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Do you happen to have a link? I'm not an accountant and all I found was this so far:
https://www.investopedia.com/articles/stocks/08/reverse-merger.asp#:~:text=A%20percentage%20of%20the%20losses%20can%20be%20carried%20forward%20and%20applied%20to%20future%20income
Why don't you buy them all up before they're gone!!!
Gladly. Except sorry I'm not a moderator.
Requesting this post be stickied to the top of the board. It has 53 "likes" so far. https://investorshub.advfn.com/boards/read_msg.aspx?message_id=173597950 Also, a new post on revenue projections would be great to replace the one that would be lost. Many thanks!!!
We have posters admitting market manipulation here on iHub, an alleged illegal activity. Follow the link: SEC Enforcement Action Involving Social Media and Market Manipulation
https://www.sec.gov/oiea/investor-alerts-bulletins/ia-rumors#:~:text=SEC%20Enforcement%20Action%20Involving%20Social%20Media%20and%20Market%20Manipulation
Do we have a date for the ASM yet?
Sure doesn't explain the 22 million short shares. I'd always assumed it was a bunch of market makers left holding the short bag, but since they're not accounted for we can only guess.
https://fintel.io/ss/us/lwlg
Funds Shorting Lightwave Logic Inc
https://fintel.io/sosh/us/lwlg
Did you miss it? Traders brace for chaotic ‘triple witching’ Friday as $5 trillion in expiring options collides with index-rebalancing mania https://www.marketwatch.com/story/traders-brace-for-chaotic-triple-witching-friday-as-5-trillion-in-expiring-options-collides-with-index-rebalancing-mania-1b4c4791
News? You must have been asleep. Here, let me help you:
Recent Significant Events and Milestones Achieved
During February and March 2018, we moved our Newark, Delaware synthetic laboratory and our Longmont, Colorado optical testing laboratory
and corporate headquarters to office, laboratory and research and development space located at 369 Inverness Parkway, Suite 350, Englewood, Colorado.
The Englewood facility includes fully functional 1,000 square feet of class 1,000 cleanroom, 500 square feet of class 10,000 cleanroom, chemistry
laboratories, and analytic laboratories.
In August 2018 we completed (ahead of schedule) our fully equipped on-site fabrication facility to expand our highspeed test and design capabilities. In August 2023, we completed new laboratory production facilities, expanding the Englewood facility by over 65%,
nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including enabling commercial device testing
and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's chemical synthesis production line.
Our Englewood facility streamlines all of our Company’s research and development and production workflow for greater operational efficiencies
During March 2018, our Company, together with our packaging partner, successfully demonstrated packaged polymer modulators designed for
50Gbaud, which we believe will allow us to scale our P
2
IC™ platform with our Mach-Zehnder ridge waveguide modulator design as well as other
photonics devices competitively in the 100Gbps and 400Gbps datacom and telecommunications applications market. We are currently fine-tuning the
performance parameters of these prototypes in preparation for customer evaluations.
During June 2018, our Company Acquired the Polymer Technology Intellectual Property Assets of BrPhotonics Productos Optoelectrónicos S.A.,
a Brazilian corporation, which significantly advanced our patent portfolio of electro-optic polymer technology with 15 polymer chemistry materials,
devices, packaging and subsystems patent and further strengthened our design capabilities to solidify our market position as we prepare to enter the
400Gbps integrated photonics marketplace with a highly competitive, scalable alternative to installed legacy systems.
Also, during June 2018, our Company promoted polymer PICs and Solidified Polymer PICs as Part of the Photonics Roadmap at the World
Technology Mapping Forum in Enschede, Netherlands, which includes our Company’s technology of polymers and polymer PICs that have the potential to
drive not only 400Gbps aggregate data rate solutions, but also 800Gbps and beyond.
In August 2018 we announced the completion (ahead of schedule) of our fully equipped on-site fabrication facility, where we are expanding our
high-speed test and design capabilities. We also announced the continuation of the building of our internal expertise with the hiring of world-class technical
personnel with 100Gbps experience. In August 2023, we announced the completion of new laboratory production facilities, expanding our corporate
headquarters by over 65%, nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including
enabling commercial device testing and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's
chemical synthesis production line.
In February 2019 we announced a major breakthrough in our development of clean technology polymer materials that target the insatiable demand
for fast and efficient data communications in the multi-billion-dollar telecom and data markets supporting Internet, 5G and IoT (Internet of Things)
webscale services. The improved thermally stable polymer has more than double the electro-optic response of our previous materials, enabling optical
device performance of well over 100 GHz with extremely low power requirements. This addition to the family of PerkinamineTM polymers will hold back
run-away consumption of resources and energy needed to support ever-growing data consumption demands. We continue to conduct testing of the material
and assessment of associated manufacturing processes and device structures prior to release to full development.
In March 2019 we created an Advisory Board comprised of three world-class leaders in the photonics industry: Dr. Craig Ciesla, Dr. Christoph S.
Harder, and Mr. Andreas Umbach. In January 2022 Dr. Ciesla was named to our Board of Directors, and our Advisory Board is currently comprised of Dr.
Franky So, Dr. Christoph S. Harder, Mr. Andreas Umbach and Dr. Joseph A. Miller, who is a former member of our Board of directors. The Advisory
Board is working closely with our Company leadership to enhance our Company’s product positioning and promote our polymer modulator made on our
proprietary Faster by Design™ polymer P
2
IC™ platform. The mission of the Advisory Board is initially to increase our Company’s outreach into the
datacenter interconnect market and later to support expansion into other billion-dollar markets. The Advisory Board members have each been chosen for
their combination of deep technical expertise, breadth of experience and industry relationships in the fields of fiber optics communications, polymer and
semiconductor materials. Each of the Advisory Board members has experience at both innovators like Lightwave Logic and large industry leaders of the
type most likely to adopt game-changing polymer-based products. In addition, they possess operational experience with semiconductor and polymer
businesses.
Also, in March 2019, our Company received the “Best Achievement in PIC Platform” award for our 100 GHz polymer platform from the PIC
International Conference. The award recognizes innovative advances in the development and application of key materials systems driving today’s photonic
integrated circuits (PICs) and providing a steppingstone to future devices.
During the second quarter of 2019, our Company promoted its polymers at CoInnovate in May and the World Technology Mapping Forum in
June. CoInnovate is a meeting of semiconductor industry experts. The World Technology Mapping Forum is a group authoring a photonics roadmap out to
2030.
25
In September 2019 at the prestigious European Conference on Communications (ECOC) in Dublin, Ireland, we showed measured material
response over frequency and the resulting optical data bits stream on our clean technology polymer materials, the newest addition to our family of
PerkinamineTM polymers, that meet and exceed of our near-term target speed of 80 GHz. We also released data demonstrating stability under elevated
temperatures in the activated (poled to create data carrying capability) state.
In October 2019, we reported that energy-saving polymer technology is highlighted in the recently published Integrated Photonics Systems
Roadmap - International (IPSR-I). The roadmap validates the need for low-voltage, high-speed technologies such as ours.
In May 2020, we announced that our latest electro-optic polymer material has exceeded target performance metrics at 1310 nanometers (nm), a
wavelength commonly used in high-volume datacenter fiber optics. This material demonstrates an attractive combination at 1310 nm of high electro-optic
coefficient, low optical loss and good thermal stability at 85
0 Celsius. The material is expected to enable modulators with 80 GHz bandwidth and low drive
power, and has an electro-optic coefficient of 200 pm/V, an industry measure of how responsive a material is to an applied electrical signal. This metric,
otherwise known as r33, is very important in lowering power consumption when the material is used in modulator devices. This technology is applicable to
shorter reach datacenter operators, for whom decreasing power consumption is imperative to the bottom line of a facility. We considered this a truly historic
moment—not only in our Company’s history, but in our industry–as we have demonstrated a polymer material that provides the basis for a world-class
solution at the 1310 nm wavelength, something which other companies have spent decades attempting to achieve.
In July 2020, we announced the official launch of our new corporate website www.lightwavelogic.com, reflecting ongoing efforts to provide upto-date information for investors and potential strategic partners. The revamped website offers a clean, modern design integrated with helpful tools and
investor relations resources, including a new corporate explainer video, to illustrate the target markets and advantages of Lightwave Logic’s proprietary
electro-optic polymers.
In August 2020, we announced the addition of Dr. Franky So, a leading authority in the OLED industry, to our Advisory Board. Dr. So is the
Walter and Ida Freeman Distinguished Professor in the Department of Materials Science and Engineering at North Carolina State University. Previously, he
was the Head of Materials and Device research for OLEDs at OSRAM Opto Semiconductors, as well as Motorola’s corporate research lab in the 1990s. Dr.
So was an early researcher in electro-optic (EO) polymer modulators at Hoechst Celanese. As a member of the Company’s advisory board, Dr. So will
work closely with management to enhance Lightwave’s product positioning for, as well as the promotion of, its polymer modulators made on its proprietary
platform. In addition, he will provide technical support and advisory services to the Lightwave materials and device teams.
On October 7, 2020 we announced the receipt of U.S. Patent number 10,754,093 that improves both the performance and reliability of our highspeed, low-power electro-optic polymer modulators intended for datacenter and telecommunications applications. The patent allows multi-layered electrooptic polymer modulators to perform more efficiently through the design of custom interfaces. These interfaces are designed into the cladding layers that
allow optical transmission, electrical conductivity, material integrity, as well as a prevention of solvents affecting adjacent polymer materials. The net
impact of all of this allows for our Company’s modulators to improve performance across the board, enabling higher reliability in the fiber optic
communications environment.
On October 15, 2020, we announced that our proprietary polymer technologies are compatible with currently available integrated photonics
platforms. Our proprietary electro-optic materials are currently in the prototyping phase and are fabricated onto standard silicon wafers, and this Polymer
Plus™ advancement, driven by the feedback our Company received from potential customers to-date, has allowed our materials to be suitable for additive
integration to integrated photonics platforms such as silicon photonics, as well as indium phosphide and other standard platforms – therefore enabling
simpler integration by customers. We believe this breakthrough allows a polymer modulator to enhance the performance of existing integrated photonics
solutions in the marketplace, enabling higher speed and lower power consumption on foundry-fabricated photonics designs. Since our technology is
additive to existing platforms such as silicon photonics, our electro-optic polymers are not actually competing with integrated photonic platforms, but
rather enabling them to be more competitive in the marketplace, and it further validates our EO polymer platform as ideally suited to enable optical
networking more efficiently than ever.
On October 21, 2020, we announced that we have optimized a robust, photo-stable organic polymer material for use in our next-generation
modulators intended to be trialed with potential customers under NDA. Our materials show high tolerance to high-intensity infrared light, common in a
fiber optic communications environment and increasingly important as higher density of devices access the network, directly resulting in higher intensity
infrared light levels. Our preliminary results suggest that our recently developed electro-optic polymer material, designed based on potential customer
input, displays unrivaled light tolerance (also known as photostability) compared to any organic commercial solution in use today. Our results meet both
our current internal criteria and address potential customer feedback.
