This is List of the companies that have consulted with him and retained him as an Expert in Legal matters.
I finished grabbing the technology list and am posting a complete list that Lebby has been called on by the industry in the past as an expert witness. I'd say that we have some pretty impressive investors on here and some even apparently know better how the industry operates and how to introduce EO Polymers to it. I'd like to see a list of the technology or subjects the smartest kid in the class here have been asked to legally be relied on.
Honestly it doesn't even have to be related to this industry, it could be anything, automotive, production, aerospace, medical related. Just copy from your resume and post.
Waiting......... Wait until I list the companies, entities countries who have called on Lebby for the following Technologies.
c. Technology: Optoelectronics (optical storage, fiber optic communications, sensors, high power lasers,
LED lighting, LED luminaires etc.).
c. Technology: semiconductor lasers/VCSELs, fiber optic transceiver modules
c. Technology: CMOS image sensors; design and fabrication
c. Technology: LEDs, device design, color gamut, packaging, optical lensing, lead frames, surface
mount packaging.
c. Technology: Fiber optic networks, optical switches, ROADMs and optical filters (dielectric based).
c. Technology: Wavelength optical switches, optical filters, and optical components, liquid crystal
technology.
c. Technology: IC design, layout, and operation; especially laser driver chips for VCSELs. High speed
laboratory testing.
c. Technology: Bar code scanners and associated optics such as imagers, lasers, LEDs, molded optics.
Laboratory testing.
c. Technology: IC design, layout, and operation; especially laser driver chips for VCSELs. High speed
laboratory testing.
c. Technology: CD, CVD, BluRay optical disk drives, optical components, laser diodes, and optical
beam patterns. Laboratory testing of visible optics.
c. Technology: LED backlights for vehicles; LED package and optical module/LED luminaire design.
c. Technology: LED backlights for vehicles; LED package and optical module/luminaire design.
c. Technology: Photonic Integrated Circuits using InP (Indium Phosphide); lasers, detectors,
waveguides, mux/demux, spot size converters.
c. Technology: LED devices, packages and modules/luminaires for vehicles.
c. Technology: LEDs for mobile phones; LED epitaxial layers, device designs, optical lensing,
packaging. Laboratory reverse engineering using TEM/SEM/EDAX etc.
c. Technology: GaN buffer layers for LEDs, and associated technical marketing, sales and import
process into USA.
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Optical storage using laser diodes, photodetectors and optical materials
d. Technology: Proximity sensors using LEDs, photodetectors and innovative semiconductor packaging.
d. Technology: High power lasers (YAG, CO2) to engrave and scribe dental orthodontic brackets.
d. Technology: Trade secret MOCVD epitaxial growth techniques for high power GaN/InGaN LED technology, luminaires, modules and packaging.
d. Technology: GaN/InGaN LEDs on structured substrates with reverse engineering laboratory analysis.
d. Technology: Proximity sensors for mobile phones.
d. Technology: Fiber optic transceiver modules.
d. Technology: High power gas laser design and operation.
d. Technology: LED packaging for illumination. LED luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: Electrical connector, IC, and LED light product design including luminaires.
d. Technology: High performance GaN based RF FET device design and operation.
d. Technology: Laser/photodetector based LIDAR design and operation for self-driving vehicles.
d. Technology: LED based luminaire design for lighting.
d. Technology: Optical and electrical device, optics, and package designs for LIDAR based self-driving
vehicles.
d. Technology: Optoelectronic based proximity sensors using LEDs and photodetectors.
d. Technology: Coding designs of optical digital signals for high performance optical networks.
d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.
d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.
d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.
d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.
d. Technology: High power grating surface emitter laser diodes, and associated packaging and device
design for laser-based cooking ovens.
d. Technology: Fiber optic based optical communications for coherent technologies
d. Technology: Fiber optic based optoelectronic semiconductor component design and operation.
d. Technology: Fiber optic based optoelectronic semiconductor component design and operation.
Including both direct detect and coherent communications, and encoding techniques such as PSK,
QPSK, AM, FM etc.
d. Technology: High volume, low cost optical lens and optics technology.
d. Technology: Bar-code scanners and associated optical/optoelectronic component performance and
operation.
d. Technology: Fabrication, design, and reverse engineering of silicon-based FET ICs.
d. Technology: Fabrication, design, characterization, and packaging of silicon-based FET ICs for power
applications
d. Technology: Design and packaging of high brightness GaN based LEDs for luminaires.
d. Technology: Submarine and subsea fiber optic cables: technology, markets, economic impact, and
history.
d. Technology: Design and packaging of high brightness GaN based LEDs for luminaires.
d. Technology: Large LED Panels, LED displays, LED modular panel design, LED thermal engineering
and color displays for outdoor environments.
