Replies to post #187401 on Lightwave Logic Inc (LWLG)

[vein]

So if there is no spending yet on 800g. And that is where we enter the market , is that the delay issue??

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You tell me, here is Lebbys Legal BIOGRAPHY:
Just who is Michael Lebby?, here is his Biography

Lebbys Legal BIOGRAPHY:
Biography: Michael S. Lebby joined Lightwave Logic as a member of the Board of Directors in 2015. In May 2017, Dr. Lebby assumed the role of CEO, and in September 2022, Chairman and CEO of Lightwave Logic Inc (NASDAQ:LWLG). Lightwave Logic is a technological company commercializing Electro-Optical polymers and successfully up listed the company to NASDAQ on 1st September, 2021. Dr. Lebby was invited to close the NASDAQ stock market on 10th September 2021. The event was carried on Fox, CNBC, Bloomberg, BNN networks.
Dr. Lebby (born 1961, London, UK) is an Anglo-American entrepreneur and intrapreneur in the fields of optoelectronics/photonics electronics and semiconductors. Dr. Lebby’s career started with the British Government in 1977 in telecommunications and he did research at their research labs (RSRE Malvern) in the early 1980s. Dr. Lebby worked at AT&T’s research labs: Bell Labs (1985-1989) in photonics, and subsequently drove the development (and co-authored the first patent) of the oxide VCSEL diode laser at Motorola in the 1990s (which is e, now used in laser mice 3D structured light sensing/FaceID in mobile phones, optical interconnects; where volumes of the laser are over 1B units today). From 2005-2010 he led the USA trade association in optoelectronics (OIDA) and represented the optoelectronics and photonics industry on Capitol Hill.
Dr. Lebby has led and run technical start-ups and commercialized optoelectronic and photonics technology into volume manufacturing. Dr. Lebby has also had roles as a Venture Capitalist specializing in Optical Communications. He is currently a technical expert to the European Commission. He is a Fellow member of NAI (National Academy of Inventors), IEEE, and OSA, and has been voted PIC (Photonic Integrated Circuit) business leader of the year by the PIC International Conference in 2018.
Dr. Lebby holds over 450 issued international patents in photonics and electronics, that have been derived from over 230 issued USPTO utility patents, mostly in the field of optoelectronics, photonics, and semiconductors. He has been cited by the USPTO to be in the most prolific 75 inventors in USA from 1988-1997.
Dr. Lebby is passionate about photonics and has focused his efforts over the last 30 years to drive new photonics manufacturing programs in USA and Europe as well as industry-based photonics technology roadmaps.
Dr. Lebby is also passionate about optics and philately, and has been elected to both the London Guild of Spectacle Makers as well as the Royal Philatelic Society London.

WORK HISTORY:
2003 – Present Oculi LLC, CEO and CTO (part-time consulting)
Oculi LLC provides consulting in expert witness, trial, deposition, expert reports, infringement, invalidity, and various patent and IP litigation in photonics, optoelectronics, semiconductors, and fiber optic telecommunication technology segments. Engaged patent agencies have included: IMS Expert Services, Thomson Reuters Expert Witness Services (now Round Table Group), LitXpert Expert Witness Group,Teklicon Expert Witness Agency, Beche Expert Services Group, Forensis Group: Expert Witness Services,
and Expertconnect. Oculi LLC also provides consulting to Ambature Inc. in superconductivity

SELECTED PROFESSIONAL ACTIVITIES & AWARDS:
Elected Chairman of Lightwave Logic Inc., NASDAQ:LWLG 1st September 2022

Elected to the Corporate Engagement Council (newly formed OIDA to represent the global optical industry) for Optica in June 2022.

Invited to ring the closing bell of NASDAQ (with associated TV interviews) on 10th September, 2021 Elected Fellow of the National Academy of Inventors (NAI) in 2020.

Voted winner at the PIC Conference (Photonic Integrated Circuits) as PIC Entrepreneur and Business Leader of the Year (March 2018).

Dr. Lebby is co-inventor of the oxide VCSEL (semiconductor laser) that is now being utilized for consumer applications (Face ID of Apple’s iPhone as an example). US Patent #5359618 “High Efficiency VCSEL and Method of Fabrication” issued 25th October 1994.

Dr. Lebby was recognized professionally as a Fellow of IEEE (2005) and OSA (2007) with his technical contributions to the field of optoelectronics.

