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kpf

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kpf

Re: chipguy post# 13200

Monday, 09/15/2003 4:24:49 AM

Monday, September 15, 2003 4:24:49 AM

Post# of 97585
chipguy

I do not see any unsurmountable obstacle to prevent AMD from testing HT-channels before bonding out.

I have no idea if that can be done at wafer sort or requires an additional step (maybe even an additional tool) in a later stage of the backend process before bonding out.

K.




Facts are irrelevant to the emotional brain

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