Replies to post #185943 on Lightwave Logic Inc (LWLG)

[DruidElf44]

260C is the right ballpark, probably not a coincidence? But would be good to have some headroom.

[prototype_101]

MAX Solder Reflow temperature is 225 degrees so well within what Lebby just reported at OFC

see graph on page 4

https://docs.broadcom.com/doc/PACKAGING-AN101-RDS.pdf

KCC said, Interestingly, LWLG’s latest OFC presentation is the first time they added the Td to their r33 and Tg box plot graph. The Td appears to be just about 260 degrees with slim margins for 2024 data.