What manufacturing and/or performance hurdles remain to be overcome on 200mm wafers, for 800gbs and 1600gbs with each of your Polymer Plus and Polymer Slot technologies- before the Foundries you are working with will qualify the Lightwave technology/processes into a ready-for-commercialization PDK? Specify the status of each hurdle (ie what are the yields and all of the other standards, how many modulators (total and average pctg) pass all minimum standards per wafer, how much time it takes from start to finish, and the added cost of Lightwave technology) and how it compares to the requirements of the Foundry.
In other words, I want a detailed status report of the Plus and Slot technology FROM THE FOUNDRY PERSPECTIVE so shareholders know exactly what they have accomplished and what remains to be accomplished before they would be able to have a commercially viable product.
If he doesn't want to provide all of that detail I'd like to know his reasoning behind that decision, especially in light of the claim that they really have the only viable eop game in town and that they are superior to all competing materials.
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