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Nice find, Thx
Watch Lightwave Logic CEO, Michael Lebby tells us about their exciting product, winner of the Most Innovative Hybrid PIC/Optical Integration Platform Award: https://t.co/OZ14DHygPB
— ECOC Exhibition (@ECOC_Exhibition) November 27, 2023
(For reference)
Infinera (INFN) Company Profile:
6373 San Ignacio Avenue
San Jose, CA 95119
United States
408 572 5200
https://www.infinera.comSector(s):
Technology Industry: Communication Equipment
Full Time Employees: 3,267
Infinera Corporation provides optical transport networking equipment, software, and services worldwide. The company's product portfolio includes Infinera Groove series for modular and sled-based platforms to support a various transport network applications; Infinera 7300 series, an SDN-ready coherent optical transport system; Infinera FlexILS open optical line system that connects various Infinera and third-party terminal equipment platforms over long-distance fiber optic cable providing switching, multiplexing, amplification, and management channels; and Infinera 7090 and 7100 series for transport platforms. It also offers Infinera XTM series, a packet-optical transport platform that enables metro connectivity solutions; Infinera XTC series, a multi-terabit packet optical transport platforms that integrates digital OTN switching and optical DWDM transmission; Infinera mTera series, a network transport solution; and Infinera XT series, a platform that is designed to power cloud scale network services over metro, DCI, long-haul, and subsea networks. In addition, the company provides Infinera Cloud Xpress Family that is designed to meet the needs of internet content providers (ICPs), communication service providers, internet exchange service providers, enterprises, and other large-scale data center operators; and ICE-X Coherent Pluggable Optics. It also offers Infinera Transcend software suite; and system software and customer support services. The company serves telecommunications service providers, ICPs, cable providers, wholesale carriers, research and education institutions, large enterprises, and government entities. It markets and sells its products and related support services primarily through its direct sales force. The company was formerly known as Zepton Networks. Infinera Corporation was incorporated in 2000 and is headquartered in San Jose, California.
As would I, just pleased to see funds rolling in to support the advancement of PICs etc. etc ...
Lightwave Logic Inc. Faster by Design
Might be a reach, might not...could this be an example of what Dr. Lebby means by "ubiquitous"? Fun to speculate...
Weaving piezoelectric polymers into nanofibers reveals a surprising pathway to boost stem cell growth naturally, without external power.
Their peizoelectric nature coupled with the fact that these polymers are soft, organic materials that mesh well with living tissue, makes them excellent candidates for medical applications like powering implanted devices, such as pacemakers.
When it comes to growing stem cells, these polymers are being studied for their ability to supercharge stem cell growth.
$14M grant...
Infinera is a domestic optical compound semiconductor manufacturer with in-house fab operations and advanced test and packaging capabilities in multiple states. According to the company, the CalCompetes grant will enable it to build upon its 20+ year history in the United States and continue to drive innovation in indium phosphide-based compound semiconductor and monolithic photonic integrated circuit (PIC) technologies. Fostering the domestic production of these critical and emerging technologies helps increase America’s economic and national security in semiconductor innovation, manufacturing, and supply chain resilience.
https://picmagazine.net/article/118106/newsletter
I'll go out on limb and say that by the end of the decade, there will have been more world changing scientific breakthroughs from AI than in the last 100 years combined, this health pod probably won't devour much data at all...:))
In the evolving healthcare landscape, AI is making significant contributions. CarePods might be our best bet to reduce the physician shortage we are experiencing. pic.twitter.com/cXNyCJSsWW
— Interesting Engineering (@IntEngineering) November 23, 2023
Who knew there was such a thing as young polymer scientists award...:) I love it!
Macromolecular Rapid Communications Junior Researcher Award
Macromolecular Rapid Communications Junior Researcher Award recognizes innovative polymer scientists at the beginning of their independent career.
https://onlinelibrary.wiley.com/page/journal/15213927/homepage/junior-researcher-award.html
Dr. So also is the CTO of NexGen Nano...when does he sleep?
Here, Professor Franky So, chief technology officer at solar technology specialist NextGen Nano, discusses the role organic solar cells (OSCs) can play in addressing the issue of solar panel waste.
The organic polymers that make up OSCs can be designed with recyclability in mind. Some of these organic materials can be broken down and reprocessed, enabling the recovery of valuable components. Additionally, the solution-based manufacturing processes used for OSCs, such as printing or coating, allow for the deposition of thin layers on flexible substrates. This characteristic makes it easier to separate and recycle different layers.
