Foundries in general advertise 3-12 months turnaround time. Depends on the foundry. You could pay more to expedite but supposedly it is very expensive. Dicing the wafer doesn’t take a meaningful amount of time. The time to get the chips into a packaged transceiver? That’s unknown for us. That is the phase we’re at now.
Your first question in #2 is partly answered with yesterday’s PR. We were also told in December 2022 that LWLG initiated work with a transceiver maker during 2022. So I’d guess that you can be damn sure some of these packaged modulators are being put inside prototype transceivers today. Where are they exactly in the process? Well, the latest we’ll get that answer is May 22nd.
We don’t know when “enough is enough” in terms of data collection and how much is needed to get the end-user to sign a purchase contract. Again, the latest we get that answer is May 22nd.
There is a huge amount of effort happening to get this technology commercialized. LWLG, it’s transceiver partner(s), the foundry(s).
Nothing but progress. There is no way this company fails. All evidence so far is pointing to it being a success. Tomorrow? Next year? We don’t know exactly when.
Luckily for LWLG and us, the company currently has cash on hand to take it through Summer 2025 with remaining available capital to get through 2027. I’m not saying I accept this as a status quo…but we’re in a very nice position.
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