Replies to post #181128 on Lightwave Logic Inc (LWLG)

[tkg]

In the wake of the rapid expansion of AI and HPC, there is a growing need for faster datacenter interconnections. Traditional technologies are struggling to keep pace, prompting the industry to turn to other solutions and silicon photonics, which transforms electrical signals into light signals, has emerged as a promising answer that can dramatically speed up chip-to-chip and machine-to-machine interconnections.

However, the journey is not without challenges. As data transmission rates climb, power consumption and heat management become more critical. The industry's proposed solution involves integrating silicon photonics components with specialized chips using Co-Packaged Optics (CPO) technology. This approach is already gaining traction, with tech leaders like Microsoft and Meta considering its adoption for their next-gen network infrastructures.