Dr. Franky So
Research and career
Franky So earned his doctoral degree in electrical engineering from the University of Southern California. He was the Manager for the OLED Research group at the Motorola Corporate Research Laboratories before transitioning to become the Head of OLED Research at OSRAM Opto Semiconductors. In 2005, he joined the University of Florida and became the Rolf E. Hummel Professor of Electronic Materials in the Department of Materials Science and Engineering. Since 2015, he has been the Walter and Ida Freeman Distinguished Professor in the Department of Materials Science and Engineering at North Carolina State University.
He has received many awards in the past. While at Motorola, he was named the Distinguished Innovator and Master Innovator. He was the recipient of the Department of Energy Solid State Lighting Program Significant Achievement Awards. He has founded and co-founded 5 startups. In 2023, he was named the Entrepreneur of the Year at the North Carolina State University. Dr. So holds 120 U.S. patents. He has published more than 230 papers with an H-Index of 82, edited 5 books, and written 4 book chapters. He is the Editor-in-Chief of the journal Materials Science and Engineering Reports and serves as an Associate Editor for the IEEE Journal of Photovoltaics, IEEE Journal of Display Technology, SPIE Journal of Photonic Technology, and Journal of SID. So is a Distinguished Lecturer of the IEEE Photonics Society, and a Fellow of the National Academy of Inventors, MRS, IEEE, SID, OSA, and SPIE.
In 2023, Franky So was named the Entrepreneur of the Year by North Carolina State University.
https://en.wikipedia.org/wiki/Franky_So
https://www.lightwavelogic.com/about-us/leadership/
So’s current research focus is on electronics properties and photophysics of organic semiconductors and quantum dots used for OLEDs, solar cells, photodetectors, sensors and transistors. His recent works include: use of corrugated structures to fabricate OLEDs and perovskite solar cells, charge transport, injection and charge transfer excitons in organic semiconductors, dielectric properties of polymer-fullerene blends for photovoltaics, vertical permeable metal base transistors, vertical field effect transistors, PbS quantum dots photodetectors and phototransistors, and ferroelectric transistors.
https://www.mse.ncsu.edu/people/fso/
Surround yourself with the best and brightest people
Lightwave Logic Inc. Faster by Design
Press Release
Nokia supercharges AI with Ultra Ethernet
Nokia working with Ultra Ethernet Consortium to develop an open networking standard to address demanding networking requirements of high-performance computing (HPC) and Artificial Intelligence (AI) workloads
Nokia leadership in Ethernet networking and standards development to help to shape Ultra Ethernet as highly compatible, low cost and interoperable part of AI and HPC application stacks
21 November 2023
Espoo, Finland – Nokia today announced its support for the Ultra Ethernet Consortium (UEC), a group that brings together companies for industry-wide cooperation to develop Ethernet specifications and software APIs that empower AI and HPC environments. Nokia will bring its technology leadership in building super scalable, low latency deterministic networks for data centers and data center interconnect to the definition of the Ultra Ethernet standard being developed by the UEC.
The AI revolution is not only driving the need for expanded computing resources, it’s also driving changes to networks, especially those connecting computing clusters for HPC used in AI training and inference. The near-universal protocol for data networks, Ethernet is the ideal place to start for meeting the broad performance needs of AI. With Nokia’s support, the UEC will develop new standards, best practices and architectures for specialized AI data center networks.
As a leader in providing super scalable, low latency network solutions for data center and data center interconnect, Nokia will bring its extensive expertise to bear on defining Ultra Ethernet. The company will leverage its deep understanding of web, enterprise and service provider networks by contributing to several UEC working groups, where it will help ensure that Ultra Ethernet will meet the critical needs of all its customers.
J Metz, Chair of the Ultra Ethernet Consortium , said: “The UEC welcomes Nokia’s deep experience and expertise in building some of the world’s highest-performing networks. Together with a broad ecosystem of consortium partners, our goal is to provide an open, interoperable standard that allows networks to be upgraded easily and inexpensively to meet the needs of AI and HPC applications. With strong partners like Nokia , we know the UEC will drive the kind of standard to ensure broad AI adoption.”
Vach Kompella , Head of Nokia’s IP business, said: “Generative AI and ML are revolutionizing every aspect of our customers’ businesses. Our networking solutions advance their ability to deploy AI quickly and pursue exciting new use cases and applications. With our extensive footprint in communications, enterprise and webscale networks, we are focused on making Ultra Ethernet a highly compatible, low cost and interoperable part of future AI and HPC application stacks.”
