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Elmer Phud

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Elmer Phud

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Re: kpf post# 13204

Monday, 09/15/2003 10:03:55 AM

Monday, September 15, 2003 10:03:55 AM

Post# of 97585
kpf -

I do not see any unsurmountable obstacle to prevent AMD from testing HT-channels before bonding out. I have no idea if that can be done at wafer sort or requires an additional step (maybe even an additional tool) in a later stage of the backend process before bonding out.

You see no insurmountable obstacle yet you have no idea how it's done... Interesting...


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