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Technical FAQ
Companies like Arista and Ciena are also talking about 400G, are they competitors?
No, companies like Arista Networks and Ciena make networking equipment with 400G ports that can take optical pluggable transceivers. These transceivers contain the sort of optics that Lightwave Logic makes. So these companies would be customers, or customer’s customers (if they buy their optics from a transceiver integrator like Lumentum or Finisar). Arista makes Ethernet switches which have 400G ports on the front panel. You can plug copper cables into these ports to connect equipment a few meters away. But if you need to go longer, you plug in an optical transceiver to convert to an optical signal. The transceiver is where a LWLG modulator would be. In a way, you can think of the pluggable transceiver as a high-end analog of the adapters that plug into laptops to convert from USB to USB-C or HDMI, etc. Ciena makes transport systems that similarly have ports that our optics would plug into.
https://www.lightwavelogic.com/resource-center/technical-faq/
Arista Networks Overview
https://www.arista.com/en/company/company-overview
Great, Thanks Pro_v!
Lovin AMAT becoming a new EPIC member...
@EPICassoc is excited to welcome 13 new members: Yildiz Technical University, Illumisonics Inc., @HoloeyeA, @iTheraMedical, @SentechNews, HEPIA, @Applied4Tech, @enlightra_inc @XFAB_FOUNDRY, DefSpace, Boltic, @UniEastFinland and @inphocal.#EPICmembers #photonics #technology pic.twitter.com/qPIEuOYsN7
— EPIC Photonics (@EPIC_photonics) November 30, 2022
2. Polariton and Silorix collaborating with Lightwave (again begging the question, why collaborate with a company whose tech can't be scaled?)
The advanced fabrication processes of ALD with temperatures below 100C will solidify the company's market position with both the company's manufacturing foundry partners as well as end-users as it prepares to enter the 800Gbps integrated photonics marketplace.
I would think once the deal is consummated, ML will do everything in his power to expedite the technology assimilation process. So, sorta depends on how fast the lawyers can move I suppose.
Was just gonna post the same video... "Silicon Photonics 2.0 The next generation of silicon photonics"
I'm all for anything that "propels the company forward"...;)
Having access to extremely low temperature ALD allows the company's polymer modulators to be protected from the environment without the need of expensive and large footprint gold box packaging, propelling the company forward with chip-scale packaging as required by major hyper-scaler end-users. The patent opens a new class of PICs which expands our variety of devices.
"What is more interesting is that every foundry we have visited has ALD systems and equipment in place for semiconductor processing. This acquisition for low temperature ALD processes provides a key piece of the PDK that we need when working with foundries for our polymers, and allows us to achieve our goals more effectively," concluded Lebby.
September 22, 2021
The world is moving towards tunability. The combination of tunable lasers and dense wavelength division multiplexing (DWDM) allows datacom and telecom industries to expand their network capacity without increasing their existing fiber infrastructure. Furthermore, the miniaturization of coherent technology into pluggable transceiver modules has finally enabled the widespread implementation of IP over DWDM solutions. Self-tuning algorithms have also made DWDM solutions more widespread by simplifying their installation and maintenance. Hence, many application cases—metro transport, data center interconnects, and even future access networks—are moving towards coherent tunable pluggables.
The market for coherent tunable transceivers will explode in the coming years, with LightCounting estimating that annual sales will double by 2026. Telecom carriers and especially data center providers will drive the market demand, upgrading their optical networks with 400G, 600G, and 800G pluggable transceiver modules that will become the new industry standards.
The valuable time and capital allocated to IP protection by LWLG management should not be taken lightly. IMO this is one of the most important updates ever provided by the company... This is the moment when many began to realize the importance of what we are doing at Lightwave Logic.
https://www.prnewswire.com/news-releases/lightwave-logic-provides-corporate-update-on-strategic-intellectual-property-development-efforts-301217115.html
Who's that handsome devil to the right?
This patent in particular is exciting from a commercial standpoint as it enables our polymers to be mass-produced using existing silicon foundry equipment, simplifying production for the foundry's we are working with. I look forward to continued progress in the months ahead both on the licensing and technology transfer fronts as we strive to create sustainable, long-term value for our shareholders."
Lightwave Logic acquires U.S. patent for new hybrid photonics that will simplify polymer modulator fabrication when integrated with silicon photonics for high-volume foundry manufacturing applications. More @ https://lightwavelogic.com #EPICmembernews #photonics
đź“Ł Lightwave Logic acquires U.S. patent for new hybrid photonics that will simplify polymer modulator fabrication when integrated with silicon photonics for high-volume foundry manufacturing applications. More @ https://t.co/2rgdTOXCuR #EPICmembernews #photonics pic.twitter.com/xWmXoccvGJ
— EPIC Photonics (@EPIC_photonics) November 24, 2022
“We represent a $100 billion industry, we are active in almost any relevant new application, there’s no industry that can function without photonics, but we really need to team up with more downstream industries and other deep tech initiatives.”