Dr. Lebby is a member of the Fellows review committee of IEEE.

As an inventor Dr. Lebby has achieved >230 issued utility patents with the USPTO.

As an inventor Dr. Lebby has ~80 published utility patent applications with the USPTO

As an inventor Dr. Lebby has over 450 issued patents world-wide if international derivatives are counted.

Dr. Lebby’s novel laser-based device, packaging, modules designs led Motorola to sell their patent portfolio independently where a number of the patents have “very high licensing coefficients.” Dr. Lebby was given a special award from the Chairman of Motorola for exemplary patent invention accomplishments in 1998 and #1 prolific inventor in Motorola’s history.

Over 60 publications

Over 300 public media activities (that include: Books, Chapters, Reports, Abstracts, Videos, Lectures, Speeches, Reviews, Courses, Talks, Invited Talks, Keynote Talks, Plenary Talks, Webinars, Interviews, Articles, etc.).

Author of OIDA’s annual market optoelectronics report and forecast (2009 version is over 600 pages), which receives international exposure and recognition. Regularly interacts with government agencies in Washington DC on photonics-based projects (DARPA, ARPA-E, NIH, NSF, DOE, NIST, DoD etc.). Typical chapters included: LEDs, laser diodes, fiber optic communications, sensors, displays, solar, green photonics, military photonics, and applications of photonics such as solid-state lighting (LED luminaires), automotive, medical, etc.
Is the recipient of a 2nd doctorate (higher) from Bradford University, UK, and only the second in the
universities history to receive a D.Eng from industry (rest being academia).

Intrepreneur at: (i) Motorola: Co-founded Optobus division – VCSEL laser based parallel optical interconnect solution, and (ii) Intel: Co-founded the Intel optics division for silicon photonics where over $300M was initially invested for the division.

Entrepreneur: Founded (and CEO) Ignis Optics Inc., a venture backed company (>$30M) that designed and manufactured 10Gbps fiber optic transceivers. Sold the company to Bookham (NASDAQ: BKHM) in 2003.
Restructured OneChip Photonics (as CEO) through bankruptcy, and new VC-based funding. Assisted in the raising of >$50M VC funding as a member of BoD. Founded Oculi LLC and Obsidian Motors LLC.

IEEE CPMT Board of Governors (’98- ‘02); IEEE Phoenix Waves and Devices Junior Engineer of the Year (1993); CPMT Distinguished lecturer (2000), CPMT technical committee (TC-10 & ECTC) 1991 to 2011


Advised at Board of Director level for a number of technical start-ups

Chartered Engineer (C.Eng) from IEE (UK). The chartered engineering status is equivalent to the US PE (professional engineer)

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This is Lebby's Legal Resume

So this is Lebby legal resume for the courts to determine his qualifications in the Semiconductor and Photonic Patent infringement cases whenever he is hired to represent them and explain to the courts what a particular patent says.

