In response to question from Mossesmann at 1:28
[After explaining that they had to change the thermal envelope for the platform of both products (Prescott and Dothan) "slightly" -- so that they could be sure that the platform would have enough "headroom."]
...After that he said this, "Both products are very sound. We're finishing up the last bit of circuit work to make sure we can enable very high volume manufacturing."
TRANSLATION: Neither product is ready for high volume manufacturing.
Also, considering the "headroom" comment, one way to have a smaller reduction in the thermal envelope is to reduce your assumptions about the headroom, i.e., higher frequencies for the product.
Petz