Replies to post #185939 on Lightwave Logic Inc (LWLG)

[jeunke22]

Wouldn’t that be solved in the PDK? Seems a none issue to bring it up here.

[prototype_101]

druid said, it's related to common assembly processes in which sub-assemblies get soldered into place through use of a reflow oven.

and so it seems you believe that Lebby would somehow have overlooked the "common assembly process" in his grand plan of making LWLG Ubiquitous using large Foundries for production process?

[KCCO7913]

Thanks.

I just peeked at a 2022 conference paper ;) using Perkinamine and it mentions the Td is at least 225 degrees.

Interestingly, LWLG’s latest OFC presentation is the first time they added the Td to their r33 and Tg box plot graph. The Td appears to be just about 260 degrees with slim margins for 2024 data.

[prototype_101]

once again you seem to want to imply that Lebby is too stoopid to plan one move in advance, here again

druid said, it's related to common assembly processes in which sub-assemblies get soldered into place through use of a reflow oven.

and so it seems you believe that Lebby would somehow have overlooked the "common assembly process" in his grand plan of making LWLG Ubiquitous using large Foundries for production process?

MAX Solder Reflow temperature is 225 degrees so well within what Lebby just reported at OFC

see graph on page 4

https://docs.broadcom.com/doc/PACKAGING-AN101-RDS.pdf

KCC said, Interestingly, LWLG’s latest OFC presentation is the first time they added the Td to their r33 and Tg box plot graph. The Td appears to be just about 260 degrees with slim margins for 2024 data.

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