SUMMARY OF TECHNICAL EXPERTISE:
Industry roles (majority of career): Dr, Lebby has founded and led several companies in various positions
including CEO and CTO (Ignis Optics, Oculi, One Chip Photonics, OIDA, Translucent Photonics, and Lightwave
Logic). Dr. Lebby is currently Chairman & CEO of a public company (Lightwave Logic Inc. NASDAQ:LWLG). As
CEO, Dr. Lebby led LWLG from an OTCQB company to OTCQX, and then to up-list on NASDAQ, organically,
without raising financing (which is extremely rare), on 1st September 2021. Subsequently, Dr. Lebby was invited to
‘ring the bell’ and close the NASDAQ stock market for ethe week on 10th September 2021. The event was carried live
on Fox, CNBC, Bloomberg, and BNN networks. On 1st September 2022, Lebby was elected Chairman of Lightwave
Logic Inc.
Academia role (minor part of career): Dr. Lebby has been a full professor (part-time) in optoelectronics at
Glyndwr University, Wales, UK (2013-15). Dr. Lebby has over 60 publications and has a google scholar h-index = 46
(which includes issued patents and published patent applications), i10-index = 165, with over 8400 citations.
Key professional bodies: Dr. Lebby is a chong of the National Academy of Inventors (NAI), the IEEE
(Institute of Electrical and Electronic Engineers), and the OSA (Optical Society of America). Dr. Lebby is a Chartered
Engineer of the British Institute of Electrical Engineers (roughly equivalent to the professional engineer status in USA).
Dr. Lebby started work in telecommunications industry and has generated over 40 years of experience in a
number of technical disciplines and technologies. Dr. Lebby is well versed in electronics, semiconductor physics,
optoelectronics, optics, materials, packaging, module design, ICs and electrical engineering in general. Dr. Lebby has
experience in commercial and industrial research of technologies such as silicon, compound semiconductors,
manufacturing, fabrication, design, simulation, testing, evaluation, reliability, qualification of new ideas, concepts and
products.
Dr. Lebby is co-inventor of the world’s first ‘oxide VCSEL’ (this is a type of semiconductor laser) that is
now being utilized for consumer applications (Face ID of Apple’s iPhone as an example, laser mice for PCs as another
example). US Patent #5359618 “High Efficiency VCSEL and Method of Fabrication” issued 25th October 1994.
Estimated commercial volumes of this semiconductor device exceed many billions of units.
Dr. Lebby has over 230 issued utility patents with the USPTO in subjects such as electronics, optoelectronics,
photonics, packaging, transceiver modules, optical sub-assemblies, materials, epitaxial growth, device design,
assembly, and various active and passive components (both electronic and optoelectronic). Dr. Lebby regularly
receives invites to speak at technical conferences as well as banking and financial conferences. Dr. Lebby has appeared
in panels and interviews many times and regularly is communicating with the public on various platforms. Dr. Lebby is
currently chairman of the International PIC conference based in Europe (since it’s conception in 2015). Dr. Lebby is
inventor or co-inventor of ~230 issued USPTO utility patents (or over 450 if international derivatives are included), as
well as over 80 published patent applications.
Dr. Lebby has participated in over 130 patent litigation cases as a technical expert witness, including over 20
trials and over 50 depositions. Dr. Lebby has authored numerous expert reports and is familiar with State (District),
Federal (ITC) and PTAB-IPR court processes for expert witness testimony. Dr. Lebby has been cited in patent
litigation case history (ITC investigation in the matter of: Certain Active Optical Cables and Products Containing the
Same (ITC Inv #337-TA-1233)). See details below in Expert Witness Experience.
The types of products that Dr. Lebby understands and includes but are not limited to; Light Emitting Diodes
(LEDs), Laser Diodes (LDs), photodetectors (PDs), optical waveguides, fiber optics, displays (LCD, LED, OLED),
lighting luminaires, plastic photonics, optical polymers, sensors, LIDAR, solar cells, lighting, data communication,
CMOS, and even new opportunities such as medical and life science applications for photonics. Dr. Lebby is
internationally known for his work with integrated photonics, PICs (Photonic Integrated Circuits), silicon photonics,
and semiconductor technologies such as InP, GaAs, III-GaN, silicon, as well as SiGe and silicon ICs (MOSFETs,
FinFETs, bipolar), power FETs, RF FETs, various display technologies such as LCD, OLED, LED, cameras, as well as
micro-fluidics and nanostructures/wires etc. Dr. Lebby has worked with DC current as well as AC current, high
frequency design, microwave design, and multi-wavelength, visible wavelengths, in addition to
850nm/1310nm/1500nm/NIR fiber optic communications. Dr. Lebby has worked extensively in fiber optics which
includes Fiber based systems, chassis’, trays, modules, adapters, splice devices, connectors, transceivers, packaging as
well as architecture and optical communication standards/protocols.
Dr. Lebby is currently CEO of a public company (Lightwave Logic Inc. NASDAQ:LWLG). As CEO, Dr.
Lebby took LWLG from an OTCQX company to up-list on NASDAQ, organically, without raising financing (which is
extremely rare). LWLG was listed on NASDAQ 1st September 2021, and Dr. Lebby was invited to close the NASDAQ
stock market on 10th September 2021 and “ring the bell”. The event was carried on Fox, CNBC, Bloomberg, and BNN
networks.

X

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This is List of the companies that have consulted with him and retained him as an Expert in Legal matters.

I finished grabbing the technology list and am posting a complete list that Lebby has been called on by the industry in the past as an expert witness. I'd say that we have some pretty impressive investors on here and some even apparently know better how the industry operates and how to introduce EO Polymers to it. I'd like to see a list of the technology or subjects the smartest kid in the class here have been asked to legally be relied on.

