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Wednesday, March 27, 2024 9:42:36 AM
And who just announced 200G per lane modulators manufactured ON a 200mm wafer?
In contrast, here’s what the Pr (written by Marcelli perhaps?) said, with my emphasis to highlight the differences:
results BASED ON a novel packaged heterogeneous polymer EO modulator DESIGN leveraging silicon photonics devices from a 200mm production foundry process
Do you see how much less clear the PR is than what you said? You said it in plain English. But the PR leaves it open for interpretation that it was a test based on designs that were in house that leveraged the modulators on wafers that could run 4×50 or 4×100 but not 4×200
The word “leverages” implies an extension of the usage as opposed to direct usage.
My interpretation certainly could be wrong. Has he told you directly that these tests were on those modulators ? because I do not feel like he told shareholders that directly.
This may seem like an effort to twist the interpretation and I will grant some of the other wording in the PR does seem more direct, but again, why didn’t he just say so directly?
You often chalk it up to “poor communication” but I don’t agree. Their history of intentional obfuscation is rather obvious imo should not be denied and it may well be happening once again:
“..we are on-track with those goals” instead of “We are making progress towards the yearly goals, and though there have been some setbacks we expect to achieve them by the end of 2022”
“We have ..expanded our laboratory space” instead of “we have contracted to expand our laboratory space by August and possibly sooner”
“commercial acceptance” as a reason to not review annual goals instead of “we will not review our goals for sensitive competitive reasons”
“ several commercial foundries are implementing” instead of what they changed to less than one month later for the annual letter “we are planning to implement” (good for them on that one!)
And lastly, when the price was going to the dogs in December “..working hard to close additional agreements by year end” instead of “we are working hard to sign agreements with potential partners, and will be delighted to share those results if and when they materialize”
And now “BASED ON .. A DESIGN LEVERGING modulators” instead of “200G per lane modulators manufactured ON a 200mm silicon wafer”
Given the latest language of “we are planning to implement” the above analysis should be taken seriously.
Now that I spelled it out are you still laughing because these kinds of misstatements intentional or not should never happen when it’s very simple to just say things in a straightforward manner so that shareholders what is really going on. To that point I’ll also note that the claim of full wafer poling with thousands of units has never been made public. Shareholders should not have to rely on secondhand reporting to determine whether this has happened or not. It should be publicized. it seems reasonable to speculate that this was not a bombshell announcement at all due to details not divulged
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