Replies to post #15712 on City Capital Corp. (CTCC)

[medicroc]

I will be watching

[medicroc]

Try taking a zero off that prediction for CTCC's EOW and there 's a better chance of being correct

[medicroc]

Guess what, today is EOW. Hope you stick around

[MONEYMADE]

,,,,,,,I HAD BUYS READY FOR 2M...BUT .004 NEVER CAME!!!!!!! WHAT HAPPENED??????????


WE WAITED...AND WAITED...AND WAITED!


I FEEL LET DOWN BY YOU PERSONALLY.

[MONEYMADE]

COINCIDENCE?????? 1130 CTCC THROUGH THE ROOF: http://investorshub.advfn.com/boards/read_msg.aspx?message_id=72797864

SOMETHING SCARED THE BEJEZUS OUT OF ETMM!!!!!!


WHO WAS THAT MASKED MAN.....

[MONEYMADE]

*****************DON'S RESUME*************************

http://sol-ir.com/product.html
http://www.facebook.com/pages/Sol-Ir/126562427415013
http://www.microcsp.com/
http://www.usti-us.com/en/gaas.html
http://investorshub.advfn.com/boards/read_msg.aspx?message_id=72542985 (PATENTS)
http://investorshub.advfn.com/boards/read_msg.aspx?message_id=72541327



Senior vice president of technology: Mr. Don McIntyre

Education:Delaware M.E. University
BSME Northrop University, top-class model worker, Chairman
Honor student
The University of California at Los Angeles, MBA college

Patents obtained: majored in semiconductor equipment, smart card encapsulation, stacked DRAM, MicroCSP packaging, liquid crystal display crystal, wafer test architecture.
Work experience:

From 2008 to 2009, senior vice president of technology, Universal Semiconductor Technology Inc. - Responsible for the new production development of wireless communication application
- Responsible for new product development of cleaning technology application
-Responsible for new business projects of the rapid prototyping

From 2007 to 2008, Probe Array Corp -Founder/President, San Clara City, California, the U.S.
-Developed the G5 semiconductor chip probe technology and Form Factor Inc.,Micronics Japan Corp, and Cascade Microtec Inc. Contended for the $1.34 billion of wafer probing project for the next generation of wafer testing interface products.

From 2004 to 2007, Multichip Display Inc. -Co-founder/Chairman, Santa Clara city, California -Designed and manufactured military electronic instruments and flight simulator instruments. Customers include Boeing, Rockwell Collins, Lockheed Martin Lockheed and the US Government.

From 1994 to 2004, Multichip Assembly Inc. - Co-founder/CTO, Santa Clara city, California -Developed and produced active LCD display driver, AMI semiconductor and Honelwell flight system applied in the of the 777 "glass cockpit" flight navigation flat-panel display.
-Developed and manufactured GM tire pressure sensors monitor "RunOnFlat" wheel systems (currently produced 17kk/month in Thailand)

From 1991 to 1994, Executive vice president of Multichip Technology Division and Cypress Semiconductor Corp
-Manufactured all kinds of devices components for Cypress Semiconductor -Launched many various equipment products, including an SRAM memory, mobile phones of multiprocessor and multichip modules.
-Obtained Cypress in technology, equipment and personnel management, and set up operations department in Thailand

From 1989 to 1991, Tape Automated Bonding, Founder/CTO
-Received (TAB/TCP) equipment production line of Tape Bonding company from the national semiconductor department.
-Established integrated circuit assembly operations department. Developed the IC packaging and mobile building solar Microsystems workstations and parallel central building processor module for Multichip Technology Division of Cypress Semiconductor Corp.
From 1986 to 1989, Sales manager of Dynapert Division, Black & Decker Corp
-Responsible for introducing semiconductor equipment and sold to a famous Thru - Hole & Surface equipment company, its annual sales of $450 million.
-Increased the sales of semiconductor equipment in North American to $40 million, its products are exported to America, Europe and Asia, etc. and set up manufacturing operations departments in the United States, Britain and Switzerland,etc.

From 1976 to 1986, Amedyne Founder / CTO
-Founded an equipment company, its products sold to Intel, national semiconductor, Fairchild, hewlett-packard, Texas instruments, AMD and other high-tech equipment processing companies.
- Increased the sales to $10 million without foreign investments, then employed by the Dynapert division of Black&Decker company.

From 1973 to 1976, Hughes Aircraft Company -
-Senior manufacturing manager Developed Hughes automation chip adhesive and welding machine equipment production line.
-This has become the pillar product of the semiconductor/welding equipment department of Hughes Airlines, is produced now by Palomar Equipment Corp..

From 1969 to 1973, Teledyne Semiconductor - Manufacturing Manager
-Developed field-effect transister chip manufacturing process, being assemblied and tested in the United States, Hong Kong and Singapore.
-Responsible for American wafer production operations, responsible for assemblying and testing field-effect transisters in Hong Kong and Singapore.

PATENTS

Mr. MacIntyre has nine inventions, co-patents to his credit probably more. You'll notice not only hermetic wafer integration
(sealed vacuum pressure) but also patents in Arrays...How the surface reacts on contact...

Hermetic wafer scale integrated circuit structure
U.S. Patent US6982475 | Filed: 07/03/2002 | Issued: 01/03/2006 Cited: 5 Times
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Laura M. Schillinger


Stress relieved contact array
U.S. Patent US6838894 | Filed: 09/03/2002 | Issued: 01/04/2005
Inventor(s): Donald M. MacIntyre | Agent(s): Henry M. Stanley | Examiner(s): David Zarneke
Donald M. MacIntyre...
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Stress relieved contact array
U.S. Patent US7038478 | Filed: 11/23/2004 | Issued: 05/02/2006
Assignee(s): MACINTYRE DONALD M | Inventor(s): Donald M. Macintyre | Agent(s): Henry M. Stanley | Examiner(s): Jermele Hollington
Donald M. Macintyre...
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Hermetic wafer scale integrated circuit structure
U.S. Patent US7205635 | Filed: 10/14/2005 | Issued: 04/17/2007
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Carl Whitehead, Jr.
Donald M. MacIntyre...
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Integrated circuit package stacking structure
U.S. Patent US6690088 | Filed: 01/31/2002 | Issued: 02/10/2004
Inventor(s): Donald M. MacIntyre | Agent(s): Henry M. Stanley | Examiner(s): Alexander O. Williams
Donald M. MacIntyre...
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Method of forming hermetic wafer scale integrated circuit structure
U.S. Patent US7205181 | Filed: 10/14/2005 | Issued: 04/17/2007
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Carl Whitehead, Jr.
Donald M. MacIntyre...
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http://www.boliven.com/patents/search?q=inventor:(%22Donald+M.+MacIntyre%22)