Logic, Inc. and Advanced Micro Foundry(AMF) have announced a collaboration to develop state-of-the-art polymer slot modulators using AMF's silicon photonics platform. This partnership has achieved record-breaking performance with modulators operating at sub-1V drive and data rates of 200Gbps PAM4, ideal for 800Gbps and 1.6T pluggable transceivers. The collaboration leverages Lightwave Logic's electro-optic polymers and AMF's standard manufacturing process on 200-mm wafers, marking a significant milestone in integrated photonics. This development aims to meet the growing demand for optical connectivity in large generative AI computing clusters.
https://ow.ly/BFEp50SiujM
#Photonics #SiliconPhotonics
see the original Synopsis post here
https://www.linkedin.com/feed/update/urn:li:activity:7208347797178236928/
PECC October 22-23 Optica Photonic-Enabled Cloud Computing Industry Summit hosted by Synopsis has a TOP SHELF speaker list, check it out here
https://www.optica.org/events/industry_events/2024/pecc/program_speakers/
Investors keep in mind that Synopsis has been posting on LinkedIn about LWLG!!
The article Synopsis Photonics Solutions posted on LinkedIn was from the PIC Magazine article by Michael Lebby here
https://www.linkedin.com/posts/synopsysphotonicsolutions_article-by-michael-lebby-ceo-lightwave-activity-7181893534705201153-QcJ2/
Synopsys reposted another Lightwave Logic article this morning. Quite interesting that a $90B company has posted about them on more than 1 occasion this week.
https://www.linkedin.com/posts/synopsysphotonicsolutions_200-gbps-heterogeneous-polymersilicon-photonic-activity-7183358130699870208-YQ_U
Synopsis also reposted the article below this morning. Some of the language in the Global Foundries portion of the article seems to resonate with me.
https://www.synopsys.com/photonic-solutions/e-news/2024-march.html#gf
Just going to put this here. Synopsis Foundy Spotlight: GF Fotonix
"Roadmap Solution (excerpt)
The GF Fotonix™ technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G solutions. Plans are in place to support 200G solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future." (LWLG Polymers)
Synopsys has been at multiple LWLG hosted/attended conferences recently, one of the directors was at the San Francisco VIP conference Lebby hosted earlier in the year, they are definitely at the very least collaborating (GFS too)
Just a guess here/speculating:
GFS, Tower/intel, Nokia among a couple others were likely the earlier leads based on white papers. Google a lead based on their recent presentation(not sure if they were old or new) Nvidia based on a repost on LinkedIn I think they’re at least aware but haven’t seen much public connection. I’m sure there’s a few I’m not remembering but the rest I don’t remember any obvious connections. Smart photonics was another one I’ve heard of I think KC referenced them.
In the investor pres at least 5-6 of the logos they show have referenced us in one way or another via whitepapers, presentations, reposts or interview mentions. The rest are quietly looking into this I’m sure
One key piece I liked is he mentioned they are less interested in tech transfer deals, likely only doing those if the 3rd party wants to use it for an auxiliary use such as Lidar which is out of their main focus. Means more money for us long term, likely going a very similar route business wise as OLED, mostly licensing type of deals.
https://www.reddit.com/r/LWLG/comments/1bzltei/daily_trading_action_and_general_discussion/?
actually the quick warrant exchange would only have only resulted in 2 cents CAD of the 10 cents CAD paid for the Unit, so it would have left the Share at an adjusted cost of 8 cents CAD (not free!)
ECOC Market Focus Topics!! Polymers RULE!! Check it out!!!
September 23-25, 2024
Components/ICs/PICs/fiber
1. Classic component performance (discrete and
integrated photonics), ROADMs
2. High speed, low power modulators (polymer, TFLN,
plasmonic, Silicon, InP etc.)
3. Tunable and fixed wavelength devices
4. Future PIC trends, roadmaps, complexity with InP,
silicon photonics, polymers
5. VCSELs: high speed, arrays, smart pixels
6. Electronics (and associated modulation techniques
– PAM, QPSK, QAM etc.) for lightwave (DSPs, ASICs,
computational processing)
7. Advanced packaging trends (low cost, high speed,
volume driven, CoB, FC, interposers) and associated
testing techniques
https://www.ecocexhibition.com/wp-content/uploads/ECOC2024-Market-Focus-Call-For-Speakers.pdf
Lebby gave a Keynote at OFC 2024 about "Heterogeneous Integration", here AMAT speaks about heterogeneous integration as well as saying that "materials science and materials engineering are increasingly important to the industry's road map", AMAT has been discussed here many times as a Tier 1 very likely having an NDA partnership with LWLG currently, here
A few little tidbits from the AMAT earnings call. Recall that at multiple industry events, Robert Blum has been seen pulling Lebby aside for private conversations.
