"Infineon's chipsets (codeveloped with InterDig) are more than 20 percent cheaper than Qualcomm's, but their quality does not lag behind Qualcomm's at all," a senior Samsung Electronics official was quoted by the newspaper as saying.
Samsung Selects Infineon HSDPA Platform for HEDGE Mobile Phone Family
Neubiberg, Germany – April 23, 2008 – Infineon Technologies AG (FSE/NYSE: IFX) today announced that Samsung Electronics, Inc., Seoul, Korea, has chosen Infineon’s HSDPA Platform XMM™6080 for their new family of HEDGE (HSDPA/EDGE) mobile handsets. Samsung is introducing a comprehensive family using the Infineon XMM 6080 platform. The platform includes the HSDPA/EDGE baseband, power management, single chip 3.5G RF transceiver and is complemented by Infineon’s protocol stack for HEDGE phones.
This state of the art solution enables customers to significantly reduce their component count, footprint, complexity and cost of designs. The launch also underlines the global maturity of Infineon’s in-house protocol stack. The XMM 6080 platform will enable Samsung to introduce a wide range of new HEDGE (HSDPA/EDGE) phones reusing the proven Infineon core architecture.
Infineon has already started volume shipments of its platform. The Samsung HEDGE phones with the XMM 6080 are expected to be available in the second quarter of calendar year 2008.
Further information on Infineon’s product portfolio for communication solutions is available at http://www.infineon.com/wireless
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