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I might be wrong you can be that stupid you did believe what ted wrote.!!!!
So X I also have been thinking about this slide. Let me just recap again because there are a lot of posters here who don't seem to want to comment on this.
Out of the 6 key parameters for our chromophores LWLG rate 9-10
The competition rates 10 on 2 parameters and the remaining 4 do not break 4!
That does not seem like competition!
Jeunke, thanks for the list. Do you remember in a few of Dr Lebby's presentations he mentions working with companies like Cisco and Ciena (among the Data Center names, etc too)?
Do you think he was just throwing out names that they could be working with just as an example? Keeping the tranceiver partners name(s) under raps for now? Or is there a reason you did not mention cisco or Ciena, for other manufacturing reasons or network gear portfolios They focus on which are not like the 800G Transceivers? Thx!
Update: just saw this Proto post that lists them, csco, ciena, arista....from the Lightwave Funnel slide. Here's Proto''s post for your thoughts. Thx
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174398192
Yes, but light or data still need to go in and out of storage. Lightwave Logic’s 9mm modulators would probably be the best option both as pluggable or on board photonics since they are so miniature and power efficient.
A Picture is worth 1,000 words. Look, think, then look and think again.
Hopefully this will display, if not here is a link.
https://www.sec.gov/Archives/edgar/data/0001325964/000155335024000021/image_033.jpg
That spider chart has it going on baby Oh and for the cherry on top
Oh and that r33 looks to be north of 200 now which was a long-time goal in the way back machine.
https://www.sec.gov/Archives/edgar/data/0001325964/000155335024000021/image_034.jpg
Oh and that R33 looks to be north of 200 now which was a long-time goal from back in the day
On the horizon I see 3 things of interest, the Volume has dropped not good for the shorts, T+1 is coming in 3 Weeks, that may be the reason for the volume as the MM's/Brokers begin to adjust as they will loose 1 day of juggling (not sure), Shareholders meeting is in a week and a half.
X Fab(ulous)
UPDATED!!! ASM Slide 38 "Multi-Level & Cross Functional Engagements"
most people do NOT understand how deeply embedded Lebby is throughout the entire Photonics Industry Food Chain, what this slide is telling investors that when the "Big Silicon Foundries" LWLG is working with (see SNN interview) there is PULL from the End Users which are the Amazon, Google, etc of the world, and the Packaging partners are likely the large Tier 1 Networkers, so when don't be surprised when the market halts news pending and there are SEVERAL large players involved including Foundries & Tier 1 Networkers
Here are some of the "Big Silicon Foundries" that produce on 200mm wafers:
(the bolded Foundries are the most likely as they have been linked to LWLG already)
GlobalFoundries
Hua Hong Semiconductor
Samsung
SK Hynix
SkyWater Technology
SMIC (Semiconductor Manufacturing International Corporation)
Tower Semiconductor
TSMC (Taiwan Semiconductor Manufacturing Company)
UMC (United Microelectronics Corporation)
Vanguard International Semiconductor
X-Fab
Let's talk about the "Growth Funnel - Internal Roadmap" Slides 38 & 39
Ok, let's start with the list of companies that Lebby has shown investors in the funnel, I don't believe Lebby just dropped random company names into this funnel, I believe Lebby is great at dropping little easter eggs into his presentations and that this list has a good deal of names with purpose to LWLG, ok so from top to bottom we see
Amazon, Meta, Microsoft, Oracle, Cisco, Arista, Samsung, OpenLight, Tower, AWS, Raytheon, Jabil, Google, D.WAVE, Gobal Foundries, Nvidia, Nokia, Xfab, Fujitsu, Ciena
Wow!! That is quite a list!!