About Nokia
At Nokia , we create technology that helps the world act together.
As a B2B technology innovation leader, we are pioneering networks that sense, think and act by leveraging our work across mobile, fixed and cloud networks. In addition, we create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs .
Service providers, enterprises and partners worldwide trust Nokia to deliver secure, reliable and sustainable networks today – and work with us to create the digital services and applications of the future.
Media inquiries Nokia Communications , Corporate Email: Press.Services@nokia.com
Nokia continuing to make headlines....
Nokia builds multi-terabit pan-Indian optical network for Bharti Airtel
Bharti Airtel will deploy Nokia’s Optical Transport Network (OTN) technology across its nationwide footprint.
Revamped optical network will transform India’s digital infrastructure and enable Bharti Airtel to provide massive capacity to enterprises, operators and hyperscalers.
New optical network allows enterprises to thrive in the growing digital economy.
21 November 2023
New Delhi, India – Nokia today announced it has entered into an agreement with Bharti Ltd (Airtel) to deploy a next-generation optical transport network that will provide additional capacity, higher reliability and lower cost, enabling superior services for Airtel’s customers. As part of the agreement, Airtel will utilize Nokia’s 1830 PSS-x OTN switches in its National Long-Distance Network connecting major cities across India.
https://www.nokia.com/about-us/news/releases/2023/11/21/nokia-builds-multi-terabit-pan-indian-optical-network-for-bharti-airtel/?did=d00000004461&utm_campaign=scale_made_simple&utm_source=twitter&utm_medium=organic&utm_term=c1dc8bb3-bfab-4e5c-9f68-52643762feba
PSE-6s: A new frontier in scale, performance and sustainability
https://www.nokia.com/networks/optical-networks/pse-6s/
Hmm?
Stay with my incredible job with Intel or take the job at Lightwave Logic under the tutelage of an industry visionary? We know his answer and I'm not even sure he gave Intel 2 weeks notice...;)
NICE!...
Mehedhi Hasan posted this • 2d2d
I’m happy to share that I’m starting a new position as Principal Process Development Engineer at Lightwave Logic, Inc.!
That's quite the chess move by Nadella, with a reported, staggering $11B invested in OpenAI, clearly he wasn't about to let Altman & Brockman be snatched up by another player. Wouldn't be surprised if MSFT gains full control/ownership of OpenAI all together.
https://www.cnbc.com/2023/11/20/ousted-openai-head-sam-altman-to-lead-microsofts-new-ai-team-ceo-nadella-says.html
The successful interoperability test between Nokia AirScale Baseband functions (DU/CU) and @Mavenir's Radio Units confirms our strong commitment to #OpenRAN. Nokia and Mavenir are long-term supporters of open networks.
— Nokia (@nokia) November 15, 2023
Read more here: https://t.co/7cvXt60kLp pic.twitter.com/BnEPZwH89c
Articulated perfectly Tleprathy!
supporting recent talent acquisition
Photonics and Quantum Computing: A New Frontier in Information Processing
October 23, 2023
Photonics’ advantages include simple components, versatility in running various quantum operations and excellent performance under practical environmental conditions. The technology’s compatibility with existing telecom light sources and silicon chip fabrication methods accelerates progress in quantum computing research. From fault-tolerant quantum computers to a reservoir computer for use at the edge, photonics is being leveraged to power a wide range of quantum computers.....
“Quantum photonics can, for the most part, leverage existing infrastructure, tools and know-how for high-volume semiconductor manufacturing, packaging and systems integration,” Shadbolt said. “The reliability, throughput and process control that have already been established for commercial integrated photonics applications are hugely advantageous given the scale and complexity of the system required for any kind of fault-tolerant quantum computing, and in our view, this leverage significantly accelerates and de-risks the path to large systems.”
https://www.eetimes.eu/photonics-and-quantum-computing-a-new-frontier-in-information-processing/
Swisscom and Nokia begin service migration to new high-capacity optical transport network
16 November 2023
The carrier selected Nokia’s portfolio of optical networking hardware, software and professional services for the entire transformation which included the rollout of 22 backbone sites and 560 metro sites.....