Honestly it doesn't even have to be related to this industry, it could be anything, automotive, production, aerospace, medical related. Just copy from your resume and post.

Waiting......... Wait until I list the companies, entities countries who have called on Lebby for the following Technologies.

c. Technology: Optoelectronics (optical storage, fiber optic communications, sensors, high power lasers,
LED lighting, LED luminaires etc.).

c. Technology: semiconductor lasers/VCSELs, fiber optic transceiver modules

c. Technology: CMOS image sensors; design and fabrication

c. Technology: LEDs, device design, color gamut, packaging, optical lensing, lead frames, surface
mount packaging.

c. Technology: Fiber optic networks, optical switches, ROADMs and optical filters (dielectric based).

c. Technology: Wavelength optical switches, optical filters, and optical components, liquid crystal
technology.

c. Technology: IC design, layout, and operation; especially laser driver chips for VCSELs. High speed
laboratory testing.

c. Technology: Bar code scanners and associated optics such as imagers, lasers, LEDs, molded optics.
Laboratory testing.

c. Technology: IC design, layout, and operation; especially laser driver chips for VCSELs. High speed
laboratory testing.


c. Technology: CD, CVD, BluRay optical disk drives, optical components, laser diodes, and optical
beam patterns. Laboratory testing of visible optics.

c. Technology: LED backlights for vehicles; LED package and optical module/LED luminaire design.

c. Technology: LED backlights for vehicles; LED package and optical module/luminaire design.

c. Technology: Photonic Integrated Circuits using InP (Indium Phosphide); lasers, detectors,
waveguides, mux/demux, spot size converters.

c. Technology: LED devices, packages and modules/luminaires for vehicles.

c. Technology: LEDs for mobile phones; LED epitaxial layers, device designs, optical lensing,
packaging. Laboratory reverse engineering using TEM/SEM/EDAX etc.

c. Technology: GaN buffer layers for LEDs, and associated technical marketing, sales and import
process into USA.

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Optical storage using laser diodes, photodetectors and optical materials

d. Technology: Proximity sensors using LEDs, photodetectors and innovative semiconductor packaging.

d. Technology: High power lasers (YAG, CO2) to engrave and scribe dental orthodontic brackets.

d. Technology: Trade secret MOCVD epitaxial growth techniques for high power GaN/InGaN LED technology, luminaires, modules and packaging.

d. Technology: GaN/InGaN LEDs on structured substrates with reverse engineering laboratory analysis.

d. Technology: Proximity sensors for mobile phones.

d. Technology: Fiber optic transceiver modules.

d. Technology: High power gas laser design and operation.

d. Technology: LED packaging for illumination. LED luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: Electrical connector, IC, and LED light product design including luminaires.

d. Technology: High performance GaN based RF FET device design and operation.

d. Technology: Laser/photodetector based LIDAR design and operation for self-driving vehicles.

d. Technology: LED based luminaire design for lighting.

d. Technology: Optical and electrical device, optics, and package designs for LIDAR based self-driving
vehicles.

d. Technology: Optoelectronic based proximity sensors using LEDs and photodetectors.

d. Technology: Coding designs of optical digital signals for high performance optical networks.

d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.

d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.

d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.


d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.

d. Technology: High power grating surface emitter laser diodes, and associated packaging and device
design for laser-based cooking ovens.

d. Technology: Fiber optic based optical communications for coherent technologies

d. Technology: Fiber optic based optoelectronic semiconductor component design and operation.

d. Technology: Fiber optic based optoelectronic semiconductor component design and operation.
Including both direct detect and coherent communications, and encoding techniques such as PSK,
QPSK, AM, FM etc.

d. Technology: High volume, low cost optical lens and optics technology.

d. Technology: Bar-code scanners and associated optical/optoelectronic component performance and
operation.


d. Technology: Fabrication, design, and reverse engineering of silicon-based FET ICs.

d. Technology: Fabrication, design, characterization, and packaging of silicon-based FET ICs for power
applications

d. Technology: Design and packaging of high brightness GaN based LEDs for luminaires.

d. Technology: Submarine and subsea fiber optic cables: technology, markets, economic impact, and
history.

d. Technology: Design and packaging of high brightness GaN based LEDs for luminaires.

d. Technology: Large LED Panels, LED displays, LED modular panel design, LED thermal engineering
and color displays for outdoor environments.


