Replies to post #13204 on Advanced Micro Devices Inc (AMD)

[Elmer Phud]

kpf -

I do not see any unsurmountable obstacle to prevent AMD from testing HT-channels before bonding out. I have no idea if that can be done at wafer sort or requires an additional step (maybe even an additional tool) in a later stage of the backend process before bonding out.

You see no insurmountable obstacle yet you have no idea how it's done... Interesting...

[Golfbum]

so we have a wide highspeed datapath that is supposed to be "bonded out" over multiple pin possibilities?

you must be kidding!

gb