The solution will address massive traffic growth by eliminating repetitive tasks, accelerating service delivery, and reducing overall ownership costs. Appreciably lower power consumption – a significant innovation in the Nokia optical portfolio – is also contributing to Swisscom’s corporate sustainability goals by reducing its carbon footprint....
Swisscom selected Nokia’s portfolio of optical networking hardware, software and professional services for the entire transformation, including the Nokia Photonic Service Engine (PSE)-V powered 1830 family of Wavelength Division Multiplexing/Optical Transport Networking (WDM/OTN) platforms, and the WaveSuite portfolio of networking applications.
https://www.nokia.com/about-us/news/releases/2023/11/16/swisscom-and-nokia-begin-service-migration-to-new-high-capacity-optical-transport-network/?did=d00000004461&utm_campaign=scale_made_simple&utm_source=twitter&utm_medium=organic&utm_term=e59b32a7-bb51-45b9-8fa0-eedb306c27fa
Application Note
Photonic Integration for AI hardware
Photonic AI
Accelerators
Optical Computing for AI
The concept of optical computing is in no means a
novel concept, but struggled to compete with rapidly
improving electronic systems1. With higher data
transmission rates and larger data storage volumes
on the horizon, however, new solutions for high-
speed information processing, which at the same
time, meet the demand for reduced energy usage
and decreasing latency, are required. Classical Von
Neuman computing architectures separate the
computing functions of memory and processing and
thus physically limit the achievable speed and low-
energy consumption.
InP Photonic Integrated Circuits (PICs)
Optical chips or PICs can contain tens to hundreds of
optical components. While electronic integrated circuits
(EICs) consist of transistors, capacitors, and resistors,
a PIC consists of, for example, lasers, modulators,
photodetectors, and filters, all integrated on a single
substrate. Several application fields, such as data- and
telecom, sensing, and lidar are already using or are
considering the use of PICs for their products. This
PIC technology is accessible to users without a
cleanroom, through so-called multi-project wafer runs
and open access foundries. InP based technology is
commercially available through SMART Photonics and
Fraunhofer Heinrich-Hertz-Institut.. Access is
individually coordinated by JePPIX.
https://www.jeppix.eu/wp-content/uploads/2021/04/JEPPIX_AppNote_PhotonicAIacc_V01.pdf
An interesting source for information...
https://www.jeppix.eu/jeppix-pilot-line/resources/application-notes/
Design-Agnostic
PIC Validation
Application specific photonic integrated circuits (ASPICs) state an appealing solution for emerging fields in photonic integration, such as quantum technology. Already deployed in telecommunication, biophotonics, sensing and signal-processing applications, ASPICs are featured by small foot- print, low-weight and low-price.
For quality assurance, every fabricated wafer needs to be validated. To avoid time-consuming and expensive characterization of individual designs, dedicated test structures are present on fixed positions on each wafer, allowing user design-agnostic platform validation. Smart testing routines reveal the performance of the most crucial photonic building blocks. Semiconductor manufacturing, and especially in the Foundry – Design House business model, separates the processing technology from the PIC functional design, in such a way that one qualified technology (process) is used to manufacture a wide range of products (designs). The designer accesses the processing technology through a Process Development Kit (PDK). Given the complexity of semiconductor manufacturing, this has proven to be a key element for success, as yield learning from a product can be easily propagated throughout the entire technology, while development and maintenance resources are used efficiently.
Technology Development & Product Development are therefore separated, leading further to a separation of quality control during manufacturing. Wafer Validation is ensured by the Foundry quality control, through the means of design agnostic Process Control Modules (PCMs), consisting of technology elements measured either during inline processing (e.g.: step height measurements, optical critical dimension measurements) or electrical tests (e.g.: metal sheet resistances, capacitances, isolations etc.) as well as building block / PDK elements tests (e.g.: photodiode dark current, DBR laser threshold current, modulator Vp etc.).
Dr. Lebby handing off ECOC Award for Ciena's WaveLogic 6 (interesting name for product...:)
Helen Xenos comments on @Ciena’s WaveLogic 6 win of the Most Innovative Pluggable Transceiver/Co-Packaged Module Award, and tells us some more about how Ciena’s innovations can benefit the industry.
— ECOC Exhibition (@ECOC_Exhibition) November 15, 2023
Watch the video here: https://t.co/O08ky1ZfvD
A Lumentum White Paper...