“Key inflections that underpin the semiconductor road map are enabled by Applied Materials and will support our ongoing outperformance as next-generation chip technologies move into high-volume production. In addition, the complexity of implementing the industry's road map and bringing new semiconductor technologies to market is driving earlier, deeper, and broader collaboration with customers, as well as supporting double-digit growth for our service business.”
“Looking further ahead, we see opportunities for this business to double again as heterogeneous integration is more widely adopted beyond the AI data center, and we introduce new products that expand our served market.”
“Materials science and materials engineering are increasingly important to the industry's road map. Applied has invested early to develop a broad, unique, and connected portfolio of materials engineering solutions that are critical to enable major semiconductor inflections, from AI high-performance computing to ICAPS edge computing.”
https://www.fool.com/earnings/call-transcripts/2024/05/16/applied-materials-amat-q2-2024-earnings-call-trans/
Ok folks, AMAT has been spoken about many times on this board as being a likely potential partner/buyer of LWLG's technology, KCC added this interesting comment for color from what he had personally witnessed in October 2023 at the PECC conference,
Very good. There’s been long running speculation that AMAT is involved somehow. Personally I think AMAT is a company who would possibly acquire LWLG.
At Optica PECC last fall, Robert Blum (former head of Silicon Photonics at Intel, now at AMAT) pulled Lebby from a table and they spent a fair amount of time talking about something that must have been private.
https://www.reddit.com/r/LWLG/comments/1ctz0o0/daily_trading_action_and_general_discussion/?share_id=2EIv0l-jrd8vK5LesM41j&utm_content=1&utm_medium=android_app&utm_name=androidcss&utm_source=share&utm_term=1
Lightwave Logic has announced that Chairman and Chief Executive Officer Dr. Michael Lebby discussed the latest world-class results for the company’s 200 Gbps heterogeneous polymer/silicon photonic modulator at a record low drive voltage at the 2024 Optical Fiber Conference (OFC) in San Diego, California.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174205574&txt2find=heterogeneous%20integration
TFLN the closet competitor (laughable!!!) to-date has NOT been able to scale to volume production at 200gbs in a Foundry, and the #1 TFLN Development company Hyperlight recently told the Industry that it may take 3 more years for TFLN to be scaled to volume in a Foundry
Why LWLG Polymers are the ONLY true Next-Gen SOLUTION!!!
1) the Industry need for a true next-gen internet transmissions solution is great because the growth rate of Data is on a parabolic curve and the TAM today is about $10 Billion growing to about $30 Billion in 2030
2) the Industry has already decided that the next-gen products to for 800gb/1600gb will be delivered using 200gb per lane
3) the ONLY incumbent technology that can deliver 200gbs per lane is InP but it is a major struggle to get there for InP and the power usage is extremely high to do it, and it cannot be extended for generations beyond 800gb/1600gb
4) there are only these several contenders as the next-gen solution, they are Polymers, TFLN, BTO, and InP
5) to-date only LWLG Polymers have proven the ability to scale volume on a 200gbs that has INCREDIBLE attributes and garnished tons of interest from all of the Tier 1's, so much so that Lebby is picking and choosing which Tier 1's to be working with first (limited resources) to get LWLG Polymers to Ubiquity the fastest
6) TFLN is thought to be the only other real contender as a next-gen solution BUT is has many issues which I'll summarize for you here,
a) TFLN is MUCH larger in size than LWG Polymers, and real estate in those tiny little Transceiver boxes is at a PREMIUM)
b) TFLN uses MUCH more power than LWG Polymers, in fact LWLG at sub 1 volt runs directly from CMOS which eliminates the power hungry and expensive Driver chip from the Transceiver (note: The Driver chip can actually cost MORE than the Modulator chip!!)
