I have heard multiple people say time and time again that poling was no longer an issue. Are you speaking about some other aspect of this problem or something different than what has been mentioned in the past?
Let's make this clear shall we KCC. Poling has not been a problem with these new devices but are you saying that the poling success in mass production is something that we have yet to put a number on.? Could you explain poling efficiency exactly. I am assuming there are no issues with the individual modulators but on the wafer in mass production this is something yet to be discovered. Could you clarify. TIA
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