Here are my Summary takeaways,
1) It is not surprising to see all of the largest End Users ie. Google, Amazon, Meta, etc on this list
2) It is interesting that Lebby listed these specific Foundries, a) Samsung b) Tower c) Global Foundries d) Xfab e) Fujitsu
3) It is interesting to see Raytheon listed but NOT Lockheed Martin (seeing as how LMT had a LT past relationship with LWLG)
4) It is interesting to see OpenLight, which is a 2022 startup company that provides a new SiP platform being implemented by Tower
5) It is interesting to see these Tier 1 Network builders on this list a) Cisco b) Ciena c) Arista d) Nokia
Note: Ciena had been listed in LWLG's FAQ's list as a potential Customer some time ago, and Lebby has told investors that LWLG must work with the "Switching/Routing" Networkers so as to handle the higher speeds that LWLG will be sending through the "pipes"
6) It is interesting to see one of the largest Contract Manufacturers, Jabil, listed
7) It is interesting to see quantum computing company D.WAVE on this list too
Here are a few comments I have regarding those Summary bullet points above,
1) #2 and #4 are Intel related, the Tower Foundry was listed by Bard AI as the "first" Foundry that LWLG had a deal with, and OpenLight is providing a new SiP platform being implemented by Tower
here's some info on OpenLight >> https://semiconductor-today.com/news_items/2022/jun/openlight-070622.shtml
2) Global Foundries pops up here on the "short list" of Foundries, also considering the number of Foundries listed here I would not be surprised at all that each and every one of these is in "deep" relationship now with LWLG
3) Jabil worked with GIG in the past so they would be a logical fit for Contract Manufacturing needs
4) Raytheon & D.WAVE seem to be such "outliers" to LWLG's stated market disruption plans that they almost certainly have to have working relationships with LWLG currently, this is really cool!
Ok, bottom line takeaways are that LWLG is going to become a HUGE HUGE HUGE company!!!
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| Moderators pochemunyet prototype_101 Pro_v12001 LOVELWLG JLPTNG Lightning_Rod | |||
The need for Lightwave Logic’s proprietary electro-optic polymers is more evident than at any prior point in history, with internet infrastructure coming under increasing strain due to increased online activity. For example, during the recent COVID-19 pandemic, leading platforms such as YouTube prevented high-definition (HD) streaming in Europe due to data throughput issues in existing internet infrastructure.
The Company’s current focus is on the datacom and telecommunications hardware supply chain for the 100 Gbps and 400 Gbps fiber optics communications market, seeking to integrate its proprietary materials into the devices that comprise key components in today’s internet infrastructure. Lightwave Logic’s unique value proposition, including ease of manufacture relative to traditional solutions, has driven several tier-1 and tier-2 potential strategic partners in the data and telecommunications markets to enter into non-disclosure agreements (NDAs) with Lightwave Logic to evaluate its technology for use in their devices, validating the demand for the Company’s solution in the marketplace. The Company expects to introduce its technology into the commercial marketplace in the near future.
Lightwave Logic is a wholly U.S.-based company with in-house materials synthesis, device/package design, wafer fabrication and testing capabilities at its Englewood, Colorado headquarters.
Having the modulator and integrated circuit development in-house has informed the materials development direction and vice versa. This vertically integrated business model enables a superior platform by aligning the design for manufacturability from materials to complex circuits with the following benefits:
Materials are called electro-optic when they enable interactions between applied electric fields and light passing through them. Notably, they change the refractive index seen by the light with minimum loss. The result is an instantaneous and accurate conversion of an electrical signal to an optical signal. Optical signals are better for transmission over distance: an increasingly useful feature as digital signal speeds are now reaching the GHz and THz ranges and the corresponding electrical transmission distances are shrinking to meters and centimeters.
EO polymers are intrinsically superior in speed and sensitivity to electric field to traditional electro-optic materials such as Lithium Niobate, Indium Phosphide and Silicon. They are engineered materials, made by embedding a variety of specially designed electro-optic chromophore molecules into a wide range of standard host polymers.
Chromophores are complex, large molecules, on a scale akin to drug molecules. They are hyperpolarizable, meaning their electron clouds are easily pulled into a different shape by the applied electric field, changing their optical properties such as index of refraction.
The material is poled to become electro-optic by applying a strong electric field along with heat. The hot material is relatively soft, allowing the chromophore molecules suspended in the host polymer to align in the same direction (poling). Cooling the poled material after the molecules are in place traps them in their active state even after the poling field is removed.