Introducing the 6th Generation
of Optical Networking –
Carrier and Spatial Division
Multiplexing (CSDM)
Scaling interface rates beyond what is achievable with a single
carrier will require innovation in photonic integration of lasers,
modulators, and receivers to enable parallel carriers, while
ensuring that $/Gb and power/Gb reductions are maintained as
coherent interface capacity increases.
Conclusion
With traffic growing exponentially, nominally doubling every two
to three years, and spectral efficiency and baud rate not keeping
pace, a new 6th generation of optical networking, termed carrier
and spatial division multiplexing (CSDM) will be required to
provide a cost-effective means to support capacity growth.
Cost effective capacity growth in ROADM networks requires
functional integration of C+L band in the first instance, evolving
to integration of C+L band and multiple fiber pairs in subsequent
WSS generations, while coherent transceiver interface rates need
to continue to scale beyond practical baud rate limitations,
requiring photonic integration of multiple parallel carriers.
https://resource.lumentum.com/s3fs-public/technical-library-items/csdm-wp-oc-ae.pdf
Optical network connects thousands of artificial neurons
13.11.2023 - International team of researchers develops photonic processor with adaptive neural connectivity.
A team of researchers has now developed an event-based architecture, using photonic processors with which data are transported and processed by means of light. In a similar way to the brain, this makes possible the continuous adaptation of the connections within the neural network.
Read through some previously issued pr's this weekend and feel that the significance of the issuance of this World Intellectual Property Patent (WIPO) is being under appreciated...
Dr. Michael Lebby, Chairman and Chief Executive Officer of Lightwave Logic, commented: "I am excited to announce the issuance of this exciting new world PCT patent that addresses poling, poling efficiency, and stability of our commercial grade electro-optic materials for foundry based modulator fabrication.
"Over the past few years, we have focused on more efficient and scalable poling and poling processes, and this patent demonstrates that we have not only improved the poling process, but we have simultaneously improved material thermal stability. This is indeed a strong step forward in the scaling and volume commercialization of our polymer technology platform," concluded Lebby.
Looks like Dr. Lebby has an eye for spotting talent...;) Welcome aboard Bryan!
About
I am a recently graduated Ph.D. physicist and optical engineer with nine years of experience in building optical setups for ultrafast spectroscopy and photoemission experiments. I am very interested in laser system design, and have designed and built a high-powered ultrafast fiber laser amplifier for my lab, with both fiber and free-space amplifier stages and variable repetition rate. My graduate research is in condensed matter, which has allowed me to become proficient in a wide range of spectroscopic techniques, and device fabrication and characterization. I am adept at scientific programming in MATLAB, Python, and Igor for data acquisition, physical simulations, and the analysis of multi-dimensional datasets. My doctoral thesis is based on the electron behavior in magnetic topological materials, giving me a good understanding of band theory, the quantum nature of electrons, and the effects of magnetism on the properties of materials.
Simply amazing short video, difficult to wrap your head around the level of complexity involved...."50 Billion Transistors crammed onto a single chip"...
#LWLG, AMAT, Smart Photonics, ASML...
Microchips can be found in a wide range of products, playing a crucial role in enabling many aspects of the contemporary world. Let's delve into the process of creating these essential components.
— Tech Burrito (@TechBurritoUno) November 7, 2023
Credit @IntEngineering pic.twitter.com/yWXYETmllL
Dr. Lebby on Monday, Smart Photonics on Tues...
14 November, 2023, Tuesday
08:20 – 08:50 Morning coffee break @ conference room B22, in hall B2 at Messe Munich
08:50 – 09:00 Introduction of the day – Ivan Nikitski, Photonics Technologies Manager at EPIC – European Photonics Industry Consortium (France / Europe) @ conference room B21, in hall B2 at Messe Munich
SESSION 3: Photonic Chips – Integration of Materials
09:00 – 09:15 IMEC – Amin Abbasi, Senior Business Development Manager (Belgium)
09:15 – 09:30 Smart Photonics – Putting Light into Your Chips: Heterogeneous Integration of InP Photonics – Ruud Vullers, Director R&D (Netherlands)
09:30 – 09:45 CSEM – Elevating Lithium Niobate on Insulator (LNOI) PICs through Standardization – Hamed Sattari, Project Manager – Photoinic Integrated Circuits / MEMS (Switzerland)
09:45 – 10:00 X-celeprint – Ruggero Loi, Supply Chain Scientist (Ireland)
10:00 – 10:15 IQE – Iwan Davies, Group Technology Director (United Kingdom)
10:15 – 10:30 TBA.