On November 2, 2020, we disclosed results on our polymer material stability testing including further results for electro-optic efficiency for our
Company’s materials that operate both at 1550nm as well as 1310nm. We demonstrated test materials results for electro-optic efficiency to 4000hrs,
improvement in sensitivity to oxygen as part of a broadband exposure test, and stability for polymers exposed to 1310nm light at 100mW.
On November 20, 2020 we announced the receipt of U.S. Patent number 10,591,755 that details an important invention that allows users of
electro-optic polymer modulators to not only operate the devices with high speed and low power directly from CMOS IC chips, but gives them the
opportunity to avoid the expense, physical footprint and power consumption of high-speed modulator driver ICs. Furthermore, this patent strengthens our
freedom of manufacturing, and directly enables our modulators to become more competitive in the marketplace.
26
On December 16, 2020 we announced the development of a new sealant for our future Chip-on-Board (COB) packaged polymer platform. The
sealant, which blocks oxygen and other atmospheric gases, is a key step in our Company’s development towards a polymer modulator without a package,
an important enabling technology for the industry. We plan to develop the sealant for commercial implementation in our future modulators. Recent results
suggest that our electro-optic polymer sealant material displays encouraging barrier properties and is expected to translate to significant improvement in
bare chip robustness against atmospheric gases, as compared to existing EO polymer commercial solutions in use today. While the initial measurements are
highly promising, our Company plans to continue development work to further optimize the sealant material and barrier performance towards the chip-onboard goal.
On January 13, 2021, we announced the receipt of U.S. Patent number 10,886,694 that details an invention that allows electro-optic polymer
modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical
semiconductor fabrication foundry – improving suitability for mass production. Further, the design of this capsule package can improve both the reliability
and the coupling interface between fiber optic cables and their laser sources for arrayed photonic integrated circuit solutions. The package can also
interpose signals from an underlying circuit board to the polymer modulators, lasers, and other components for data transfer. The hermetic capsule is built
from a semiconductor base that contains electrical and optical circuits and components. A hermetic capsule chamber is created by the design of a
semiconductor lid that is sealed to the semiconductor base platform by a metallization process. Using standardized fabrication techniques we can now
create a package that achieves the performance, reliability, cost, and volume requirements that has been a challenge for the photonics industry for years.
On May 11, 2021, we announced the receipt of U.S. Patent number 10,989,871 that details an invention that allows for improved protective
polymer layers in modulators when designed into advanced integrated photonic platforms, better positioning them for high-volume manufacturing
processes. The protective layers will enhance electro-optic polymer devices' performance through higher reliability, better optical performance and enable
the use of standardized manufacturing processes best suited for mass-production.
On June 7, 2021, we announced that our company’s common stock was added to the Solactive EPIC Core Photonics EUR Index NTR as part of
the index's semi-annual additions. The index includes global public companies with a common theme of optoelectronics, photonics, and optical
technologies in general that range from components, modules, manufacturers, and optical network system companies. This inclusion broadens our exposure
to the capital markets community, as well as credibility with potential partners and customers.
On June 16, 2021, we announced test results from new modulators fabricated in 2021, which exceeded bandwidth design targets and achieved
triple the data rate as compared to competing devices in use today. The breakthrough new devices demonstrated 3dB electro-optical with electrical
bandwidths that exceed 100GHz – with measurements coming close to our Company’s state-of-the-art 110GHz test equipment capability. We expect this
advancement to have a profound impact on the traffic flow on the internet.
On June 24, 2021, we announced the receipt of U.S. patent number 11,042,051 that details a breakthrough new device design that enables massvolume manufacturing when designed into advanced integrated photonic platforms. The device design enhances reliability, improves optical mode control
and most important, lowers by consumption through the use of direct-drive, low-voltage operation. The patent is entitled, "Direct drive region-less polymer
modulator methods of fabricating and materials therefor" and is expected to open the opportunity for low power consumption electro-optic polymers to be
developed into large foundry PDKs (process development kits) and be ready for mass volume commercialization. The patent emphasizes our technology
platform using fabrication techniques that would naturally fit into foundry PDKs.
On August 4, 2021, we announced that we developed improved thermal design properties for electro-optic polymers used in our Polymer Plus™
and Polymer Slot™ modulators, enabling the speed, flexibility and stability needed for high-volume silicon foundry processes. We successfully created a
2x improvement in r33, while allowing higher stability during poling and post-poling. This provides better thermal performance and enables greater design
flexibility in high-volume silicon foundry PDK (process development kit) processes.
On August 9, 2021, we announced the receipt of U.S. patent number 11,067,748 entitled "Guide Transition Device and Method" that covers a new
invention that enables enhanced optical routing architectures for polymer-based integrated photonics that can be scaled with partner foundries. This new
invention will enable innovative, highly scalable optical routing architectures for integrated photonic platforms. The patent provides novel optical
waveguide transition designs using two planes of optical waveguides that are expected to be critical for optical signal routing and optical switching,
opening the opportunity for high speed, energy efficient electro-optic polymers to be implemented into foundry PDKs (process development kits) to
improve the performance of integrated photonic circuits. This breakthrough technology opens the door for advanced integrated photonics architectural
design. We believe the simplicity of the design is ideal for production in foundries and will best position our Company to enable increased data traffic on
the internet while using less power.
On September 1, 2021, our Company's common shares began trading on the Nasdaq Capital Market ("Nasdaq"). The Company’s Nasdaq listing
will help to expand our potential shareholder base, improve liquidity, elevate our public profile within the industry and should ultimately enhance
shareholder value.
On September 15, 2021, we announced the receipt of the 2021 Industry Award for Optical Integration from the European Conference on Optical
Communications (ECOC), a premier industry exhibition that was held in Bordeaux from September 13-15, 2021. ECOC created the fiber communication
industry awards in six categories to put the spotlight on innovation happening within the industry. The awards recognize and highlight key industry
achievements in advancing optical components, photonic integration, optical transport and data center innovation. The awards are selected from top
industry players, representing significant innovation in photonics integration at our prestigious exhibition.
27
On September 16, 2021, we announced the achievement of world-record performance for a polymer modulator, as demonstrated in an optical
transmission experiment by ETH Zurich, using our Company's proprietary, advanced Perkinamine™ chromophores and Polariton Technologies Ltd.'s
newest plasmonic EO modulator, a silicon-photonics-based plasmonic racetrack modulator offering energy-efficient, low-loss, and high-speed modulation
in a compact footprint. The groundbreaking results were presented as a post-deadline paper at the prestigious European Conference on Optical
Communications (ECOC) industry exhibition and conference in Bordeaux on September 16, 2021. Polariton's plasmonic modulator transmitted 220 Gbit/s
OOK and 408 Gbit/s 8PAM. Transmission of an optical signal was conducted over 100 m using a low-voltage electrical drive of 0.6Vp, an on-chip loss of 1
dB, and an optical 3 dB bandwidth of beyond 110 GHz.
On January 3, 2022, we announced the publication of our patent application 20210405504A1 by the United States Patent and Trademark Office
(USPTO) – entitled 'Nonlinear Optical Chromophores Having a Diamondoid Group Attached Thereto, Methods of Preparing the Same, and Uses
Thereof' – which significantly improves the overall stability and performance of our electro-optic polymers. The Company's electro-optic chromophores are
designed to have one or more diamondiod molecular groups attached to the chromophore. When such chromophores are dispersed in a host polymer
matrix, the electro-optic materials result in improved macroscopic electro-optic properties, increased poling efficiency, increased loading as well as
increased stability of these materials after poling. The impact of this technology is that it will accelerate the path for very high-speed, low-power electrooptic polymers to be implemented into large foundry process development kits (“PDKs”) to boost performance of integrated photonic circuits.
On January 3, 2022, we announced that we enhanced our Company’s Foundry Process Development Kit Offering with the addition of Optical
Grating Couplers. This expanded design tool kit will enable silicon foundries to implement PDKs and fabricate modulators and optical gratings in a single
fab run, further enhancing modulator efficacy. We are continuing to work on additional design tool kit components to enable an expedited
commercialization process through a more simplified manufacturing process for our foundry partners.
On January 3, 2022, we announced that we appointed respected industry leader Dr. Craig Ciesla to our Board of Directors and that retired director
Dr. Joseph A. Miller transitioned to our Company's Advisory Board. Dr. Ciesla is currently the Vice President, Head of the Advanced Platforms and
Devices Group at Illumina, a leading provider of DNA sequencing and array technologies. There he leads a team driving innovation in sequencing
platforms, microfluidics, electronics, and nanofabrication. Prior to Illumina, he was Vice President of Engineering at Kaiam, where he was responsible for
the development and production of 100G transceivers for the data-center market. He was also the founding CEO of Tactus Technology, an innovator in the
user interface industry, where he was the co-inventor of Tactus' polymer morphing screen technology. Before Tactus he had a variety of roles at Intel, JDSU
(now Lumentum), Bookham (now Oclaro) and Ignis Optics developing a wide range of products in the fiber-optics market. He started his career at Toshiba
Research Europe, where he performed early terahertz images of skin cancer. Dr. Ciesla holds a BSc (Hons.) in Applied Physics and Ph.D. in Physics from
Heriot-Watt University in Edinburgh.
On February 10, 2022, we announced breakthrough photostability results on our electro-optic polymer modulators that are compatible with highvolume silicon foundry processes. The improved photostability of our polymers are expected to minimize any optical losses and provide a more robust
platform for silicon foundries. This breakthrough photostability performance is incredibly important as we optimize our polymers for high-volume silicon
foundry processes.
On March 7, 2022, we announced the receipt of U.S. patent number 11,262,605 entitled, "Active region-less polymer modulator integrated on a
common PIC platform and method." This invention will simplify modulator integration for high-volume foundry manufacturing operations while
enhancing polymer reliability to enable a more effective photonic engine. The essence of the invention is a complete optical engine that fits into fiber optic
transceivers (either pluggable or co-packaged) that are used in routers, servers and elsewhere in optical networks. The engine is designed for high-volume
manufacturing operations using silicon foundry infrastructure. The patent illustrates the use of our polymer modulators as a high speed, low power engine
not only for data communication and telecommunication applications, but other new market opportunities as well.
