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1stnflight

11/22/05 5:51 PM

#102363 RE: Doma #102362

Slide 10 (from 11/21/2005 Wave investor conference presentation, see post 102311) leaves me with the following questions:

1) "Embassy technology bundled with Winbond silicon", not tpm, versus "Embassy Platform bundled with Atmel and STM TPM". Silicon must mean TPM because Windbond website link below shows safekeeper as TPM and TCG1.1b compliant.

http://www.winbond.com.tw/e-winbondhtm/partner/apc_pc8392t.html

2) Also did not mention works with IBM Embedded Security Subsystem but did mention works with HP. Trying to distance from IBM or letting Winbond and Atmel make inroads with them?

3) Also says Wave is a ISV for HP but not IBM. Used to be for IBM and go to the IBM Partnerworld conferences. What changed?