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SNAPSHOT PATENT BIO: Donald MacIntyre-CTCC

Mr. MacIntyre has nine inventions, co-patents to his credit probably more. You'll notice not only hermetic wafer integration
(sealed low vacuum pressure) but in Arrays. How the surface reacts on contact...

Hermetic wafer scale integrated circuit structure
U.S. Patent US6982475 | Filed: 07/03/2002 | Issued: 01/03/2006 Cited: 5 Times
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Laura M. Schillinger


Stress relieved contact array
U.S. Patent US6838894 | Filed: 09/03/2002 | Issued: 01/04/2005
Inventor(s): Donald M. MacIntyre | Agent(s): Henry M. Stanley | Examiner(s): David Zarneke
Donald M. MacIntyre...
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Stress relieved contact array
U.S. Patent US7038478 | Filed: 11/23/2004 | Issued: 05/02/2006
Assignee(s): MACINTYRE DONALD M | Inventor(s): Donald M. Macintyre | Agent(s): Henry M. Stanley | Examiner(s): Jermele Hollington
Donald M. Macintyre...
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Hermetic wafer scale integrated circuit structure
U.S. Patent US7205635 | Filed: 10/14/2005 | Issued: 04/17/2007
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Carl Whitehead, Jr.
Donald M. MacIntyre...
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Integrated circuit package stacking structure
U.S. Patent US6690088 | Filed: 01/31/2002 | Issued: 02/10/2004
Inventor(s): Donald M. MacIntyre | Agent(s): Henry M. Stanley | Examiner(s): Alexander O. Williams
Donald M. MacIntyre...
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Method of forming hermetic wafer scale integrated circuit structure
U.S. Patent US7205181 | Filed: 10/14/2005 | Issued: 04/17/2007
Assignee(s): MCSP, LLC | Inventor(s): Donald M. MacIntyre | Agent(s): Stallman & Pollock LLP | Examiner(s): Carl Whitehead, Jr.
Donald M. MacIntyre...
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