On March 22, 2022 we announced the achievement of world-class results for a polymer modulator, as demonstrated in an enhanced stability and
high-speed measurement by Polariton Technologies and ETH Zurich. The results were generated using the Company's proprietary, advanced
Perkinamine™ chromophores in Polariton's silicon-photonics-based plasmonic racetrack modulator that offers energy-efficient, low-loss, and high-speed
modulation in a compact footprint that is ideal for pluggable and/or co-packaging transceiver modules. The plasmonic modulator performance was
compared to that of silicon photonic microring modulators. The plasmonic device, using Lightwave Logic's electro-optic polymer material, was shown to
be 250-3000x more stable than the silicon devices relative to operating condition changes. In addition, the plasmonic modulator was tested for 70+ minutes
at 100 Gbps NRZ at 80C with no decrease in performance. The world-class results were presented as a contributed peer-reviewed paper at the prestigious
2022 Optical Fiber Conference (OFC2022), the optical communication industry's leading international technical conference and trade show, in San Diego
on March 10, 2022.
On April 19, 2022, we announced the publication of our patent application 2022/0113566 A1 entitled "TFP (thin film polymer) optical transition
device and method" that illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which are
more advantageous for high-volume production. The invention will simplify polymer modulator fabrication when integrated with silicon photonics for
high-volume foundry manufacturing applications. The simplified fabrication approach enables us to simplify the production of very high speed, low power
proprietary polymer modulators that will enable significantly faster data rates in the internet environment. The essence of the invention is a hybrid polymersilicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment
that are proliferating with the growth of data centers, cloud computing and optical communications capacity. The hybrid polymer-silicon photonics engine
is designed to use high-volume silicon foundry infrastructure.
28
On May 25, 2022, we announced enhanced photostability results on our Company's proprietary electro-optic polymer modulators – demonstrating
the reliability necessary for commercial deployments – all based on a technology which can be ported into high-volume silicon foundries and integrated
onto a silicon photonics platform with other optical devices. Photostability is a critical performance metric required both in high volume manufacturing
processes (such as photolithography) and in offering the high reliability and network availability required for commercial deployments. In the tests
conducted, subjecting the Company's latest polymers to high intensity optical power for over 3000 hours produced no change in device performance. The
ability of our proprietary polymers to pass this accelerated photostability aging test provides assurance that they will both tolerate the optical exposures
which occur in high-volume manufacturing and support the reliability over the required operating life of optical transceivers and network elements.
On June 21, 2022, we announced the publication of our patent application 2022/0187637A1 entitled "Hybrid electro-optic polymer modulator
with silicon photonics" that details a novel fabrication process that allows our Company’s proprietary polymers to be fabricated by silicon foundries in a
high-volume manufacturing environment. The published patent application also details a more efficient process that allows for high yielding, high stability
poling of polymers in a high-volume foundry manufacturing environment. The development of the PDK for this new optical hybrid optical modulator
design is now in progress with our Company’s foundry partners.
June 23, 2022, we announced the publication of our patent application 2022/0187638A1 entitled " Hybrid electro-optic polymer modulator with
atomic layer deposition (ALD) sealant layer" that allows our Company’s proprietary polymers to be sealed to moisture and other atmospheric gases in a
very low temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e.
in volume) and that eliminates the need for a separate hermetic enclosure or "gold box." Chip-scale packaging is a technique that has been gathering
momentum in the silicon electronics industry for the past decade to reduce device chip packaging costs and increase device performance – enabling highvolume front and back-end manufacturing as well as extremely small sizes in miniaturization. Specifically, our electro-optic polymer modulators are sealed
with a low-temperature conformal atomic layer deposition dielectic layers that are supported on a silicon substrate with passive silicon photonics
waveguides.
On June 27, 2022 our Company's common stock was added to the Russell 3000® Index. We expect that the awareness of being included in one of
the most widely followed benchmarks will not only benefit our existing shareholders but will lead to a broader base of institutional investors. The annual
Russell index reconstitution captures the 4,000 largest US stocks as of May 6, ranking them by total market capitalization. Our membership in the US allcap Russell 3000® Index, which remains in place for one year, means automatic inclusion in the small-cap Russell 2000® Index as well as the appropriate
growth and value style indexes.
On June 30, 2022, we announced that our CEO, Dr. Michael Lebby, was again invited to co-chair the Photonic Integrated Circuits (PIC)
International Conference that took place June 28-29, 2022 in Brussels, Belgium. At the conference, Dr. Lebby led an invited talk entitled, "Enabling lower
power consumption optical networking using high speed, low power polymer modulators", focusing on the issue of reducing power consumption in
datacenters and optical networks. He also contributed to a panel session, "Hybrid PICs technology challenges and solutions," on the need for hybrid
integration addressing the volume production of 3D and 2.5 integrated electronic and photonic integrated circuits (PICs) based on the utilization of large
silicon foundries. This included a discussion on the use of silicon photonics with hybrid technologies such as electro-optic polymers, polymer based
plasmonics, silicon nitride and III-V laser sources.
On September 22, 2022, we announced the achievement of world record performance for low-power consumption ultra-high-speed 'green' slot
modulators in collaboration with Karlsruhe Institute of Technology (KIT) and its spin-off SilOriX as part of a peer-reviewed post-deadline paper presented
at the prestigious 2022 European Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022. The team presented the
first sub-1mm Mach Zehnder-type modulators with sub-1V drive voltage that rely on Lightwave’s proprietary advanced Perkinamine™ chromophores. The
devices rely on the slot-waveguide device concept developed at KIT and commercialized through SilOriX. Further, the material has experimentally proven
thermal stability at 85°C and offers extreme energy-efficiency along with high-speed modulation in a compact footprint. Additionally, this shows that our
material can perform in a variety of device structures and designs and is positioned to significantly reduce power consumption of optical networking and to
become a true 'green photonics' enabler for the industry.
On September 22, 2022, we announced the achievement of a world-record demonstration of a 250GHz super high bandwidth electro-opticalelectrical (EOE) link through a collaboration with ETH Zurich. The link was demonstrated by ETH Zurich and uses Polariton's high-speed plasmonic
modulators containing Lightwave's proprietary Perkinamine™ chromophores and ETH Zurich's high-speed graphene photodetectors. The link contained a
plasmonic modulator using electro-optic polymer material as well as a novel metamaterial enhanced graphene photodetector featuring a 200 nm spectral
window and a setup-limited
1 bandwidth of 500 GHz. The EOE link achieved a world record and unprecedented 250 GHz 3dB bandwidth
2
. This is an
optical link that utilizes devices with extremely high bandwidths, and the plasmonic demonstration shows that hybrid technologies such as our electro-optic
polymers and graphene together form an important technology platform for volume scalability using large silicon foundries for mass commercialization.
The groundbreaking results were presented by Stephan Koepfli as part of a peer-reviewed post-deadline paper presented at the prestigious 2022 European
Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022.
29
On November 15, 2022, we announced the receipt of U.S. patent number 11,435,603 B2 entitled "TFP (thin film polymer) optical transition
device and method," which illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which
are more advantageous for high-volume production. The simplified fabrication approach enables streamlined production of very high speed, low power
proprietary polymer modulators that will enable significantly faster data rates in the internet environment. The essence of the invention is a hybrid polymersilicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment
that are proliferating with the growth of data centers, cloud computing and optical communications capacity.
On November 17, 2022, we announced the receipt of U.S. patent number 11,435,604 B2 entitled "Hybrid electro-optic polymer modulator with
silicon photonics," which allows Lightwave Logic's proprietary polymers to be fabricated by silicon foundries in a high-volume manufacturing
environment. The patent also details a more efficient process that allows for high yielding, high stability poling of polymers in a high-volume foundry
manufacturing environment. From a commercial standpoint, this patent enables our polymers to be mass-produced using existing silicon foundry
equipment, simplifying production for the foundry's we are working with.
On November 29, 2022, we announced our acquisition of the polymer technology and intellectual property assets of Chromosol Ltd (UK). The
acquisition significantly strengthened our Company's design capabilities with foundry PDKs with extremely low temperature atomic layer deposition
(ALD) processes that effectively hermetically seal polymer devices that have been prepared for high volume manufacturing. The advanced fabrication
processes of ALD with temperatures below 100C will solidify our Company's market position with both the Company's manufacturing foundry partners as
well as end-users as we prepare to enter the 800Gbps integrated photonics marketplace. The acquisition also advanced our Company’s patent portfolio of
electro-optic polymer technology with an innovative polymer chemistry device patent that has potential to increase the performance of integrated
modulators through optical amplification in a photonic integrated circuit (PIC) and enhance the functionality of the PIC by integrating laser light sources
made using the polymer-based gain and a laser optical cavity defined on the Silicon photonic platform, with our Company’s high speed, high efficiency
modulators. Having access to extremely low temperature ALD allows our Company's polymer modulators to be protected from the environment without
the need for expensive and large footprint gold box packaging, propelling our Company forward with chip-scale packaging as required by major hyperscaler end-users. The patent opens a new class of PICs which expands our variety of devices. The Patent is US patent number 9837794, EU patent number
3017489, China registration number 201480048236 & 201910230856, and is entitled, “Optoelectronic devices, methods of fabrication thereof and
materials therefor.”
___________________________
1 Set-up limited' indicates that the measurement was limited by the testing equipment.
2 University of Kiel, Germany supported the digital signal processor (DSP), and ETHZ supported the photodetector.
30
On December 12, 2022, we announced the receipt of U.S. patent number 11,506,918 B2 entitled “Hybrid electro-optic polymer modulator with
atomic layer deposition (ALD) sealant layer,” which allows our proprietary polymers to be sealed to moisture and atmospheric gases in a very low
temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e. in
volume) and that eliminates the need for a separate hermetic enclosure or "gold box." Specifically, our electro-optic polymer modulators will be sealed with
low-temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonics waveguides.
The sealant process will enable lower cost system implementation in a high-volume foundry environment.
On December 13, 2022, we provided a world-class figure-of merit performance for modulators using electro-optical polymers and a plasmonic
device design in conjunction with Polariton Technologies. Building from the world record performance and demonstration of a 250 GHz super high
bandwidth electro-optical-electrical (EOE) link that was presented at the 2022 European Conference on Optical Communications (ECOC)
3
through a
collaboration with ETH Zurich, these latest figure of merit results show the potential for extreme power savings for optical network equipment and
demonstrated clearly that polymer-based technology platforms are positioned well for general implementation. These results were achieved using
Polariton's electro-optic polymer-based plasmonic devices with Lightwave's electro-optic materials, with a bandwidth greater than 250 GHz. While these
high-speed results have been reported previously, here Lightwave Logic reported for the first time that the voltage-length product Figure of Merit (FoM)
for this modulator is just 60 Vum, which is approximately 10X better than the performance of the optical semiconductor modulators that are incumbent in
the optical network and internet today. This figure of merit will allow ultra-low voltage operation and, enabled by Polariton's plasmonic modulator, the
ability to carry significantly more data per modulator while consuming much less power. The net positive effect on system level equipment is expected not
only to be significant, but perhaps more importantly, also a strong driver of a ''green photonics" platform. These results position our Company extremely
well for next generation ultra-high-capacity interconnects for the hyper-scale market. The combination of electro-optic polymers and plasmonics is
becoming an ideal sunrise technology platform to address the 'Achilles heel' of the data industry: high power consumption. As the industry contemplates
the implementation of PAM4 200G lanes for 2023 and 2024, these optical devices already have shown capability for at least 2X these lane speeds.