c) TFLN has MUCH HIGHER Optical losses than LWLG Polymers
d) TFLN needs to be "shoehorned" into an SiPh Foundry, LWLG has "Ease of Integration" into an SiPh Foundry
e) TFLN to-date has NOT been able to scale to volume production at 200gbs in a Foundry, and the #1 TFLN Development company Hyperlight recently told the Industry that it may take 3 more years for TFLN to be scaled to volume in a Foundry
f) TFLN likely cannot be extended for generations beyond 800/1600 while LWLG Polymers have headroom for next generations for at least the next DECADE
7) LWLG 200gbs Polymer Modulator now being produced at multiple Foundries on 3 Continents including on large 200mm Wafers which support Mass Commercial applications in the Millions of Units, the Timeline has NOT changed, Lebby has LWLG positioned for Customer Acceptance in 2024 with Sampling, and Ramp into 2025, with full blown Mass Commercialization in 2026, remember this matches PERFECTLY with the following
a) Lebby's Long-standing Timeline to Commercialization with Customer Acceptance in 2024 including Sampling Units shown on Lebby SAM SOM guidance given at 2023 ASM
b) The LightCounting Forecast for 800gb/1600Gbs Adoption curve rapidly accelerating from Introduction in 2024
c) Andy Bechtolscheim, founder and chairman of Arista at OFC showing a slide of Polymers HVP (High Volume Production) being in 2026
The ONLY thing that has changed is the level of interest from the giant Tier 1's has SKYROCKETED so much so based on the 2024 OFC demos that Lebby has been forced to pick & choose between the couple dozen Tier 1's clamoring for Lebby's time & attention, Lebby is giving first priority to those Tier 1's that will get LWLG's technology to Ubiquity the fastest!!
Here are relevant Q&A from the 2024 ASM,
ASM Q&A: Is the current state of the technology, of the Company’s technology enough for commercialization of product polymer modulators?
Lebby: Well, our current performance is suitable for live trials with the data centers. Another way of saying data centers is what people use today as hyper scaling. I don’t know where that word came from, but yes, our performance is suitable for those companies. We engage with these companies today.
ASM Q&A: Are we achieving an industry average with this brand new technology to displace incumbents?
Lebby:I think we are. We’re not behind. As investors you may look at this and go, well, it’s taking a long time to get to revenue. But are we really behind the curve? I don’t think we are. That’s why I’m excited. I don’t feel that we’re behind. I feel we’re on a threshold of something huge.
Jeunke posted this about Lebby's pivot to slides showing Nvidia's Infiniband on Slides 13 and 14, Lebby is quite calculated in what he presents as being extremely relevant and as Jeunke points out in a recent presentation Nvidia said they would NOT wait for Standards to develop and if you had a Solution to bring it to their attention and they would work with you or buy you out!! here,
In fact if you look at the X axis ( timing) of the NVIDIA roadmap than ( slides 13/14) than it would appear Lightwaves 800 G ( 4 lane x 200G) is clearly positioned in 2024. You may also like to reflect on the fact why Lebby changed his previous ETHERNET slides and used the NVIDIA roadmap and the InfiniBand market requirements? Some will say that this is another carrot. Personally I don’t think so, just look at the comment alongside the Nvidia graph. I participated in a Photondelta event a few years ago where I heard the NVIDIA VP for R&D challenging the audience to come up with more bandwidth. In fact he said:” if you have a solution contact me after the meeting. If you have a solution we may even buy out your company “, That was in 2018. I think listen to Lebby and BOD, these are some of the most experienced people in the industry. I don’t think there is any messenger here with similar reputation, know how or experience. So, just listen to the company.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174511230
Conclusion: There is NO competition that comes even close to LWLG Polymers as the solution to true next-generation and future generations of Internet transmissions!!
worth another LQQk, slides 13/14. There is NVIDIA written all over it. InfiniBand is 90% NVIDIA. NVIDIA is currently driving future industry hardware choices and all the big guys are in ‘catch up’ mode.
Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”.
