c3po, NIST, Through participation in the above DARPA projects ( and others, including MMIC, Terahertz Electronics, ELASTx, DAHI and CHIPS) and other collaborations, CTL has developed measurements that characterize and model, at millimeter wave frequencies, leading-edge integrated microelectronic components, interconnects used in 3D heterogeneous integration, and advanced materials. Each project worked with industrial stakeholders including Northrop Grumman, Teledyne, Hughes Research Labs, Raytheon, IBM, Intel, AIM Photonics, Lightwave Logic, Corning, Broadpak, and Cadence. The stakeholder's applications include 5G/6G communications, biomedicine, optical communications, radio astronomy, radar, and space communications.
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