On January 12, 2023, our Chief Executive Officer, Dr. Michael Lebby, hosted a presentation and participated in an industry panel discussion at
the 2023 Photonics Spectra Conference, a prominent virtual conference within the photonics industry. In the panel discussion, Dr. Lebby and a panel of
industry experts from the entire photonics integrated chip (PIC) value chain, discussed lessons learned when scaling PIC production for volume
applications. In his presentation, Dr. Lebby reviewed the potential solutions that electro-optical polymer modulators offer to integrated and hybrid
photonics integrated chips (PICs), discussing their relevance to PIC packaging operations as well as how electro-optic polymers boost PIC speed and power
efficiency.
On January 30, 2023, our Chief Executive Officer, Dr. Michael Lebby, participated in an industry panel discussion at the 2023 Laser Focus World
Executive Forum. The Laser Focus World Executive Forum is one of the industry's premier events for senior-level executives, technology directors, and
business managers from technology companies around the world, delivering an in-depth analysis of the global laser and photonics market. In this
discussion, Dr. Lebby joined a panel of industry experts to discuss how the success of Silicon Photonics is based on the premise that it is a semiconductor
technology, and hence it can be manufactured in volume by semiconductor fabs. The panel addressed the manufacturing plans of photonic integrated
circuits (PICs) by semiconductor fabs and how the photonic industry can transfer their processes to the semiconductor industry.
On March 22, 2023, we announced that our latest commercial-class electro-optic polymer material achieved breakthrough performance metrics at
1310 nanometers (nm), a wavelength popular in hyperscale datacenter applications. These commercial-class improvements include a significantly higher
electro-optic coefficient exceeding 200 pm/V, which allows for very low drive power of 1 volt or less. Other characteristics include optimized chromophore
loading, superior low optical loss, excellent temporal stability at 85
0 Celsius, and extremely high thermal and photo stability. The breakthrough
commercial-class electro-optic material is expected to enable ultra-small footprint modulators with at least 100 GHz bandwidth as well as meeting all
critical requirements for pluggable transceivers, on-board optics and co-packaging solutions. Additionally, the achievement of these results at the 1310nm
bandwidth positions us for potential near-term licensing opportunities in datacenter applications.
In April 2023, our Chief Executive Officer, Dr. Michael Lebby, co-chaired the Photonic Integrated Circuits (PIC) International Conference in
Brussels, Belgium. Industry-leading insiders delivered more than 30 presentations spanning six sectors at the conference. The conference provided
attendees with an up-to-date overview of the status of the global photonics industry as well as the opportunity to meet many other key players within the
community. In addition to serving as co-chair of the event, Dr. Lebby hosted a presentation for in-person attendees within the "Scaling PICs in Volume
Using Foundries" track, focusing on the industry's consideration of electro-optic polymer modulators due to their increased modulation speed, lower power
consumption, and potential for future multi-Tbps aggregated data-rates in the next decade. Additionally, Dr. Lebby discussed the latest results on foundry
fabricated EO polymers, as well as the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level.
_____________________________
3 The groundbreaking results were presented by Stefan Koepfli (ETH Zurich) as part of a peer-reviewed post-deadline paper presented at the prestigious 2022 European
Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022. The post-deadline paper is titled ">500 GHz Bandwidth Graphene
Photodetector Enabling Highest-Capacity Plasmonic-to-Plasmonic Links."
31
On May 4, 2023, we announced, that in conjunction with our research partners at the Karlsruhe Institute of Technology and Solarix, the
achievement of record optical modulator performance using our Company's latest Perkinamine® Series 5 material at extremely low cryogenic temperatures,
delivering the potential to revolutionize applications in supercomputers, quantum circuits and advanced computing systems. Building from the world
record performance and demonstration of super high bandwidth, and super low voltage electro-optic modulators with Karlsruhe Institute of Technology and
Silorix over the past year, the results have the potential to enable supercomputing and quantum systems to be more competitive than standard
computational systems given its faster speeds at low temperatures. This achievement opens huge opportunities to our Company in the areas of
supercomputing and quantum systems by giving access to very high data rate, low power optical modulators.
On May 18, 2023, we announced the receipt of U.S. patent number 11,614,670 B2 entitled "Electro-optic polymer devices having high
performance claddings and methods of preparing the same," which is a cutting-edge design technique, enhancing the performance of polymer modulators
through the use of innovative polymer cladding design that is amenable for high-volume foundry fabrication when integrated with silicon photonics. The
patent details a novel fabrication process that allows our proprietary polymers to perform more effectively and to be fabricated by silicon foundries in a
high-volume manufacturing environment. It also introduces a more efficient process for improving the performance of the polymer claddings, leading to
increased poling efficiency and lower losses in both optical and RF aspects. This patent is helping us move forward with our commercial discussions
through the enabling of enhanced performance and simplified manufacturing of our polymer modulators with silicon photonics.
On May 25, 2023, we announced our Company's first commercial material supply license agreement for our Perkinamine® chromophore
materials. This agreement is to provide Perkinamine® chromophore materials for polymer based photonic devices and photonic integrated circuits (PICs).
Supplying licensed materials is one prong of our Company's three-prong revenue model and business strategy that includes polymer modulator products as
well as technology transfer. This agreement recognizes market acceptance and competitive advantage of our technology and validates the first prong of our
business model. Further, it represents tangible commercial progress for electro-optic polymers as part of our business plan.
On May 31, 2023, we announced the receipt of U.S. patent number 11,661,428 entitled "Nonlinear Optical Chromophores, Nonlinear Optical
Materials Containing the Same, and Uses Thereof in Optical Devices," which details an innovative organic chromophore design using a novel 'thiophene
bridge' to significantly improve material performance in a production environment. This is accomplished by designing thiophene-containing bridging
groups that are positioned between the electron-donating and electron-accepting ends of the chromophore. These designs provide nonlinear optical
chromophores with significantly improved optical properties and improved stability. We expect this patent will help us progress our commercial
discussions with potential customers.
In June 2023, we announced the publication of World International Property Organization (WIPO) PCT Patent Publication - PCT Patent No. WO
2023/102066 entitled “Nonlinear Optical Materials Containing High Boiling Point Solvents, and Methods of Efficiently Poling The Same,” which
illustrates novel organic chemical structural designs that offer increased poling efficiency, as well as thermal stability for electro-optic materials. These
designs provide non-linear optical chromophores with significantly improved material properties and stability for processing and fabrication by commercial
foundries. Specifically, the patent teaches material processing and poling methods that directly leads to significantly enhanced electro-optic efficiency (r33)
as compared to previous poling techniques. We consider this WIPO PCT Patent Publication to be a strong step forward in the scaling and volume
commercialization of our polymer technology platform.
On August 1, 2023, we appointed respected industry executive Laila Partridge to our Board of Directors. Ms. Partridge brings over 30 years of
executive experience in technology, corporate innovation and finance to our Board – having worked with a wide range of technologies, including
telecommunications, internet infrastructure, AI, internet of things and more. She was named by Boston Business Journal as one of the ten "2017 Women to
Watch in Science and Technology". She currently serves as Founder and Chief Executive Officer of The HardTech Project, a new venture with a novel
approach to early-stage hardware investing. Previously, she was Managing Director of the STANLEY + Techstars Accelerator where she directed a global
effort for Stanley Black & Decker's Chief Technology Officer to identify and invest in innovative technologies for industrial applications with an emphasis
on electrification, sustainability and advanced manufacturing. Prior to that, she began her technology career at Intel Capital, serving as a Director of
Strategic Investments. Ms. Partridge began her career at Wells Fargo, where she ultimately achieved the role of VP of Corporate Banking, having led
complex corporate finance transactions for the company's senior secured debt agencies in the Midwest. Ms. Partridge brings significant board experience to
the Board of Directors, including at Intel Capital serving privately-held technology companies, and in her current role as an independent Director at
Cambridge Trust (NASDAQ: CATC). She holds a Bachelor's degree with Honors from Wellesley College.
On August 21, 2023, we announced the completion of new laboratory production facilities, expanding our corporate headquarters by over 65%,
nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including enabling commercial device testing
and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's chemical synthesis production line.
On October 3, 2023, we announced our receipt of the 2023 Industry Award for Most Innovative Hybrid PIC/Optical Integration Platform from
the European Conference on Optical Communications (ECOC) – a premier industry exhibition – held in Glasgow, Scotland from October 2-4, 2023. ECOC
is one of the leading conferences on optical communication and attracts top industry minds from across the world. The ECOC awards emphasize
technology and product commercialization, highlighting significant achievements in advancing the business of optical communications, transport,
networking, fiber-based products, photonic integration circuits and related developments. The Innovative Product category with 5 subcategories looks
across the industry at new products driving change in their respective market segment, and what is timely and helping to increase the use of optics. Metrics
include design features that are photonics, electronics, thermal, mechanical, chemical, environmental and carbon footprint based
Not a good look. Someone bought 1000 shares at the ask, then turned around and sold 105,000 shares at the bid? VWAP was .0056
Mitsubishi UFJ Kokusai Asset Management Co. Ltd. Buys Shares of 259,849 Lightwave Logic, Inc. (NASDAQ:LWLG)
Posted by Defense World Staff on Nov 20th, 2023
Mitsubishi UFJ Kokusai Asset Management Co. Ltd. bought a new stake in shares of Lightwave Logic, Inc. (NASDAQ:LWLG – Free Report) during the 2nd quarter, according to the company in its most recent disclosure with the SEC. The fund bought 259,849 shares of the company’s stock, valued at approximately $1,811,000. Mitsubishi UFJ Kokusai Asset Management Co. Ltd. owned approximately 0.23% of Lightwave Logic at the end of the most recent reporting period...
https://www.defenseworld.net/2023/11/20/mitsubishi-ufj-kokusai-asset-management-co-ltd-buys-shares-of-259849-lightwave-logic-inc-nasdaqlwlg.html
News? You must have been asleep. Here, let me help you:
Recent Significant Events and Milestones Achieved
During February and March 2018, we moved our Newark, Delaware synthetic laboratory and our Longmont, Colorado optical testing laboratory
and corporate headquarters to office, laboratory and research and development space located at 369 Inverness Parkway, Suite 350, Englewood, Colorado.
The Englewood facility includes fully functional 1,000 square feet of class 1,000 cleanroom, 500 square feet of class 10,000 cleanroom, chemistry
laboratories, and analytic laboratories.
In August 2018 we completed (ahead of schedule) our fully equipped on-site fabrication facility to expand our highspeed test and design capabilities. In August 2023, we completed new laboratory production facilities, expanding the Englewood facility by over 65%,
nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including enabling commercial device testing
and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's chemical synthesis production line.