Thailand based Fabrinet, manufactures AEVA's chip modules. Fabrinet subsidiaries include: VitroCom, Casix, Fabrinet Japan and Fabrinet West. An inside glimpse of the manufacturing process starts around 2:30 mark...
500 meter object detection capability...
Ewit Roos, CEO of PhotonDelta, said: “Photonic chips are a next generation chip technology which will bring new innovations like FMCW LiDAR on CHIP to life and we are excited to ride along this journey with Scantinel.
Leveraging Aeva’s unique Frequency Modulated Continuous Wave (FMCW) 4D technology and the world’s first LiDAR-on-chip silicon photonics design, Aeries II’s capabilities go beyond today’s legacy Time-of-Flight LiDAR sensors.
October 26, 2022
The demand for data and other digital services is rising exponentially. From 2010 to 2020, the number of Internet users worldwide doubled, and global internet traffic increased 12-fold. From 2020 to 2026, internet traffic will likely increase 5-fold. To meet this demand, datacom and telecom operators need constantly upgrade their transport networks.
400 Gbps links are becoming the standard for links all across telecom transport networks and data center interconnects, but providers are already thinking about the next steps. LightCounting forecasts significant growth in shipments of dense-wavelength division multiplexing (DWDM) ports with data rates of 600G, 800G, and beyond in the next five years.
The market for coherent tunable transceivers will explode in the coming years, with LightCounting estimating that annual sales will double by 2026. Telecom carriers and especially data center providers will drive the market demand, upgrading their optical networks with 400G, 600G, and 800G pluggable transceiver modules that will become the new industry standards.
"Lebby's Law" That has a nice ring to it, just rolls of the tongue...;)
An example of AMAT working with a breakthrough materials company...
DISPLAY DAILY 1 month ago
Breakthrough thinking in MicroLED and the implications for QDEL blue dots
Porotech is a UK start-up with technology from the University of Cambridge. Their notion is to use a tunable layer that allows colour to be modulated with current and PWM. But this is a single InGaN material system.
Apologies for beating the (AMAT) dead horse but...
Emerging Technology Trends
The next wave of emerging technology disruptions will require materials engineering innovations
https://www.appliedmaterials.com/us/en/collaboration.html
Xena, you are a warrior! Thanks for the generous sharing of your hard work.
"The elegance of this materials chemistry design is perfect for integrated photonics that can be fabricated in large silicon foundries. The impact of being able to optimize our designs is clear: the potential to not only to increase data flow and data traffic on the internet, but to create energy-efficient solutions that help to support the increasingly data-heavy lifestyle of today's consumer. This exciting development positions us well as we seek to grow our relationships with partners and potential customers in 2022," concluded Lebby.
Reasons to Consider Filing an Information Disclosure Statement
You should file an IDS if the prior art meets any of these criteria:
It's used, known, or sold in the U.S.;
It's patented in another country;
It's featured in a publication in the U.S. or anywhere in the world;
It's described in a USPTO or foreign patent application; or
It's described in an issued USPTO patent.
After some quiet time since Jan 22, additional information has been submitted in the forms of : Non-Patent Literature, Foreign References, and matching "Information Disclosure Statement (IDS) Form (SB08)".
Would be totally pumped to hear AMAT & LWLG are collaborating someday....yeah I dream about it...;)
Advanced Manufacturing
< 1/7 >
Advanced Materials
< 2/7 >
AI & Big Data
< 3/7 >
Energy Technologies
< 4/7 >
Life Sciences
< 5/7 >
Semiconductor Technologies
< 6/7 >
Advanced Display
< 7/7 >
https://www.appliedmaterials.com/us/en/applied-ventures.html#carousel-be630e9f65-item-b879b19b47-tabpanel
I don't think this concept vehicle will be breaking any land speed records anytime soon, but very cool just the same.
This is a fully autonomous ride-hailing service concept by Renault pic.twitter.com/TwFhmahhpF
— Insider Tech (@TechInsider) November 19, 2022
LWLG will need to update the Corp. Video regarding number of patents issued at the pace they are moving...("over 50 patents") Are we in the 60's yet?