10:30 – 11:15 Networking coffee break
https://epic-assoc.com/events/epic-technology-meeting-on-microelectronics-photonics-two-sides-of-one-coin-2023/
Industry related news...Intel/Ayar mentioned
US Navy selects Mercury for photonics chiplet advancements
Nov 3, 2023
According to the company, this partnership aims to develop manufacturing capabilities to leverage commercial photonics chiplets for enhancing edge processing in defense applications.
The collaboration is part of the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) Trusted and Assured Microelectronics (T&AM) Program’s Project KANAGAWA. This initiative seeks to advance the domestic supply chain and manufacturing processes for multi-chip packages, which integrate co-packaged optics with electronic integrated circuits. This integration enables long-range, high-bandwidth data transfer using optical fibers, offering a substantial increase in data bandwidth while consuming significantly less power compared to conventional copper connections.
Tom Smelker, General Manager of Microsystems at Mercury Systems, expressed enthusiasm about the partnership, stating, “We are excited to partner with the Navy to bring this game-changing commercial technology to the defense community. As we continue to drive innovation in defense microelectronics at the edge and move from board-scale to chip-scale, photonics chiplets will play a key role in advanced packaging and benefit a wide range of systems and platforms.”
Very interesting...
New method for manufacturing semiconductor thin films
06.11.2023 - Better production of monolayers of organic semiconductor molecules at air-water interfaces possible.
Organic semiconductors, which usually consist of carbon-based molecular materials or polymers, are part of a variety of today’s applications: For example, ultra-thin, mechanically flexible and lightweight semiconductor thin films are used in modern transistors, sensitive sensors or organic solar cells. Their energy conversion potential and thus their functionality is determined by the electronic energy levels of the organic thin films, which depend on the molecules as well as their arrangement and the interactions between neighboring molecules within the thin films. The new method should make it possible to specifically produce thin films with controllable interactions between neighboring molecules and specific energy levels.
Cyrus Mewawalla, GLOBALDATA on CNBC
I think AI is one of the fastest growth tech cycles we've ever seen...as Elon Musk said at the UK Safety Summit, "AI is growing in the order of 5-10X per year, that means in just 24 months it could be 25 to 100x more powerful as it is now..."
How will DC's keep pace, not to mention the power demand constraints?
Lightwave Logic Inc. Faster by Design
Not limited to the AG industry, my back round is in heavy construction, when I say the industry is heavily reliant on lasers, that would be an understatement. Example, for those who may not be familiar, ever wonder how large warehouses (think Amazon, Costco's) are able to build slabs/floors that are near perfectly flat over massive sq. ft. areas? That's right lasers...and this is a smaller unit.
Kospi squeeze...
South Korea stocks surge more than 5% for best session since March 2020 after short-selling ban....
https://www.cnbc.com/2023/11/06/asia-stock-markets-live-updates.html
This is truly amazing to watch. You have to wonder how much faster it could become with Perk power? Pulses of energy/light powered by a laser, switching on and off "really, really, really fast"...an example of ubiquity?...;)
Say goodbye to chemicals! An advanced AI-driven laser technology can eliminate as many as 200,000 weeds every hour, with pinpoint precision smaller than a millimeter.
— Tech Burrito (@TechBurritoUno) November 5, 2023
Credit: Carbon Robotics.
pic.twitter.com/x5niSKaDr9
Great find adagium!
Or maybe, Dr. Lebby was chatting with Mr. Caulfield and he mentioned we recently had a good, young engineer move to CO, here's his contact info if your interested in speaking with him...;)
Very interesting!
GlobalFoundries
5 yrs 4 mos5 yrs 4 mos
Front End of Line Reactive Ion Etch - Principal Process Engineer
Front End of Line Reactive Ion Etch - Principal Process Engineer
Full-timeFull-time
Mar 2022 - Nov 2023 · 1 yr 9 mosMar 2022 - Nov 2023 · 1 yr 9 mos
Essex Junction, Vermont, United States · HybridEssex Junction, Vermont, United States · Hybrid
Recent promotion, continued duties and responsibilities of prior senior process engineer role. Added responsibilities include ownership of key development qualifications outside of prior process ownership (FET gate-level poly etching and shallow trench isolation etching on new state-of-the-art tool platforms), including integration-level changes, and continued project management of these projects. Awarded with the company's CEO award for work in this role.