Our Englewood facility streamlines all of our Company’s research and development and production workflow for greater operational efficiencies
During March 2018, our Company, together with our packaging partner, successfully demonstrated packaged polymer modulators designed for
50Gbaud, which we believe will allow us to scale our P
2
IC™ platform with our Mach-Zehnder ridge waveguide modulator design as well as other
photonics devices competitively in the 100Gbps and 400Gbps datacom and telecommunications applications market. We are currently fine-tuning the
performance parameters of these prototypes in preparation for customer evaluations.
During June 2018, our Company Acquired the Polymer Technology Intellectual Property Assets of BrPhotonics Productos Optoelectrónicos S.A.,
a Brazilian corporation, which significantly advanced our patent portfolio of electro-optic polymer technology with 15 polymer chemistry materials,
devices, packaging and subsystems patent and further strengthened our design capabilities to solidify our market position as we prepare to enter the
400Gbps integrated photonics marketplace with a highly competitive, scalable alternative to installed legacy systems.
Also, during June 2018, our Company promoted polymer PICs and Solidified Polymer PICs as Part of the Photonics Roadmap at the World
Technology Mapping Forum in Enschede, Netherlands, which includes our Company’s technology of polymers and polymer PICs that have the potential to
drive not only 400Gbps aggregate data rate solutions, but also 800Gbps and beyond.
In August 2018 we announced the completion (ahead of schedule) of our fully equipped on-site fabrication facility, where we are expanding our
high-speed test and design capabilities. We also announced the continuation of the building of our internal expertise with the hiring of world-class technical
personnel with 100Gbps experience. In August 2023, we announced the completion of new laboratory production facilities, expanding our corporate
headquarters by over 65%, nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including
enabling commercial device testing and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's
chemical synthesis production line.
In February 2019 we announced a major breakthrough in our development of clean technology polymer materials that target the insatiable demand
for fast and efficient data communications in the multi-billion-dollar telecom and data markets supporting Internet, 5G and IoT (Internet of Things)
webscale services. The improved thermally stable polymer has more than double the electro-optic response of our previous materials, enabling optical
device performance of well over 100 GHz with extremely low power requirements. This addition to the family of PerkinamineTM polymers will hold back
run-away consumption of resources and energy needed to support ever-growing data consumption demands. We continue to conduct testing of the material
and assessment of associated manufacturing processes and device structures prior to release to full development.
In March 2019 we created an Advisory Board comprised of three world-class leaders in the photonics industry: Dr. Craig Ciesla, Dr. Christoph S.
Harder, and Mr. Andreas Umbach. In January 2022 Dr. Ciesla was named to our Board of Directors, and our Advisory Board is currently comprised of Dr.
Franky So, Dr. Christoph S. Harder, Mr. Andreas Umbach and Dr. Joseph A. Miller, who is a former member of our Board of directors. The Advisory
Board is working closely with our Company leadership to enhance our Company’s product positioning and promote our polymer modulator made on our
proprietary Faster by Design™ polymer P
2
IC™ platform. The mission of the Advisory Board is initially to increase our Company’s outreach into the
datacenter interconnect market and later to support expansion into other billion-dollar markets. The Advisory Board members have each been chosen for
their combination of deep technical expertise, breadth of experience and industry relationships in the fields of fiber optics communications, polymer and
semiconductor materials. Each of the Advisory Board members has experience at both innovators like Lightwave Logic and large industry leaders of the
type most likely to adopt game-changing polymer-based products. In addition, they possess operational experience with semiconductor and polymer
businesses.
Also, in March 2019, our Company received the “Best Achievement in PIC Platform” award for our 100 GHz polymer platform from the PIC
International Conference. The award recognizes innovative advances in the development and application of key materials systems driving today’s photonic
integrated circuits (PICs) and providing a steppingstone to future devices.
During the second quarter of 2019, our Company promoted its polymers at CoInnovate in May and the World Technology Mapping Forum in
June. CoInnovate is a meeting of semiconductor industry experts. The World Technology Mapping Forum is a group authoring a photonics roadmap out to
2030.
25
In September 2019 at the prestigious European Conference on Communications (ECOC) in Dublin, Ireland, we showed measured material
response over frequency and the resulting optical data bits stream on our clean technology polymer materials, the newest addition to our family of
PerkinamineTM polymers, that meet and exceed of our near-term target speed of 80 GHz. We also released data demonstrating stability under elevated
temperatures in the activated (poled to create data carrying capability) state.
In October 2019, we reported that energy-saving polymer technology is highlighted in the recently published Integrated Photonics Systems
Roadmap - International (IPSR-I). The roadmap validates the need for low-voltage, high-speed technologies such as ours.
In May 2020, we announced that our latest electro-optic polymer material has exceeded target performance metrics at 1310 nanometers (nm), a
wavelength commonly used in high-volume datacenter fiber optics. This material demonstrates an attractive combination at 1310 nm of high electro-optic
coefficient, low optical loss and good thermal stability at 85
0 Celsius. The material is expected to enable modulators with 80 GHz bandwidth and low drive
power, and has an electro-optic coefficient of 200 pm/V, an industry measure of how responsive a material is to an applied electrical signal. This metric,
otherwise known as r33, is very important in lowering power consumption when the material is used in modulator devices. This technology is applicable to
shorter reach datacenter operators, for whom decreasing power consumption is imperative to the bottom line of a facility. We considered this a truly historic
moment—not only in our Company’s history, but in our industry–as we have demonstrated a polymer material that provides the basis for a world-class
solution at the 1310 nm wavelength, something which other companies have spent decades attempting to achieve.
In July 2020, we announced the official launch of our new corporate website www.lightwavelogic.com, reflecting ongoing efforts to provide upto-date information for investors and potential strategic partners. The revamped website offers a clean, modern design integrated with helpful tools and
investor relations resources, including a new corporate explainer video, to illustrate the target markets and advantages of Lightwave Logic’s proprietary
electro-optic polymers.
In August 2020, we announced the addition of Dr. Franky So, a leading authority in the OLED industry, to our Advisory Board. Dr. So is the
Walter and Ida Freeman Distinguished Professor in the Department of Materials Science and Engineering at North Carolina State University. Previously, he
was the Head of Materials and Device research for OLEDs at OSRAM Opto Semiconductors, as well as Motorola’s corporate research lab in the 1990s. Dr.
So was an early researcher in electro-optic (EO) polymer modulators at Hoechst Celanese. As a member of the Company’s advisory board, Dr. So will
work closely with management to enhance Lightwave’s product positioning for, as well as the promotion of, its polymer modulators made on its proprietary
platform. In addition, he will provide technical support and advisory services to the Lightwave materials and device teams.
On October 7, 2020 we announced the receipt of U.S. Patent number 10,754,093 that improves both the performance and reliability of our highspeed, low-power electro-optic polymer modulators intended for datacenter and telecommunications applications. The patent allows multi-layered electrooptic polymer modulators to perform more efficiently through the design of custom interfaces. These interfaces are designed into the cladding layers that
allow optical transmission, electrical conductivity, material integrity, as well as a prevention of solvents affecting adjacent polymer materials. The net
impact of all of this allows for our Company’s modulators to improve performance across the board, enabling higher reliability in the fiber optic
communications environment.
On October 15, 2020, we announced that our proprietary polymer technologies are compatible with currently available integrated photonics
platforms. Our proprietary electro-optic materials are currently in the prototyping phase and are fabricated onto standard silicon wafers, and this Polymer
Plus™ advancement, driven by the feedback our Company received from potential customers to-date, has allowed our materials to be suitable for additive
integration to integrated photonics platforms such as silicon photonics, as well as indium phosphide and other standard platforms – therefore enabling
simpler integration by customers. We believe this breakthrough allows a polymer modulator to enhance the performance of existing integrated photonics
solutions in the marketplace, enabling higher speed and lower power consumption on foundry-fabricated photonics designs. Since our technology is
additive to existing platforms such as silicon photonics, our electro-optic polymers are not actually competing with integrated photonic platforms, but
rather enabling them to be more competitive in the marketplace, and it further validates our EO polymer platform as ideally suited to enable optical
networking more efficiently than ever.
On October 21, 2020, we announced that we have optimized a robust, photo-stable organic polymer material for use in our next-generation
modulators intended to be trialed with potential customers under NDA. Our materials show high tolerance to high-intensity infrared light, common in a
fiber optic communications environment and increasingly important as higher density of devices access the network, directly resulting in higher intensity
infrared light levels. Our preliminary results suggest that our recently developed electro-optic polymer material, designed based on potential customer
input, displays unrivaled light tolerance (also known as photostability) compared to any organic commercial solution in use today. Our results meet both
our current internal criteria and address potential customer feedback.
On November 2, 2020, we disclosed results on our polymer material stability testing including further results for electro-optic efficiency for our
Company’s materials that operate both at 1550nm as well as 1310nm. We demonstrated test materials results for electro-optic efficiency to 4000hrs,
improvement in sensitivity to oxygen as part of a broadband exposure test, and stability for polymers exposed to 1310nm light at 100mW.
On November 20, 2020 we announced the receipt of U.S. Patent number 10,591,755 that details an important invention that allows users of
electro-optic polymer modulators to not only operate the devices with high speed and low power directly from CMOS IC chips, but gives them the
opportunity to avoid the expense, physical footprint and power consumption of high-speed modulator driver ICs. Furthermore, this patent strengthens our
freedom of manufacturing, and directly enables our modulators to become more competitive in the marketplace.
26
On December 16, 2020 we announced the development of a new sealant for our future Chip-on-Board (COB) packaged polymer platform. The
sealant, which blocks oxygen and other atmospheric gases, is a key step in our Company’s development towards a polymer modulator without a package,
an important enabling technology for the industry. We plan to develop the sealant for commercial implementation in our future modulators. Recent results
suggest that our electro-optic polymer sealant material displays encouraging barrier properties and is expected to translate to significant improvement in
bare chip robustness against atmospheric gases, as compared to existing EO polymer commercial solutions in use today. While the initial measurements are
highly promising, our Company plans to continue development work to further optimize the sealant material and barrier performance towards the chip-onboard goal.
On January 13, 2021, we announced the receipt of U.S. Patent number 10,886,694 that details an invention that allows electro-optic polymer
modulators to be packaged in a hermetic environment using well-known, high-volume and low-cost fabrication processes that are available in a typical
semiconductor fabrication foundry – improving suitability for mass production. Further, the design of this capsule package can improve both the reliability
and the coupling interface between fiber optic cables and their laser sources for arrayed photonic integrated circuit solutions. The package can also
interpose signals from an underlying circuit board to the polymer modulators, lasers, and other components for data transfer. The hermetic capsule is built
from a semiconductor base that contains electrical and optical circuits and components. A hermetic capsule chamber is created by the design of a
semiconductor lid that is sealed to the semiconductor base platform by a metallization process. Using standardized fabrication techniques we can now
create a package that achieves the performance, reliability, cost, and volume requirements that has been a challenge for the photonics industry for years.