Although the electrons in the material respond to any applied electric field, they remain tightly bound to the molecule. The response to an applied signal is almost instantaneous response and recovery– like that of a tight spring– unlike materials that involve much slower macroscopic movement of free electrons.
Another key difference from traditional crystalline materials is the performance of EO polymers continues to improve as chemists explore the almost unlimited design space. Combinations of chromophores and host polymers can be tailored for specific applications.
In addition to innovating the EO polymer materials, Lightwave Logic takes its technology platform to the next level by developing ancillary materials and processes. These elements are brought together and demonstrated in advanced high-speed optical modulators.
The polymer is spun onto silicon wafers and standard microfabrication techniques are used to deposit and pattern metal electrodes and optical waveguides.
One well-known optical modulator device is the Mach-Zehnder interferometer. The light output is changed by changing the relative phase between the two arms. One common trick to double the effect for the same available drive voltage is to drive the two arms in opposite directions (push-pull mode). Polymers have an interesting advantage over most other electro-optic materials which are crystalline. The direction of polymer’s electro-optic activity is entirely determined by the direction of the applied poling field. By poling the two arms of the Mach-Zehnder in opposite directions, the resulting device automatically has push-pull operation with a single applied signal.
Once the modulator chip is made, it is packaged for mechanical protection and also to ensure signal quality for electrical and optical connections.
Below is a polymer optical modulator with >60 GHz bandwidth packaged with high-speed electrical connectors and optical pigtails.
Inspired by the remarkable record of integrated microelectronics, the opto-electronics industry has great interest in developing photonic integrated circuits (PICS). Photonics refers to devices that manipulate photons—that is, light—rather than electrons.
Even the best individual devices can be made more functional by integrating many together. Integration has many benefits, the most notable being dramatic improvements in size and cost. Yet, photonic integration has only recently come into the spotlight. The primary applications for photonics used to require stand-alone, high performance components such as used for long-haul telecom.
Now, photonic integration has suddenly come into the spotlight as electronic interconnects struggle to keep up with speed increases of electronic chips. Photonics is being looked at to replace electronics in already highly integrated applications such as chip interconnect. Co-packaging of electronics integrated circuits (ICs) with photonic interconnect, considered unlikely a few years ago, is now viewed by many as inevitable. However, this requirement poses new challenges that are acknowledged as difficult and that new technologies will be required to meet them.
P2IC™ (Polymer Photonic Integrated Circuits) are ideally positioned to be one of these new technologies. Lightwave Logic’s devices are made using conventional wafer-scale processing such as used for microelectronics and therefore similarly capable of being integrated. In addition, the polymer microfabrication processes are compatible with other materials platforms such as Silicon Photonics and Indium Phosphide which are now starting to become more integrated. In particular, the Silicon Photonics ecosystem has recently accepted that its roadmap will include adding more and more materials, each for their specific benefits. EO polymers’ speed and voltage advantages are attractive additions to this ecosystem.
A fiber link sends data from a transmitter to a receiver through an optical fiber cable. Lightwave Logic’s technology can be used to make a data modulator, a central function of the transmitter.
Datacenters and high-performance computing (HPC) are two market segments that demand the very highest speed optical fiber communications. The datacenter fiber communications segment includes applications ranging from connections inside hyperscale datacenters to fiber links between datacenter campuses.
Optical fiber communication is the infrastructure that supports internet content through its entire lifecycle, between businesses, consumers and datacenters. Behind the scenes, massive amounts of data move between computer processors inside datacenters (or inside supercomputers) as content is generated. In addition to these intra-datacenter links, there are also significant datacenter interconnection links between big datacenters to provide flexible capacity and resilience – all of these represent significant addressable market segments for Lightwave Logic’s technology.
Modulator performance limits the speed of the transmitter, which in turn limits the data-carrying capacity of the entire fiber link. EO polymers have superior speed and sharply reduce the electrical power needed to operate the modulators.