LWLG patent categories:
-Materials
-Optical Devices
-Fabrication
-Integration with Semiconductors
-Packaging
Lightwave Logic Inc. Faster by Design
https://www.lightwavelogic.com/technology/patent-portfolio/
Off topic, but interesting to see what's coming down the pike...
https://www.ces.tech/Innovation-Awards/Honorees.aspx
4D LiDAR
https://www.ces.tech/Innovation-Awards/Honorees/2023/Honorees/A/Aeries-II.aspx
Infineon
https://www.ces.tech/Innovation-Awards/Honorees/2023/Honorees/I/Infineon’s-XENSIV™-connected-sensor-kit-(CSK).aspx
SC MEMS Mirror
By SC MEMS (the subsidiary of iBULe Photonics)
https://www.ces.tech/Innovation-Awards/Honorees/2023/Honorees/S/SC-MEMS-Mirror.aspx
etc., etc., etc.....
They would be an outstanding EU foundry partner IMO.
In 1999, Siemens' semiconductor operations were spun off into a new company called Infineon Technologies.
companies including Intel are starting to stack several of them, sometimes mixing and matching different technologies, to improve performance.
Great read RL,
Another way GF differentiates itself from the competition is with its EDA partnerships. Picking a diverse set of partners allows GF to address many applicable silicon photonics markets. GF has had EDA partnerships with big-name players within the silicon space for many years, like Cadence, Ansys, Siemens, and Synopsys.
WRAPPING UP
If there ever was a time to get excited about silicon photonics, the time is now. The data center is going through many significant changes that align perfectly with what silicon photonics can offer. Data centers need to accommodate for disaggregation, the high bandwidth and low latency required to keep up with HPC, the inability to keep pace with Moore’s Law and its proportionate performance jumps, and the need for less power- hungry systems.
The technology is here, and GF and its EDA partners are making a huge splash within the data center with silicon photonics. GF has a comprehensive feature set within its silicon photonics solutions enabled on multiple geometries. The future of computing is silicon photonics, and we believe GF is leading the way.
Data tsunami heading straight for us...
The Next Tech Revolution
The smartphone revolution changed lives. IoT will change the world.
00:35 mark.. "producing a vast trove of data every day that holds extraordinary potential"
In fact, the IoT runs on Arm technology, as its partners are shipping over 29 billion Arm-based chips a year, around 70% of these were designed for IoT and embedded markets.
"a tool in the tool box"...
Thanks for posting that proto, I hadn't seen that one from the Sept. 22' ECOC Exhibition!
Yes, it would appear that is just one of the many tools in their tool box to jump start and facilitate product launches...
Xcelerator as a Service: welcome to the digital future
Imagine a company that collaborates with its suppliers, vendors, partners and customers; where all your engineers work simultaneously on the next product launch; a company that scales as it grows. This company could be you – with our Xcelerator as a Service offering.
I'm lovin this too...
ACCELERATE YOUR DIGITAL TRANSFORMATION
Siemens Xcelerator
Siemens Xcelerator is our open digital business platform that will accelerate digital transformation. Now companies of all sizes can access the digital technologies to transform the way they compete, collaborate and connect.
Accelerate your company with Siemens Xcelerator.
https://www.sw.siemens.com/en-US/digital-transformation/
Munich, Germany based behemoth Siemens may not be the first foundry that comes to top of mind but this is interesting...
Plano, Texas, USA, 22 September 2022
Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
Apple's largest shareholder, (BRK-B) W. Buffett in latest 13-F shows a new $4B purchase of TSMC, headline this morning is Apple plans on turning to TSMC for it's chips from is AZ plant in 2024. Looking back at a message from our friend Herman Sleegers...
May 31, 2021
Michael Lebby gave the message that they are deep in discussions at various levels with a few examples of companies in sectors that LWLG can engage with. These are just examples. I am not saying that these are the partner companies.
- High speed optics manufacturers: lumentum, II-VI, Sp Source photonics
- Network Equipment Manufacturers: Nokia, Cisco, Ciena, Arista, Huawei
- Internet Service Providers: AWS, Facebook,Google,Verizon, AT&T, Comcast
Lebby made it clear that we are also already present in foundries both large and the smaller specialized foundries again without claiming that these are the actual partners.
Some examples: Global Foundries, TSMC, Lionix, IMEC
There is also spontaneous unsolicited interest from other sectors:
Lidar: environmental recognition: Tesla, automotive manufacturers, government
Display companies: Apple, Samsung
The names of the companies simply indicate how broad Lightwave Logic can go in partnering and collaborating.
Sounds great spartex, please keep spreading the word...thanks!
Infineon hikes long-term targets, plans $5 billion plant in Dresden
Published: Nov. 14, 2022 at 9:54 a.m. ET
https://www.marketwatch.com/story/infineon-hikes-long-term-targets-plans-5-billion-plant-in-dresden-2022-11-14?siteid=yhoof2