Technology: CMOS device (inc FinFETs) and IC fabrication techniques at 40, 28, 20, 16nm nodes.

d. Technology: High brightness InGaAlP, GaP, AlGaAs, and GaN/InGaN based LEDs for use in medical
instruments

d. Technology: LIDAR optical and electronic component and system technology

d. Technology: Trade Secret GaAs based solar cell design, fabrication, manufacturing, and device
performance

d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.


d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.

d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.

d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.

d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
IPR2023-00475
HKC v. 138 East
Ex. 2001 - Page 092
Page 13

d. Technology: Semiconductor displays using active matrix LCD and thin film transistor technology.
Design, fabrication, and circuit layout.

d. Technology: Semiconductor displays using active matrix LCD and thin film transistor technology.
Design and fabrication technology.

d. Technology: LED lighting, LED luminaires, LED performance, electrical and mechanical design and
construction.

d. Technology: LEDs for mobile phones

d. Technology: LED chips, LED packaging, LED lenses, LED luminaires, backlights, displays, and
televisions/monitors

c. IPR/PTAB trial/deposition: 0 (Cumulative total: 4)

d. Technology: Silicon solar cells and materials analysis of passivation layers

d. Technology: Fiber optic based optoelectronic semiconductor component and transceiver design/
operation.

d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology.

d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology

d. Technology: Fiber optic based optoelectronic semiconductor components, transceivers, and subsystems.

d. Technology: LED design patent, and the design of an aftermarket LED based headlight assembly for
an automobile.

d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology (LTCC).

d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.

d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.

d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.

d. Technology: Silicon solar cells and materials analysis of passivation layers

d. Technology: Silicon solar cells and materials analysis of passivation layers

d. Technology: Optical filters and optical sensor systems, design and fabrication of dielectric materials
for passband filters in applications such as optical communications, imaging, sensing, medical,
automotive.

d. Technology: Fiber optic adapters, fiber optic connectors (simplex, duplex, quad, multi-fiber), fiber
trays, racks, and fiber cabinet equipment.
e. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.

d. Optoelectronics, LEDs, lead frame packaging, optics, optical lenses, GaN (Gallium Nitride), optical
transparency

d. Technology: Silicon CMOS image sensors, drive electronics, smart pixels and CCD technology

d. Technology: Touch sensor (resistive, optical, and capacitive) technology for mobile displays.
Analysis of display, electronic, and optical technologies.

d. Optoelectronics; solar cell design, fabrication, device performance, packaging, and interface issues
relating to passivation (both chemical and electric field enhanced).

d. Technology: Fiber optic based optoelectronic semiconductor component design and operation,
especially phase shift keying (PSK, QPSK) and phase based coherent communications.

d. Technology: Fiber optic wavelength selective switches (WSS), reconfigurable add-drop multiplexors
(ROADMs), and their design. Technical issues include polarization, wavelength selection, coupling,
mux/demux and operation in optical networks.

d. Optoelectronics: solar cell design, fabrication, device performance, packaging, and interface issues
relating to passivation (both chemical and electric field enhanced).


d. Technology: Light projectors for display and the color wheel, phosphor technology, high power visible
lasers for projection, and the associated packaging of the modules/projectors for efficient cost design.

d. Technology: Visible GaN based LEDs and various packaging optical lens designs for directing and
re-directing LED light output with applications in street lighting.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.

d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components. Noise suppression using EMI between electrical
components and connectors.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology.

d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD

d. Technology: Analysis of coding for fiber optic communications, specifically in relation to the standardization process for the Telecommunication Standardization Sector of the International Telecommunications Union (“ITU-T”), including the ITU-T’s G.709: Interfaces for the optical transport network standard (“G.709” or “the G.709 Standard”). In particular, the technical issues that relate to OTN hierarchy; functionality of the overhead in support of multi-wavelength optical
networks; frame structures, bit rates, and formats for mapping client signals.

d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.

d. Technology: LIDAR technology for motor vehicles that includes fiber amplifiers, LIDAR hardware,
laser diodes, photodetectors, fiber links, and free space communications.

d. Technology: Active optical cables with embedded silicon modulator ICs, copper cable, fiber optic cable, VCSEL laser diodes, photodetectors and cable sheathing for consumer applications such as gaming, HDMI, USB, etc.