Let me add. You believe Lebby and we are on the runway to the moon, or Lebby is the biggest con man in the world, My choice: I believe Lebby
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174518590
The 800X Quantum switch of 115.2 Tbps announced in March 2024 will have 200 G electrical lanes and would be able to connected to 4x 200 G transceivers ( 800 G) or eventually 8x 200G ( 1600G). I know only one company being able to deliver such 200G per lane option. NVIDIA would leapfrog the competition and be the first to offer a full 800G/1600 G all encompassing solution from GPU into the datacenter and combine its monopolistic world class GPU’s with far the best AI datacenter solution in the world, leaving the rest scratching their heads.No doubt a similar Spectrum solution will be planned for the 2025 and I assume the rest of the ‘ Ethernet industry cooperation’ which is still defining it ‘ standard’ will need to follow soon after.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174537948
I believe anyone with half a brain, so this excludes teddybear, punkipoo, and the "fake Longs" who are such big liars they try to make their user ID's "sound like" they would be Longs, would see that the quote on Slide13 Quote from Industry Leader (Nvidia?) “in many ways polymers will be an ideal enabler for the growth expected in InfiniBand. High speeds are required now”. was from Nvidia, very likely from Ashkan Seyedi NVIDIA, Principal Silicon Photonics Products who is connected on LinkedIn to Atikem of LWLG presumably working on the upcoming LWLG Customer Agreement with Nvidia
Spekkie said, When I asked whether the products were ready and if any issues were outstanding, he clearly said that everything was ready (stability, scaling etc) and the time line was fully intact and there were no changes to that. Tier 1’s are very interested and the number of them significantly increased after OFC demo’s.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174302051
Exactly!! meanwhile Longs are being throttled here, I can't post much while Shorts and FAKE Longs mudsling at me and other Longs here NONSTOP!!!
Fact is LWLG has multiple products already, they have multiple versions of it's Perk Polymer, the latest being Perk 6, now available for Licensing, in addition they have a 200Gb modulator that is now capable of being produced at several Foundries and on large 200mm Wafers including the Poling being performed at Wafer scale something Shorts said was impossible, Lebby has told investors that Customers could use these modulators in quantities of 4 per Transceiver device to produce an 800Gbs Transceiver currently, but the preference of the large Transceiver companies (Cisco etc) would be to use the single chip modulator array (4x200) which is still under construction but Lebby announced publicly at PECC that it would be ready sometime in 2024, but the individual modulators would be used in Sampling now while the single chip modulator array (4x200) would be used in mass commercialization, Lebby is still on track with his Timeline of Customer Acceptance and Ramp in 2024 and has not backed down on his SAM/SOM guidance, Shorts are the LYING SCAMMERS period!!
Remember that it is because of the following two main reasons that Tier 1 interest has skyrocketed in recent months
1) the early 2024 "Big Milestone" achieved of success in Mass Production of LWLG modulators on Foundries large 200mm Wafers
2) the INCREDIBLE reliability/stability data collected/presented at ECOC 2023 and then even more so at OFC in March 2024
Investors have learned INCREDIBLE Developments in 2024 so far!!! here is a summary of things investors have learned form OFC in March 2024, and Lebby's LD Micro Interview in April, as well as Lebby's Belgium visit/presentations in April
1) Lebby has LWLG modulators being implemented at SEVERAL Foundries on large 200mm Wafers now beginning in early 2024!! Lebby declared it a "BIG MILESTONE"!!!
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174278606
2) Lebby has achieved Volume Scale Poling on 200mm Wafers!!! (successfully able to Pole Thousands of Devices at a time!!)
3) Lebby's LWLG team of seven completed demonstrations at OFC to over 20 potential Customers!! NDA's now estimated at 40 companies
4) the response to the OFC demos has been so overwhelming that Lebby claims the Tier 1's "being PULLED along" has become more like "being dragged along" (a good problem to have!!!)
Spekkie posted this
, Important take away we are working with multiple tier ones, tripled since a few weeks after OFC , wow we are golden
5) The Customer Funnel slide is updated and now showing greater than 20 Prospects and greater than 10 Leads, where in the ASM presentation it was only greater than 12 Prospects and 5 Leads, so about DOUBLED since the ASM!!!!
6) at OFC Google had a shout out to (LWLG) EOP on their slide for hetero integration.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174276893
7) KCC reported "the transceiver partner is a giant company that is dedicating a lot of their own resources to LWLG’s development."
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174279401
8) Lebby also showcased that LWLG's Perk 6 is NOW ready and available for Licensing !!!
9) Lebby reported that 3rd party ETH Zurich set world record performance with LWLG Polymers running at 400Gbs per lane enabling 4 lane 1600gbs!!! This ensures LWLG ALREADY capable to meet the future Roadmap
10) The response from the Tier 1's is so overwhelming such that Lebby is 100% focused on SEVERAL Tier 1's who are battling it out for Lebby/LWLG's time and attention to bring 4x200 powered Transceivers to market ASAP!!