On May 11, 2021, we announced the receipt of U.S. Patent number 10,989,871 that details an invention that allows for improved protective
polymer layers in modulators when designed into advanced integrated photonic platforms, better positioning them for high-volume manufacturing
processes. The protective layers will enhance electro-optic polymer devices' performance through higher reliability, better optical performance and enable
the use of standardized manufacturing processes best suited for mass-production.
On June 7, 2021, we announced that our company’s common stock was added to the Solactive EPIC Core Photonics EUR Index NTR as part of
the index's semi-annual additions. The index includes global public companies with a common theme of optoelectronics, photonics, and optical
technologies in general that range from components, modules, manufacturers, and optical network system companies. This inclusion broadens our exposure
to the capital markets community, as well as credibility with potential partners and customers.
On June 16, 2021, we announced test results from new modulators fabricated in 2021, which exceeded bandwidth design targets and achieved
triple the data rate as compared to competing devices in use today. The breakthrough new devices demonstrated 3dB electro-optical with electrical
bandwidths that exceed 100GHz – with measurements coming close to our Company’s state-of-the-art 110GHz test equipment capability. We expect this
advancement to have a profound impact on the traffic flow on the internet.
On June 24, 2021, we announced the receipt of U.S. patent number 11,042,051 that details a breakthrough new device design that enables massvolume manufacturing when designed into advanced integrated photonic platforms. The device design enhances reliability, improves optical mode control
and most important, lowers by consumption through the use of direct-drive, low-voltage operation. The patent is entitled, "Direct drive region-less polymer
modulator methods of fabricating and materials therefor" and is expected to open the opportunity for low power consumption electro-optic polymers to be
developed into large foundry PDKs (process development kits) and be ready for mass volume commercialization. The patent emphasizes our technology
platform using fabrication techniques that would naturally fit into foundry PDKs.
On August 4, 2021, we announced that we developed improved thermal design properties for electro-optic polymers used in our Polymer Plus™
and Polymer Slot™ modulators, enabling the speed, flexibility and stability needed for high-volume silicon foundry processes. We successfully created a
2x improvement in r33, while allowing higher stability during poling and post-poling. This provides better thermal performance and enables greater design
flexibility in high-volume silicon foundry PDK (process development kit) processes.
On August 9, 2021, we announced the receipt of U.S. patent number 11,067,748 entitled "Guide Transition Device and Method" that covers a new
invention that enables enhanced optical routing architectures for polymer-based integrated photonics that can be scaled with partner foundries. This new
invention will enable innovative, highly scalable optical routing architectures for integrated photonic platforms. The patent provides novel optical
waveguide transition designs using two planes of optical waveguides that are expected to be critical for optical signal routing and optical switching,
opening the opportunity for high speed, energy efficient electro-optic polymers to be implemented into foundry PDKs (process development kits) to
improve the performance of integrated photonic circuits. This breakthrough technology opens the door for advanced integrated photonics architectural
design. We believe the simplicity of the design is ideal for production in foundries and will best position our Company to enable increased data traffic on
the internet while using less power.
On September 1, 2021, our Company's common shares began trading on the Nasdaq Capital Market ("Nasdaq"). The Company’s Nasdaq listing
will help to expand our potential shareholder base, improve liquidity, elevate our public profile within the industry and should ultimately enhance
shareholder value.
On September 15, 2021, we announced the receipt of the 2021 Industry Award for Optical Integration from the European Conference on Optical
Communications (ECOC), a premier industry exhibition that was held in Bordeaux from September 13-15, 2021. ECOC created the fiber communication
industry awards in six categories to put the spotlight on innovation happening within the industry. The awards recognize and highlight key industry
achievements in advancing optical components, photonic integration, optical transport and data center innovation. The awards are selected from top
industry players, representing significant innovation in photonics integration at our prestigious exhibition.
27
On September 16, 2021, we announced the achievement of world-record performance for a polymer modulator, as demonstrated in an optical
transmission experiment by ETH Zurich, using our Company's proprietary, advanced Perkinamine™ chromophores and Polariton Technologies Ltd.'s
newest plasmonic EO modulator, a silicon-photonics-based plasmonic racetrack modulator offering energy-efficient, low-loss, and high-speed modulation
in a compact footprint. The groundbreaking results were presented as a post-deadline paper at the prestigious European Conference on Optical
Communications (ECOC) industry exhibition and conference in Bordeaux on September 16, 2021. Polariton's plasmonic modulator transmitted 220 Gbit/s
OOK and 408 Gbit/s 8PAM. Transmission of an optical signal was conducted over 100 m using a low-voltage electrical drive of 0.6Vp, an on-chip loss of 1
dB, and an optical 3 dB bandwidth of beyond 110 GHz.
On January 3, 2022, we announced the publication of our patent application 20210405504A1 by the United States Patent and Trademark Office
(USPTO) – entitled 'Nonlinear Optical Chromophores Having a Diamondoid Group Attached Thereto, Methods of Preparing the Same, and Uses
Thereof' – which significantly improves the overall stability and performance of our electro-optic polymers. The Company's electro-optic chromophores are
designed to have one or more diamondiod molecular groups attached to the chromophore. When such chromophores are dispersed in a host polymer
matrix, the electro-optic materials result in improved macroscopic electro-optic properties, increased poling efficiency, increased loading as well as
increased stability of these materials after poling. The impact of this technology is that it will accelerate the path for very high-speed, low-power electrooptic polymers to be implemented into large foundry process development kits (“PDKs”) to boost performance of integrated photonic circuits.
On January 3, 2022, we announced that we enhanced our Company’s Foundry Process Development Kit Offering with the addition of Optical
Grating Couplers. This expanded design tool kit will enable silicon foundries to implement PDKs and fabricate modulators and optical gratings in a single
fab run, further enhancing modulator efficacy. We are continuing to work on additional design tool kit components to enable an expedited
commercialization process through a more simplified manufacturing process for our foundry partners.
On January 3, 2022, we announced that we appointed respected industry leader Dr. Craig Ciesla to our Board of Directors and that retired director
Dr. Joseph A. Miller transitioned to our Company's Advisory Board. Dr. Ciesla is currently the Vice President, Head of the Advanced Platforms and
Devices Group at Illumina, a leading provider of DNA sequencing and array technologies. There he leads a team driving innovation in sequencing
platforms, microfluidics, electronics, and nanofabrication. Prior to Illumina, he was Vice President of Engineering at Kaiam, where he was responsible for
the development and production of 100G transceivers for the data-center market. He was also the founding CEO of Tactus Technology, an innovator in the
user interface industry, where he was the co-inventor of Tactus' polymer morphing screen technology. Before Tactus he had a variety of roles at Intel, JDSU
(now Lumentum), Bookham (now Oclaro) and Ignis Optics developing a wide range of products in the fiber-optics market. He started his career at Toshiba
Research Europe, where he performed early terahertz images of skin cancer. Dr. Ciesla holds a BSc (Hons.) in Applied Physics and Ph.D. in Physics from
Heriot-Watt University in Edinburgh.
On February 10, 2022, we announced breakthrough photostability results on our electro-optic polymer modulators that are compatible with highvolume silicon foundry processes. The improved photostability of our polymers are expected to minimize any optical losses and provide a more robust
platform for silicon foundries. This breakthrough photostability performance is incredibly important as we optimize our polymers for high-volume silicon
foundry processes.
On March 7, 2022, we announced the receipt of U.S. patent number 11,262,605 entitled, "Active region-less polymer modulator integrated on a
common PIC platform and method." This invention will simplify modulator integration for high-volume foundry manufacturing operations while
enhancing polymer reliability to enable a more effective photonic engine. The essence of the invention is a complete optical engine that fits into fiber optic
transceivers (either pluggable or co-packaged) that are used in routers, servers and elsewhere in optical networks. The engine is designed for high-volume
manufacturing operations using silicon foundry infrastructure. The patent illustrates the use of our polymer modulators as a high speed, low power engine
not only for data communication and telecommunication applications, but other new market opportunities as well.
On March 22, 2022 we announced the achievement of world-class results for a polymer modulator, as demonstrated in an enhanced stability and
high-speed measurement by Polariton Technologies and ETH Zurich. The results were generated using the Company's proprietary, advanced
Perkinamine™ chromophores in Polariton's silicon-photonics-based plasmonic racetrack modulator that offers energy-efficient, low-loss, and high-speed
modulation in a compact footprint that is ideal for pluggable and/or co-packaging transceiver modules. The plasmonic modulator performance was
compared to that of silicon photonic microring modulators. The plasmonic device, using Lightwave Logic's electro-optic polymer material, was shown to
be 250-3000x more stable than the silicon devices relative to operating condition changes. In addition, the plasmonic modulator was tested for 70+ minutes
at 100 Gbps NRZ at 80C with no decrease in performance. The world-class results were presented as a contributed peer-reviewed paper at the prestigious
2022 Optical Fiber Conference (OFC2022), the optical communication industry's leading international technical conference and trade show, in San Diego
on March 10, 2022.
On April 19, 2022, we announced the publication of our patent application 2022/0113566 A1 entitled "TFP (thin film polymer) optical transition
device and method" that illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which are
more advantageous for high-volume production. The invention will simplify polymer modulator fabrication when integrated with silicon photonics for
high-volume foundry manufacturing applications. The simplified fabrication approach enables us to simplify the production of very high speed, low power
proprietary polymer modulators that will enable significantly faster data rates in the internet environment. The essence of the invention is a hybrid polymersilicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment
that are proliferating with the growth of data centers, cloud computing and optical communications capacity. The hybrid polymer-silicon photonics engine
is designed to use high-volume silicon foundry infrastructure.
28
On May 25, 2022, we announced enhanced photostability results on our Company's proprietary electro-optic polymer modulators – demonstrating
the reliability necessary for commercial deployments – all based on a technology which can be ported into high-volume silicon foundries and integrated
onto a silicon photonics platform with other optical devices. Photostability is a critical performance metric required both in high volume manufacturing
processes (such as photolithography) and in offering the high reliability and network availability required for commercial deployments. In the tests
conducted, subjecting the Company's latest polymers to high intensity optical power for over 3000 hours produced no change in device performance. The
ability of our proprietary polymers to pass this accelerated photostability aging test provides assurance that they will both tolerate the optical exposures
which occur in high-volume manufacturing and support the reliability over the required operating life of optical transceivers and network elements.
On June 21, 2022, we announced the publication of our patent application 2022/0187637A1 entitled "Hybrid electro-optic polymer modulator
with silicon photonics" that details a novel fabrication process that allows our Company’s proprietary polymers to be fabricated by silicon foundries in a
high-volume manufacturing environment. The published patent application also details a more efficient process that allows for high yielding, high stability
poling of polymers in a high-volume foundry manufacturing environment. The development of the PDK for this new optical hybrid optical modulator
design is now in progress with our Company’s foundry partners.