d. Technology: LED lighting, LED chips, LED packages and LED packaging technologies such as
molding, glob-top, substrates, die mounting, optical reflectors, and electrical interconnect layouts.

d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting.
Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.

d. Technology: Image sensor modules, cameras in PCs/laptops, consumer products, tear downs, optical
lenses, optical packaging, optical alignment.

d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting.
Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.

d. Technology: LED lighting, LED chips, LED packages and LED packaging technologies such as leadframes, molding, glob-top, substrates, die mounting, optical reflectors, and electrical interconnect
layouts.

d. Technology: TV displays, OLEDs, LCDs, color gamut, and quality of RGB/white color as per CIE charts and colorimetry (NTSC, sRGB, AdobeRGB etc,.). Analysis of CHL (constant hue locus), quantum dots, nano-crystals, nano-devices, nano-structures to improve light quality output.

d. Technology: Fluid lenses, and optical lenses with controlled focus facilities. Packaging of fluid lenses using piezoelectric actuators, and hermetic chambers. Deformable surfaces using micro-fluidics.


d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.

d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.

d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.

d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.

d. Technology: LED chips, LED packaging with metallic electrodes, flip-chip solder bumping, and doping of semiconductors for electrical conduction.

d. Technology: Silicon based solar/photovoltaic cells and modules that include fabrication techniques such as deposition, diffusion, wet/dry etching of nanostructures, nanowires, and nano-structures, nanofeatures, black silicon, monocrystalline wafers, and polysilicon fabrication.

d. Technology: Image sensor modules, cameras in PCs/laptops, consumer products, tear downs, optical
lenses, optical packaging, optical alignment.

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs

d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs


d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs

d. Technology: Automotive sensors, cameras, electronic circuitry, controls, packaging, surround view camera systems.

d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting. Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.

d. Technology: Thermal, gas, and flow sensing for use in designing and manufacturing equipment used
in semiconductor chip manufacturing. In particular, review of data relating to the simulation of finite
element analysis (“FEA”) and computational fluid dynamics (“CFD”) data for gases, temperature, and
stress with actual sensor data that could be intelligently integrated, customized, installed, tested,
verified, and validated.

d. Technology: Optical PON for high-speed data FTTH evaluation, testing, and analysis.

d. Technology: High volume fiber optic transceivers for EPON/GPON with: CDR circuits, ‘Intelligencein-the-Module’ and ‘M-ary’ families.

d. Technology: LED based light bulbs, LED chips that emit in the UV and visible, LED arrays, LED
packaging including phosphors and encapsulants, and the type of phosphors utilized for different
emission. In particular, phosphors that are activated by dopants such as Europium (Eu), Manganese
(Mn) and the associated ions for these materials e.g. Mn2+, Mn3+, Mn4+, Mn6+, etc. Included
analysis of InGaN and AlGaN based epitaxial material systems, and the use of phosphors in high
pressure mercury vapor lamps.

d. Technology: Digital camera operation including optical focus, image sensing, optical train, depth of
field, exposure time, different focus and focal areas of a portion of the image, general photography
and optical principles.

d. Technology: Digital camera operation including optical focus, image sensing, optical train, depth of
field, exposure time, different focus and focal areas of a portion of the image, general photography
and optical principles.

d. Technology: Ultra-sonic equipment that includes displays, especially OLED displays. The electronic
circuits and how displays are electronically controlled.

d. Technology: LED surface mount packaging, LED GaN/InGaN chips, and associated LED lighting
performance specifications.

d. Technology: LED surface mount packaging, LED GaN/InGaN chips, and associated LED lighting
performance specifications. LED Luminaires.

d. Technology: LED surface mount packaging, LED GaN/InGaN chips, GaN/InGaN epitaxial growth,
fabrication, device design and packaging. LED luminaires.

d. Technology: LED surface mount packaging, LED GaN/InGaN chips, GaN/InGaN epitaxial growth,
fabrication, device design and packaging. LED Luminaires.

d. Technology: acoustic wave filters, BAW filters (bulk-acoustic-wave) filters for RF applications,
devices, fabrication, and character.

Xster impressive

[StevenDice]

“You are truly delusional.”

Yes, this why I became spiritguide and brought tidings from the third realm of photonic enlightenment, where all delusions are not only real, but amplified.

I found it hard to outdo Proto, however. He channels the third realm like none other.