Advanced Micro Devices Inc (AMD)

[Petz]

In response to question from Mossesmann at 1:28

[After explaining that they had to change the thermal envelope for the platform of both products (Prescott and Dothan) "slightly" -- so that they could be sure that the platform would have enough "headroom."]

...After that he said this, "Both products are very sound. We're finishing up the last bit of circuit work to make sure we can enable very high volume manufacturing."

TRANSLATION: Neither product is ready for high volume manufacturing.

Also, considering the "headroom" comment, one way to have a smaller reduction in the thermal envelope is to reduce your assumptions about the headroom, i.e., higher frequencies for the product.

Petz