I am not familiar enough with Apples manufacturing processes to answer your questions with any amount of certainty. It seems to me that the hermetic sealing process described in that patent takes place at the annealing temperature of the alloys, which would probably be about 350-450 degrees C. I doubt that they would be able to localize that enough to not damage the internal components. I don't foresee Apple's next Iphone being waterproof. I'm not sure how they would achieve this with all of the buttons, ports, and speakers. But, like I said, I don't know what Apple has up their sleeve.