June 23, 2022, we announced the publication of our patent application 2022/0187638A1 entitled " Hybrid electro-optic polymer modulator with
atomic layer deposition (ALD) sealant layer" that allows our Company’s proprietary polymers to be sealed to moisture and other atmospheric gases in a
very low temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e.
in volume) and that eliminates the need for a separate hermetic enclosure or "gold box." Chip-scale packaging is a technique that has been gathering
momentum in the silicon electronics industry for the past decade to reduce device chip packaging costs and increase device performance – enabling highvolume front and back-end manufacturing as well as extremely small sizes in miniaturization. Specifically, our electro-optic polymer modulators are sealed
with a low-temperature conformal atomic layer deposition dielectic layers that are supported on a silicon substrate with passive silicon photonics
waveguides.
On June 27, 2022 our Company's common stock was added to the Russell 3000® Index. We expect that the awareness of being included in one of
the most widely followed benchmarks will not only benefit our existing shareholders but will lead to a broader base of institutional investors. The annual
Russell index reconstitution captures the 4,000 largest US stocks as of May 6, ranking them by total market capitalization. Our membership in the US allcap Russell 3000® Index, which remains in place for one year, means automatic inclusion in the small-cap Russell 2000® Index as well as the appropriate
growth and value style indexes.
On June 30, 2022, we announced that our CEO, Dr. Michael Lebby, was again invited to co-chair the Photonic Integrated Circuits (PIC)
International Conference that took place June 28-29, 2022 in Brussels, Belgium. At the conference, Dr. Lebby led an invited talk entitled, "Enabling lower
power consumption optical networking using high speed, low power polymer modulators", focusing on the issue of reducing power consumption in
datacenters and optical networks. He also contributed to a panel session, "Hybrid PICs technology challenges and solutions," on the need for hybrid
integration addressing the volume production of 3D and 2.5 integrated electronic and photonic integrated circuits (PICs) based on the utilization of large
silicon foundries. This included a discussion on the use of silicon photonics with hybrid technologies such as electro-optic polymers, polymer based
plasmonics, silicon nitride and III-V laser sources.
On September 22, 2022, we announced the achievement of world record performance for low-power consumption ultra-high-speed 'green' slot
modulators in collaboration with Karlsruhe Institute of Technology (KIT) and its spin-off SilOriX as part of a peer-reviewed post-deadline paper presented
at the prestigious 2022 European Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022. The team presented the
first sub-1mm Mach Zehnder-type modulators with sub-1V drive voltage that rely on Lightwave’s proprietary advanced Perkinamine™ chromophores. The
devices rely on the slot-waveguide device concept developed at KIT and commercialized through SilOriX. Further, the material has experimentally proven
thermal stability at 85°C and offers extreme energy-efficiency along with high-speed modulation in a compact footprint. Additionally, this shows that our
material can perform in a variety of device structures and designs and is positioned to significantly reduce power consumption of optical networking and to
become a true 'green photonics' enabler for the industry.
On September 22, 2022, we announced the achievement of a world-record demonstration of a 250GHz super high bandwidth electro-opticalelectrical (EOE) link through a collaboration with ETH Zurich. The link was demonstrated by ETH Zurich and uses Polariton's high-speed plasmonic
modulators containing Lightwave's proprietary Perkinamine™ chromophores and ETH Zurich's high-speed graphene photodetectors. The link contained a
plasmonic modulator using electro-optic polymer material as well as a novel metamaterial enhanced graphene photodetector featuring a 200 nm spectral
window and a setup-limited
1 bandwidth of 500 GHz. The EOE link achieved a world record and unprecedented 250 GHz 3dB bandwidth
2
. This is an
optical link that utilizes devices with extremely high bandwidths, and the plasmonic demonstration shows that hybrid technologies such as our electro-optic
polymers and graphene together form an important technology platform for volume scalability using large silicon foundries for mass commercialization.
The groundbreaking results were presented by Stephan Koepfli as part of a peer-reviewed post-deadline paper presented at the prestigious 2022 European
Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022.
29
On November 15, 2022, we announced the receipt of U.S. patent number 11,435,603 B2 entitled "TFP (thin film polymer) optical transition
device and method," which illustrates the design of a simpler to fabricate, lower cost hybrid integrated photonics chip using electro-optic polymers which
are more advantageous for high-volume production. The simplified fabrication approach enables streamlined production of very high speed, low power
proprietary polymer modulators that will enable significantly faster data rates in the internet environment. The essence of the invention is a hybrid polymersilicon photonics engine that fits into fiber optic transceivers (either pluggable or co-packaged) that are used in the routers, servers and network equipment
that are proliferating with the growth of data centers, cloud computing and optical communications capacity.
On November 17, 2022, we announced the receipt of U.S. patent number 11,435,604 B2 entitled "Hybrid electro-optic polymer modulator with
silicon photonics," which allows Lightwave Logic's proprietary polymers to be fabricated by silicon foundries in a high-volume manufacturing
environment. The patent also details a more efficient process that allows for high yielding, high stability poling of polymers in a high-volume foundry
manufacturing environment. From a commercial standpoint, this patent enables our polymers to be mass-produced using existing silicon foundry
equipment, simplifying production for the foundry's we are working with.
On November 29, 2022, we announced our acquisition of the polymer technology and intellectual property assets of Chromosol Ltd (UK). The
acquisition significantly strengthened our Company's design capabilities with foundry PDKs with extremely low temperature atomic layer deposition
(ALD) processes that effectively hermetically seal polymer devices that have been prepared for high volume manufacturing. The advanced fabrication
processes of ALD with temperatures below 100C will solidify our Company's market position with both the Company's manufacturing foundry partners as
well as end-users as we prepare to enter the 800Gbps integrated photonics marketplace. The acquisition also advanced our Company’s patent portfolio of
electro-optic polymer technology with an innovative polymer chemistry device patent that has potential to increase the performance of integrated
modulators through optical amplification in a photonic integrated circuit (PIC) and enhance the functionality of the PIC by integrating laser light sources
made using the polymer-based gain and a laser optical cavity defined on the Silicon photonic platform, with our Company’s high speed, high efficiency
modulators. Having access to extremely low temperature ALD allows our Company's polymer modulators to be protected from the environment without
the need for expensive and large footprint gold box packaging, propelling our Company forward with chip-scale packaging as required by major hyperscaler end-users. The patent opens a new class of PICs which expands our variety of devices. The Patent is US patent number 9837794, EU patent number
3017489, China registration number 201480048236 & 201910230856, and is entitled, “Optoelectronic devices, methods of fabrication thereof and
materials therefor.”
___________________________
1 Set-up limited' indicates that the measurement was limited by the testing equipment.
2 University of Kiel, Germany supported the digital signal processor (DSP), and ETHZ supported the photodetector.
30
On December 12, 2022, we announced the receipt of U.S. patent number 11,506,918 B2 entitled “Hybrid electro-optic polymer modulator with
atomic layer deposition (ALD) sealant layer,” which allows our proprietary polymers to be sealed to moisture and atmospheric gases in a very low
temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e. in
volume) and that eliminates the need for a separate hermetic enclosure or "gold box." Specifically, our electro-optic polymer modulators will be sealed with
low-temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonics waveguides.
The sealant process will enable lower cost system implementation in a high-volume foundry environment.
On December 13, 2022, we provided a world-class figure-of merit performance for modulators using electro-optical polymers and a plasmonic
device design in conjunction with Polariton Technologies. Building from the world record performance and demonstration of a 250 GHz super high
bandwidth electro-optical-electrical (EOE) link that was presented at the 2022 European Conference on Optical Communications (ECOC)
3
through a
collaboration with ETH Zurich, these latest figure of merit results show the potential for extreme power savings for optical network equipment and
demonstrated clearly that polymer-based technology platforms are positioned well for general implementation. These results were achieved using
Polariton's electro-optic polymer-based plasmonic devices with Lightwave's electro-optic materials, with a bandwidth greater than 250 GHz. While these
high-speed results have been reported previously, here Lightwave Logic reported for the first time that the voltage-length product Figure of Merit (FoM)
for this modulator is just 60 Vum, which is approximately 10X better than the performance of the optical semiconductor modulators that are incumbent in
the optical network and internet today. This figure of merit will allow ultra-low voltage operation and, enabled by Polariton's plasmonic modulator, the
ability to carry significantly more data per modulator while consuming much less power. The net positive effect on system level equipment is expected not
only to be significant, but perhaps more importantly, also a strong driver of a ''green photonics" platform. These results position our Company extremely
well for next generation ultra-high-capacity interconnects for the hyper-scale market. The combination of electro-optic polymers and plasmonics is
becoming an ideal sunrise technology platform to address the 'Achilles heel' of the data industry: high power consumption. As the industry contemplates
the implementation of PAM4 200G lanes for 2023 and 2024, these optical devices already have shown capability for at least 2X these lane speeds.
On January 12, 2023, our Chief Executive Officer, Dr. Michael Lebby, hosted a presentation and participated in an industry panel discussion at
the 2023 Photonics Spectra Conference, a prominent virtual conference within the photonics industry. In the panel discussion, Dr. Lebby and a panel of
industry experts from the entire photonics integrated chip (PIC) value chain, discussed lessons learned when scaling PIC production for volume
applications. In his presentation, Dr. Lebby reviewed the potential solutions that electro-optical polymer modulators offer to integrated and hybrid
photonics integrated chips (PICs), discussing their relevance to PIC packaging operations as well as how electro-optic polymers boost PIC speed and power
efficiency.
On January 30, 2023, our Chief Executive Officer, Dr. Michael Lebby, participated in an industry panel discussion at the 2023 Laser Focus World
Executive Forum. The Laser Focus World Executive Forum is one of the industry's premier events for senior-level executives, technology directors, and
business managers from technology companies around the world, delivering an in-depth analysis of the global laser and photonics market. In this
discussion, Dr. Lebby joined a panel of industry experts to discuss how the success of Silicon Photonics is based on the premise that it is a semiconductor
technology, and hence it can be manufactured in volume by semiconductor fabs. The panel addressed the manufacturing plans of photonic integrated
circuits (PICs) by semiconductor fabs and how the photonic industry can transfer their processes to the semiconductor industry.
On March 22, 2023, we announced that our latest commercial-class electro-optic polymer material achieved breakthrough performance metrics at
1310 nanometers (nm), a wavelength popular in hyperscale datacenter applications. These commercial-class improvements include a significantly higher
electro-optic coefficient exceeding 200 pm/V, which allows for very low drive power of 1 volt or less. Other characteristics include optimized chromophore
loading, superior low optical loss, excellent temporal stability at 85
0 Celsius, and extremely high thermal and photo stability. The breakthrough
commercial-class electro-optic material is expected to enable ultra-small footprint modulators with at least 100 GHz bandwidth as well as meeting all
critical requirements for pluggable transceivers, on-board optics and co-packaging solutions. Additionally, the achievement of these results at the 1310nm
bandwidth positions us for potential near-term licensing opportunities in datacenter applications.