Lightwave Logic estimates that in 2019, the total market for opto-electronic components used in the fiber optics market reached a value of ~$26 billion and is forecasted to grow to approximately $80 billion by 2030.
Above: Market forecasts for photonic (electro-optic) components and transceivers used in optical fiber communications. (Source: Oculi LLC)
The growth in the optical fiber communications market is driven by many factors, primarily:
The historic trend has been a migration from text to graphics, followed by still graphics to increasingly high-definition video. On the accessibility front, the introduction of 5G will enable low-cost mobile internet connections at the same, or higher speeds, as today’s home broadband. This trend continues today as users demand more data at all times.
Recently, particularly since the onset of the COVID-19 pandemic, there has been a sharp increase in reliance on video-conferencing services, often replacing in-person meetings. As video conferencing becomes more commonly used, users will continue to demand faster response times to enable no-lag, real-time communications in full HD.
The benefits of EO polymers, such as low power usage, high speed, increased throughput and lower cost make them ideally suited for markets outside of communications as well, including in consumer, media, augmented reality/virtual reality, medical and industrial applications.
Developing, protecting and commercializing intellectual property is central to Lightwave Logic’s identity as a technology company. Lightwave Logic has over 50 U.S. and international patents and applications that are issued or pending.
These patents provide freedom of manufacture for the company’s electro-optic (EO) polymer materials systems and its optical device technology.
Lightwave Logic’s patent portfolio covers the following areas:
The company continuously seeks to innovate new electro-optic chromophores, designing molecular architectures to meet application needs such as high electro-optic activity and stability. We also design ancillary materials that are useful in conjunction with the EO polymers themselves. Example patents within the materials category include:
| Publication Number | Title |
|---|---|
| US Patent 7,902,322 | Nonlinear optical chromophores with stabilizing substituent and electro-optic devices |
| US Patent 9,535,215 | Fluorinated Sol-Gel Low Refractive Index Hybrid Optical Cladding and Electro-Optic Devices Made Therefrom |
As the company demonstrates its materials in devices, such as modulators, it has engineered ways to enhance device performance by means of device design and optimized control. Example patents within the optical device category include:
| Publication Number | Title |
|---|---|
| US Patent 10,520,673 | Protection layers for polymer modulators/waveguides |
| US Patent 7,738,745 | Method of Biasing and Operating Electr-Optic Polymer Optical Modulators |
Materials innovations are followed by methods in which the Company or its partners can best work with the materials in the fabrication process. Example patents within the fabrication category include:
| Publication Number | Title |
|---|---|
| US Patent Application 20190353843 | Fabrication process of polymer based photonic apparatus and the apparatus |
| US Patent 10,591,755 | Direct-drive polymer modulator methods of fabricating and materials therefor |
Polymers can be used to add functionality to existing semiconductor devices, inclusive of making photonic integrated circuits (ICs). Areas of active innovation include how to get light from one material system into another with minimal losses. Example patents within the semiconductor integration category include:
| Publication Number | Title |
|---|---|
| US Patent 10,527,786 | Polymer modulator and laser integrated on a common platform and method |
| US Patent 10,511,146 | Guide transition device with digital grating deflectors and method |
Challenges for high-speed optical packaging includes maintaining the quality of radio-frequency electrical signals and hermetic/environmental sealing of devices for durability (while still allowing light to go through). Example patents within the packaging category include:
| Publication Number | Title |
|---|---|
| US Patent 10,574,025 | Hermetic capsule and method for a monolithic photonic integrated circuit |
| US Patent 10,162,111 | Multi-fiber/port hermetic capsule sealed by metallization and method |
We cannot assure you that we will meet the conditions of the 2023 Purchase Agreement with Lincoln Park in order to obligate Lincoln Park to purchase our shares of common stock, and we cannot assure you that we will be able to sell any shares under or fully utilize the Roth Sales Agreement. In the event we fail to do so, and other adequate funds are not available to satisfy long-term capital requirements, or if planned revenues are not generated, we may be required to substantially limit our operations. This limitation of operations may include reductions in capital expenditures and reductions in staff and discretionary costs.
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