Folks this is a Cinderella story 40 years in the making!!!
For OVER 40 YEARS the Industry has tried UNSUCCESSFULLY!!
IBM, Intel, Boeing, Lockheed Martin, DuPont, AT&T Bell Labs, Honeywell, Motorola, GE, HP, 3M, and others in addition to numerous Universities and U.S. Government Agencies, DARPA, DOD, etc have all attempted to produce high-performance, high-stability electro-optic polymers
The Industry combined has spent literally in the Billions R&D $$ UNSUCCESSFULLY trying to do what LWLG has done!
LWLG's technology has been successfully developed in much less time than what the Industry spent, and at a cost less than 5% of what the Industry spent screwing around with unstable fragile molecules for 40 years!
RIDDLE ME THIS >> WHY WOULD THE INDUSTRY SPEND BILLIONS AND BILLIONS OF $$ ON SOMETHING THEY DIDN'T DESPERATELY WANT???????
We’re working with the biggest transceiver companies in the world"
Keep in mind, Lebby is working on multi-year deals, with the type of Tier 1s investors know Lebby is in negotiations with, there could easily be large up-front monies, $50 million or more is realistic, don't think it's not!!
LWLG is a once in a lifetime opportunity!!
The quotes are from the LWLG executive and should be nearly exact to what was said. While the conversation was not recorded, detailed notes were taken and the messages should be very close, if not exactly what was said.
LWLG is “close on deals”. They have "calls all week discussing the deals". Just before the conversation, the executive was on a call with a "potential counterparty to a deal".
This executive acknowledged the only thing that will move the stock price at this point is closing deals.
"I am more than confident we’ll close on probably more than one Tier 1 deal this year."
Within the next month, engineering teams from three separate companies will be visiting LWLG’s facility.
When asked if the T1 announcements will have a name attached, the response was that they "would love to be able to". Based on the NDA’s, they "can’t use a counterparty’s name without its permission". “The argument they make is that they are trying to gain a competitive advantage.”
When asked directly if they are working with NVIDIA the response was, “Let’s put it this way. Anyone not trying to work with NVIDIA is a fool and I’m no fool. What’s the old saying? I can neither confirm nor deny that we are working with NVIDIA.”
“We’re working with the biggest transceiver companies in the world.”
“Amazon wants warrants from companies to sell to them. They eat their young. I said that to a guy during a meeting – you eat your young. He just smirked.”
I will not disclose the identity of this person. Do not ask. Do not assume.
https://www.reddit.com/r/LWLG/comments/1dad4n6/a_quick_message/
I've been adding shares since the ASM as Lebby told investors nothing had changed!! The long-standing Timeline to Commercialization has been 2024 for Customer Acceptance and Ramp into 2025 with full blown Mass Commercialization in 2026!!!
Shorts are LYING SCUMBAGS and will say LITERALLY ANYTHING to get Longs to sell their shares!!! They are criminals who worship their underworld gods of manipulation!!!
so let's examine the PP a bit, so the purchasers of the PP get,
$0.10 per Unit (CAD) >> the unit is one share and one warrant
Each Warrant is exercisable immediately and entitles the holder thereof to purchase either: (i) one Common Share; or (ii) if the Share Ownership Threshold would be exceeded by a Subscriber as a result of the exercise of their Warrants, one Pre-Funded Warrant, at an exercise price of $0.11 per Common Share or Pre-Funded Warrant until June 13, 2029
Ok So in theory the purchaser could have already exercised the warrant today for .11 CAD and sold it in the market for Bid .13 CAD and pocketed .02 CAD and a FREE SHARE to boot!!
Good deal for the purchasers!!
Now let's try to calculate a "fair valuation" of the cost of the Unit .10 CAD as broken out by Share & Warrant, and since the Warrants are only a Penny above the Shares and exercisable immediately I would say the following is a fair breakdown of the value of the Share at .06 CAD and the Warrant at .04 CAD for a Total Unit value of .10 CAD
I used the info on "Units" from here
https://www.spectra7.com/spectra7-announces-closing-of-pp-for-1-8-million
So it looks to me that the Purchasers of Units have already basically doubled their money at todays PPS of .14 CAD (Bid .13/Ask .15)