Advanced Micro Devices Inc (AMD)

[chipguy]

Being unable to test before bonding out would make the whole concept of redundancy in chip-design obsolete.

Try reading what I wrote again but more slowly. I didn't say
it would be impossible to test HT at all at wafer sort, I said
it was probably impossible to achieve comprehensive parametric
testing at wafer sort.

Some things are easy to test at wafer sort and other things
are very difficult if not impossible. The purpose of wafer sort
is to quickly check for easy to check things that indicate a
defective die. Redundancy is usually used with functions like
on-chip memory that are relatively easy to check and diagnose
at wafer sort. I don't think HT links will fall in that
category.