Recent promotion, continued duties and responsibilities of prior senior process engineer role. Added responsibilities include ownership of key development qualifications outside of prior process ownership (FET gate-level poly etching and shallow trench isolation etching on new state-of-the-art tool platforms), including integration-level changes, and continued project management of these projects. Awarded with the company's CEO award for work in this role.
Skills: Critical Thinking · Manufacturing · Fab · Semiconductor Industry · Technology Development · Device Integration · Cross-functional Team Leadership · Microsoft PowerPoint · Microsoft Excel · Lean Manufacturing · Data Analysis · Continuous Improvement
Skills: Critical Thinking · Manufacturing · Fab · Semiconductor Industry · Technology Development · Device Integration · Cross-functional Team Leadership · Microsoft PowerPoint · Microsoft Excel · Lean Manufacturing · Data Analysis · Continuous Improvement
Front End of Line Reactive Ion Etch - Sr Process Engineer
Front End of Line Reactive Ion Etch - Sr Process Engineer
Full-timeFull-time
Dec 2019 - Apr 2022 · 2 yrs 5 mosDec 2019 - Apr 2022 · 2 yrs 5 mos
Essex Junction, VT · On-siteEssex Junction, VT · On-site
Owner of key front end of line RIE processes including shallow trench and deep trench isolation etches, bipolar device formation etches, and through-silicon via etches. Responsible for ensuring the quality and efficiency of product though the line by using statistical process control and lean six sigma principles. Drove projects to improve a number of different etching processes to meet key business deliverables including ground-up development of first-of-a-kind etch processes, transferring processes to new tool types, installing new tools, eliminating obsolete tools, and implementing optimized processes to ensure process capability and product quality. Significant cost savings and yield improvements achieved with these projects. Rewarded with the highest level excellence award and numerous spotlight awards for work in this role.
Owner of key front end of line RIE processes including shallow trench and deep trench isolation etches, bipolar device formation etches, and through-silicon via etches. Responsible for ensuring the quality and efficiency of product though the line by using statistical process control and lean six sigma principles. Drove projects to improve a number of different etching processes to meet key business deliverables including ground-up development of first-of-a-kind etch processes, transferring processes to new tool types, installing new tools, eliminating obsolete tools, and implementing optimized processes to ensure process capability and product quality. Significant cost savings and yield improvements achieved with these projects. Rewarded with the highest level excellence award and numerous spotlight awards for work in this role.
Process Change Review Board - Co-Chair
Process Change Review Board - Co-Chair
Full-timeFull-time
Mar 2019 - Jun 2021 · 2 yrs 4 mosMar 2019 - Jun 2021 · 2 yrs 4 mos
Essex Junction, Vermont, United States · On-siteEssex Junction, Vermont, United States · On-site
Responsible for administration of the fab’s process change review board. Reviewed all JEDEC minor and major classified changes executed in the fab while ensuring compliance with industry change management standards. Worked with worldwide change management team to standardize processes across the company’s different fabs. Implemented a new change management system for sub-class changes to improve quality control. Rewarded with numerous spotlight awards for work in this role.
Responsible for administration of the fab’s process change review board. Reviewed all JEDEC minor and major classified changes executed in the fab while ensuring compliance with industry change management standards. Worked with worldwide change management team to standardize processes across the company’s different fabs. Implemented a new change management system for sub-class changes to improve quality control. Rewarded with numerous spotlight awards for work in this role.
Skills: Change Management
Skills: Change Management
Wafer Finish - Process Engineer
Wafer Finish - Process Engineer
Aug 2018 - Nov 2019 · 1 yr 4 mosAug 2018 - Nov 2019 · 1 yr 4 mos
Essex Junction, Vermont · On-siteEssex Junction, Vermont · On-site
Owner of the post-fab wafer thinning and TSV wafer fishing processes at Fab 9 - responsible for ensuring the quality and efficiency of product though the post-fab line including support plate bonding and debonding, wafer thinning, physical vapor deposition, and shipping. Drove projects to improve and optimize a number of different wafer finishing processes. Significant yield improvement and cost savings achieved with these projects, identified by value stream map and structured problem solving exercises. Rewarded with the highest level excellence award and numerous spotlight awards for work in this role.
Excellent video Heylbroeck, see Smart Photonics with llse de Graaf beginning about 4:10 mark... looks like they are growing quickly and very well financed. Thank you for sharing!
Highlight
When 6G emerges at the end of the decade, it will alter the very notion of a network. 6G will fuse digital and physical realities.