In April 2023, our Chief Executive Officer, Dr. Michael Lebby, co-chaired the Photonic Integrated Circuits (PIC) International Conference in
Brussels, Belgium. Industry-leading insiders delivered more than 30 presentations spanning six sectors at the conference. The conference provided
attendees with an up-to-date overview of the status of the global photonics industry as well as the opportunity to meet many other key players within the
community. In addition to serving as co-chair of the event, Dr. Lebby hosted a presentation for in-person attendees within the "Scaling PICs in Volume
Using Foundries" track, focusing on the industry's consideration of electro-optic polymer modulators due to their increased modulation speed, lower power
consumption, and potential for future multi-Tbps aggregated data-rates in the next decade. Additionally, Dr. Lebby discussed the latest results on foundry
fabricated EO polymers, as well as the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level.
_____________________________
3 The groundbreaking results were presented by Stefan Koepfli (ETH Zurich) as part of a peer-reviewed post-deadline paper presented at the prestigious 2022 European
Conference on Optical Communications (ECOC) in Basel, Switzerland on September 22, 2022. The post-deadline paper is titled ">500 GHz Bandwidth Graphene
Photodetector Enabling Highest-Capacity Plasmonic-to-Plasmonic Links."
31
On May 4, 2023, we announced, that in conjunction with our research partners at the Karlsruhe Institute of Technology and Solarix, the
achievement of record optical modulator performance using our Company's latest Perkinamine® Series 5 material at extremely low cryogenic temperatures,
delivering the potential to revolutionize applications in supercomputers, quantum circuits and advanced computing systems. Building from the world
record performance and demonstration of super high bandwidth, and super low voltage electro-optic modulators with Karlsruhe Institute of Technology and
Silorix over the past year, the results have the potential to enable supercomputing and quantum systems to be more competitive than standard
computational systems given its faster speeds at low temperatures. This achievement opens huge opportunities to our Company in the areas of
supercomputing and quantum systems by giving access to very high data rate, low power optical modulators.
On May 18, 2023, we announced the receipt of U.S. patent number 11,614,670 B2 entitled "Electro-optic polymer devices having high
performance claddings and methods of preparing the same," which is a cutting-edge design technique, enhancing the performance of polymer modulators
through the use of innovative polymer cladding design that is amenable for high-volume foundry fabrication when integrated with silicon photonics. The
patent details a novel fabrication process that allows our proprietary polymers to perform more effectively and to be fabricated by silicon foundries in a
high-volume manufacturing environment. It also introduces a more efficient process for improving the performance of the polymer claddings, leading to
increased poling efficiency and lower losses in both optical and RF aspects. This patent is helping us move forward with our commercial discussions
through the enabling of enhanced performance and simplified manufacturing of our polymer modulators with silicon photonics.
On May 25, 2023, we announced our Company's first commercial material supply license agreement for our Perkinamine® chromophore
materials. This agreement is to provide Perkinamine® chromophore materials for polymer based photonic devices and photonic integrated circuits (PICs).
Supplying licensed materials is one prong of our Company's three-prong revenue model and business strategy that includes polymer modulator products as
well as technology transfer. This agreement recognizes market acceptance and competitive advantage of our technology and validates the first prong of our
business model. Further, it represents tangible commercial progress for electro-optic polymers as part of our business plan.
On May 31, 2023, we announced the receipt of U.S. patent number 11,661,428 entitled "Nonlinear Optical Chromophores, Nonlinear Optical
Materials Containing the Same, and Uses Thereof in Optical Devices," which details an innovative organic chromophore design using a novel 'thiophene
bridge' to significantly improve material performance in a production environment. This is accomplished by designing thiophene-containing bridging
groups that are positioned between the electron-donating and electron-accepting ends of the chromophore. These designs provide nonlinear optical
chromophores with significantly improved optical properties and improved stability. We expect this patent will help us progress our commercial
discussions with potential customers.
In June 2023, we announced the publication of World International Property Organization (WIPO) PCT Patent Publication - PCT Patent No. WO
2023/102066 entitled “Nonlinear Optical Materials Containing High Boiling Point Solvents, and Methods of Efficiently Poling The Same,” which
illustrates novel organic chemical structural designs that offer increased poling efficiency, as well as thermal stability for electro-optic materials. These
designs provide non-linear optical chromophores with significantly improved material properties and stability for processing and fabrication by commercial
foundries. Specifically, the patent teaches material processing and poling methods that directly leads to significantly enhanced electro-optic efficiency (r33)
as compared to previous poling techniques. We consider this WIPO PCT Patent Publication to be a strong step forward in the scaling and volume
commercialization of our polymer technology platform.
On August 1, 2023, we appointed respected industry executive Laila Partridge to our Board of Directors. Ms. Partridge brings over 30 years of
executive experience in technology, corporate innovation and finance to our Board – having worked with a wide range of technologies, including
telecommunications, internet infrastructure, AI, internet of things and more. She was named by Boston Business Journal as one of the ten "2017 Women to
Watch in Science and Technology". She currently serves as Founder and Chief Executive Officer of The HardTech Project, a new venture with a novel
approach to early-stage hardware investing. Previously, she was Managing Director of the STANLEY + Techstars Accelerator where she directed a global
effort for Stanley Black & Decker's Chief Technology Officer to identify and invest in innovative technologies for industrial applications with an emphasis
on electrification, sustainability and advanced manufacturing. Prior to that, she began her technology career at Intel Capital, serving as a Director of
Strategic Investments. Ms. Partridge began her career at Wells Fargo, where she ultimately achieved the role of VP of Corporate Banking, having led
complex corporate finance transactions for the company's senior secured debt agencies in the Midwest. Ms. Partridge brings significant board experience to
the Board of Directors, including at Intel Capital serving privately-held technology companies, and in her current role as an independent Director at
Cambridge Trust (NASDAQ: CATC). She holds a Bachelor's degree with Honors from Wellesley College.
On August 21, 2023, we announced the completion of new laboratory production facilities, expanding our corporate headquarters by over 65%,
nearly 10,000 square feet, for a total of approximately 23,500 square feet to support new commercial activity, including enabling commercial device testing
and evaluation, production reliability testing, laser characterization, SEM analysis and the expansion of our Company's chemical synthesis production line.
On October 3, 2023, we announced our receipt of the 2023 Industry Award for Most Innovative Hybrid PIC/Optical Integration Platform from
the European Conference on Optical Communications (ECOC) – a premier industry exhibition – held in Glasgow, Scotland from October 2-4, 2023. ECOC
is one of the leading conferences on optical communication and attracts top industry minds from across the world. The ECOC awards emphasize
technology and product commercialization, highlighting significant achievements in advancing the business of optical communications, transport,
networking, fiber-based products, photonic integration circuits and related developments. The Innovative Product category with 5 subcategories looks
across the industry at new products driving change in their respective market segment, and what is timely and helping to increase the use of optics. Metrics
include design features that are photonics, electronics, thermal, mechanical, chemical, environmental and carbon footprint based
Shorts be blown away like this???
Can you say pizza delivery guy lol
Much depends on Thom's integrity.
WE ARE COMMITTED TO INCREASING SHAREHOLDER VALUE
https://www.worlds.com/investor-information
What happened to this?
You didn't mention the over $100,000 in MRMD stock. Likely that's all been sold to support the continued bleeding of benefits to Thom. I believe I did the math on the tax loss carry forwards back when the 10Q came out in August. I didn't keep good notes, but I don't believe they amounted to very much.
Maybe not so off topic. This sounds much like the LWLG message board lol
Investor Presentation slide 3
• Large Addressable Market: Optical transceivers market expected to grow to at
least $100B by 2030 chiefly driven by data centers, fiber comm & AI requirements
• Proprietary EO Polymer Technology: Supports >3x faster data transmission
speeds with ~10x lower power, relieving key bottlenecks in internet infrastructure
• Robust Patent Portfolio: Composed of 70+ patents and patents pending
• Commercialization Underway: Secured initial licensing agreement in May ’23
• Robust Balance Sheet: $30M+ cash position provides significant optionality
• Building a Foundation: Expanded facility and team with in-house control of
material supply, device fabrication & package design enables Lightwave to
control its own destiny and maintain key trade secrets in-house
• Experienced Leadership: Management and Board are composed of
technology and finance experts with 200+ years of combined experience
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/683426d1-5a08-bc3a-6df3-ce127bd5ef17?origin=2
Reverse mergers are a real crap shoot, and returns are a complete gamble. Returns run the whole spectrum of losing nearly all of your wager to exorbitant payouts. A spike to .50 would put us near the top ten of all time posted to the Reverse Merger board some time ago. I'm sticking around because I believe that Thom won't give the middle finger to his friends that have supported him through the years.
https://investorshub.advfn.com/Reverse-Mergers-7308
Scroll down to "HALL OF FAME SHELL and REVERSE MERGER RUNS:"
X, you posted a link to Lewrock's earnings spreadsheet a couple of months ago. Do you or Lewrock remember what the assumptions were for this in relation to TAM, SAM, and SOM? As I recall, this was for limited verticals and no 3200G so in later years there should be other sources of revenue which are not accounted for and thus making the estimates quite conservative.
I value your opinions. Here's my thoughts on this. Thom owns 27% stake in WDDD last time I checked. If he made an announcement that he was suspending his salary and benefits until WDDD could turn a profit, the share price would spike and his stock ownership value would outpace his salary while making friends. On the other hand, continuing down the present path leads to further share price collapse, and the increasing possibility of dilution again, further downward pressure, and making enemies.
We are basically valued as a shell. With the proper merger, this thing could skyrocket. Not holding my breath.
How 'bout it datastream? Can you do the right thing?
Lightwave Logic CEO Dr. Michael Lebby to Present at the Optica Photonic-Enabled Cloud Computing Industry Summit at Juniper Networks
Lebby commented:
***YES***
The Basher's Handbook "transcript" in case you don't want to wade through a video:
http://cdn.ceo.ca.s3-us-west-2.amazonaws.com/1dr223l-Anatomy%20of%20a%20Basher%20-%20Do%20and%20Don%27t.pdf
Thanks!!! Here's the link: https://news.mit.edu/2023/new-tools-available-reduce-energy-that-ai-models-devour-1005
Maybe orders to take the boot off the neck and let it run?
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"We're in lots of discussions with other folks that are interested in licensing our technology and also we're in discussions with folks looking at our technology itself for product sales. So what investors can expect to see is a lot more activity there... in general these are really exciting times for us."
Thom would be better off financially if he would temporarily suspend his salary and expenses until he can turn this around. As it is, WDDD is being driven into the ground from this perspective. The MRMD cash cow is being milked dry.