Lightwave Logic Inc (LWLG)

[prototype_101]

that was before Ayars big issues were discovered/revealed a few months later....

excerpts from Ayars recent paper (Rut-Roh),

. For example, it has been challenging for this technology to achieve 25 Gb/s modulation even into relatively small photonic loads such as ring-based optical modulators

. However, a major challenge in monolithic integration is that process optimizations for photonics and electronics cannot be performed independently of each other. As such, the transistors in monolithic platforms tend to derive from older CMOS processes, where transistor properties are not so sensitive to fabrication changes for photonics

Due to the limited transistor speed scaling in advanced processes, and relative increase in transistor and interconnect parasitics, link speeds in excess of 50 Gsymbol/s will be highly energy inefficient, while links above 100 Gsymbol/s will be very difficult to realize. Utilizing the microring-based DWDM technology with large bandwidth density allows for line rates per wavelength to stay in the energy-efficient regime of around 25 Gsymbol/s, while growing the overall system throughput by adding more wavelengths

Meanwhile... LWLG now PERFECTLY POSITIONED!

ASM Q&A at about 1:01:01 Dr Lebby talks about how LWLG's technology is perfectly positioned for the Photonics Industry's rapid trend towards CO-PACKAGING

Listen to what Dr Lebby's said, "co-packaging is where you bring the optics right next to the electronic chip, the CMOS chip, in fact, you put it actually on the chip, so you want to make that inter-connect as short as you can, so that the interaction between the electronics and the photonics is as close as possible, and if you think about our technology for a second, we've got a spin-on polymer technology that you can spin on to IC's and CMOS, so we are ideally positioned to harness the co-packaging trend that is occurring, so yes, I am watching the competition in terms of the materials and the performance of the devices, but we're also watching how it gets packaged together, and we are actually ideally positioned for this new trend that's just occurring where other technologies are going to suffer, and so yes it's not just the materials, it's not just the device's but you have to look at the packaging too, and you have to look at where all the fronts are, and where the technologies are progressing and at what rate, and the conclusion is that mother nature is working with us on a number of different fronts, and that's really really exciting!

Ok, so WHY do you think the trend has rapidly shifted to CO-PACKAGED optics/electronics, and NOT to a monolithic chip like Ayars is pursuing?

The word from within the Industry is because the monolithic attempts are FAILING, they are having big issues with accelerated aging! See what Andrew Rickman said here,

https://investorshub.advfn.com/boards/read_msg.aspx?message_id=148935552