Technology: CMOS device (inc FinFETs) and IC fabrication techniques at 40, 28, 20, 16nm nodes.
d. Technology: High brightness InGaAlP, GaP, AlGaAs, and GaN/InGaN based LEDs for use in medical
instruments
d. Technology: LIDAR optical and electronic component and system technology
d. Technology: Trade Secret GaAs based solar cell design, fabrication, manufacturing, and device
performance
d. Technology: Fiber optic connectors, panels, and distribution switches using optoelectronic
components.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
IPR2023-00475
HKC v. 138 East
Ex. 2001 - Page 092
Page 13
d. Technology: Semiconductor displays using active matrix LCD and thin film transistor technology.
Design, fabrication, and circuit layout.
d. Technology: Semiconductor displays using active matrix LCD and thin film transistor technology.
Design and fabrication technology.
d. Technology: LED lighting, LED luminaires, LED performance, electrical and mechanical design and
construction.
d. Technology: LEDs for mobile phones
d. Technology: LED chips, LED packaging, LED lenses, LED luminaires, backlights, displays, and
televisions/monitors
c. IPR/PTAB trial/deposition: 0 (Cumulative total: 4)
d. Technology: Silicon solar cells and materials analysis of passivation layers
d. Technology: Fiber optic based optoelectronic semiconductor component and transceiver design/
operation.
d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology.
d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology
d. Technology: Fiber optic based optoelectronic semiconductor components, transceivers, and subsystems.
d. Technology: LED design patent, and the design of an aftermarket LED based headlight assembly for
an automobile.
d. Technology: LED chips, LED packaging and ceramic thermal heat sinking technology (LTCC).
d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components.
d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.
d. Technology: Silicon solar cells and materials analysis of passivation layers
d. Technology: Silicon solar cells and materials analysis of passivation layers
d. Technology: Optical filters and optical sensor systems, design and fabrication of dielectric materials
for passband filters in applications such as optical communications, imaging, sensing, medical,
automotive.
d. Technology: Fiber optic adapters, fiber optic connectors (simplex, duplex, quad, multi-fiber), fiber
trays, racks, and fiber cabinet equipment.
e. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.
d. Optoelectronics, LEDs, lead frame packaging, optics, optical lenses, GaN (Gallium Nitride), optical
transparency
d. Technology: Silicon CMOS image sensors, drive electronics, smart pixels and CCD technology
d. Technology: Touch sensor (resistive, optical, and capacitive) technology for mobile displays.
Analysis of display, electronic, and optical technologies.
d. Optoelectronics; solar cell design, fabrication, device performance, packaging, and interface issues
relating to passivation (both chemical and electric field enhanced).
d. Technology: Fiber optic based optoelectronic semiconductor component design and operation,
especially phase shift keying (PSK, QPSK) and phase based coherent communications.
d. Technology: Fiber optic wavelength selective switches (WSS), reconfigurable add-drop multiplexors
(ROADMs), and their design. Technical issues include polarization, wavelength selection, coupling,
mux/demux and operation in optical networks.
d. Optoelectronics: solar cell design, fabrication, device performance, packaging, and interface issues
relating to passivation (both chemical and electric field enhanced).
d. Technology: Light projectors for display and the color wheel, phosphor technology, high power visible
lasers for projection, and the associated packaging of the modules/projectors for efficient cost design.
d. Technology: Visible GaN based LEDs and various packaging optical lens designs for directing and
re-directing LED light output with applications in street lighting.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology. Technical history of CCD v. CMOS image sensors in the 1990s and associated
performance criteria.
d. Technology: Electrical and fiber optic connectors, panels, and distribution switches using both
electronic and optoelectronic components. Noise suppression using EMI between electrical
components and connectors.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
technology.
d. Technology: Hand-held silicon CMOS image sensors, drive electronics, smart pixels and CCD
d. Technology: Analysis of coding for fiber optic communications, specifically in relation to the standardization process for the Telecommunication Standardization Sector of the International Telecommunications Union (“ITU-T”), including the ITU-T’s G.709: Interfaces for the optical transport network standard (“G.709” or “the G.709 Standard”). In particular, the technical issues that relate to OTN hierarchy; functionality of the overhead in support of multi-wavelength optical
networks; frame structures, bit rates, and formats for mapping client signals.
d. Technology: LED chips, LED packaging and light bulb filaments with transparent sub-mounts.
d. Technology: LIDAR technology for motor vehicles that includes fiber amplifiers, LIDAR hardware,
laser diodes, photodetectors, fiber links, and free space communications.
d. Technology: Active optical cables with embedded silicon modulator ICs, copper cable, fiber optic cable, VCSEL laser diodes, photodetectors and cable sheathing for consumer applications such as gaming, HDMI, USB, etc.
d. Technology: LED lighting, LED chips, LED packages and LED packaging technologies such as
molding, glob-top, substrates, die mounting, optical reflectors, and electrical interconnect layouts.
d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting.
Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.
d. Technology: Image sensor modules, cameras in PCs/laptops, consumer products, tear downs, optical
lenses, optical packaging, optical alignment.
d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting.
Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.
d. Technology: LED lighting, LED chips, LED packages and LED packaging technologies such as leadframes, molding, glob-top, substrates, die mounting, optical reflectors, and electrical interconnect
layouts.
d. Technology: TV displays, OLEDs, LCDs, color gamut, and quality of RGB/white color as per CIE charts and colorimetry (NTSC, sRGB, AdobeRGB etc,.). Analysis of CHL (constant hue locus), quantum dots, nano-crystals, nano-devices, nano-structures to improve light quality output.
d. Technology: Fluid lenses, and optical lenses with controlled focus facilities. Packaging of fluid lenses using piezoelectric actuators, and hermetic chambers. Deformable surfaces using micro-fluidics.
d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.
d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.
d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.
d. Technology: LED products, LED circuits, including both DC and AC circuit design. LED color emission, white light, color mixing, CIE charts, and black body radiators for color temperature.
d. Technology: LED chips, LED packaging with metallic electrodes, flip-chip solder bumping, and doping of semiconductors for electrical conduction.
d. Technology: Silicon based solar/photovoltaic cells and modules that include fabrication techniques such as deposition, diffusion, wet/dry etching of nanostructures, nanowires, and nano-structures, nanofeatures, black silicon, monocrystalline wafers, and polysilicon fabrication.
d. Technology: Image sensor modules, cameras in PCs/laptops, consumer products, tear downs, optical
lenses, optical packaging, optical alignment.
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, active regions, cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: LED based light bulbs, LED chips, LED arrays, LED packaging, flip-chip packaging, chip-on-board, heat sinks, GaN, InGaN, AlGaN (Gallium Nitride, Indium Gallium Nitride, Aluminum Gallium Nitride) epitaxial layers, GaN fabrication, LED quantum well active regions, LED cladding layers, optical mirrors, DBRs
d. Technology: Automotive sensors, cameras, electronic circuitry, controls, packaging, surround view camera systems.
d. Technology: LED lighting and LED packaging technologies for T8 and T12 form factor tube lighting. Technologies such as LED luminaire/tube packaging, mechanical structure, thermal heat dissipation, electronic circuitry, printed circuit boards, and LED chips.
d. Technology: Thermal, gas, and flow sensing for use in designing and manufacturing equipment used
in semiconductor chip manufacturing. In particular, review of data relating to the simulation of finite
element analysis (“FEA”) and computational fluid dynamics (“CFD”) data for gases, temperature, and
stress with actual sensor data that could be intelligently integrated, customized, installed, tested,
verified, and validated.
d. Technology: Optical PON for high-speed data FTTH evaluation, testing, and analysis.
d. Technology: High volume fiber optic transceivers for EPON/GPON with: CDR circuits, ‘Intelligencein-the-Module’ and ‘M-ary’ families.
d. Technology: LED based light bulbs, LED chips that emit in the UV and visible, LED arrays, LED
packaging including phosphors and encapsulants, and the type of phosphors utilized for different
emission. In particular, phosphors that are activated by dopants such as Europium (Eu), Manganese
(Mn) and the associated ions for these materials e.g. Mn2+, Mn3+, Mn4+, Mn6+, etc. Included
analysis of InGaN and AlGaN based epitaxial material systems, and the use of phosphors in high
pressure mercury vapor lamps.
d. Technology: Digital camera operation including optical focus, image sensing, optical train, depth of
field, exposure time, different focus and focal areas of a portion of the image, general photography
and optical principles.
d. Technology: Digital camera operation including optical focus, image sensing, optical train, depth of
field, exposure time, different focus and focal areas of a portion of the image, general photography
and optical principles.
d. Technology: Ultra-sonic equipment that includes displays, especially OLED displays. The electronic
circuits and how displays are electronically controlled.
d. Technology: LED surface mount packaging, LED GaN/InGaN chips, and associated LED lighting
performance specifications.
d. Technology: LED surface mount packaging, LED GaN/InGaN chips, and associated LED lighting
performance specifications. LED Luminaires.
d. Technology: LED surface mount packaging, LED GaN/InGaN chips, GaN/InGaN epitaxial growth,
fabrication, device design and packaging. LED luminaires.
d. Technology: LED surface mount packaging, LED GaN/InGaN chips, GaN/InGaN epitaxial growth,
fabrication, device design and packaging. LED Luminaires.
d. Technology: acoustic wave filters, BAW filters (bulk-acoustic-wave) filters for RF applications,
devices, fabrication, and character.
Xster impressive
