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The advanced fabrication processes of ALD with temperatures below 100C [b[b]will solidify the company's market position with both the company's manufacturing foundry partners as well as end-users as it prepares to enter the 800Gbps integrated photonics marketplace.
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Having access to extremely low temperature ALD allows the company's polymer modulators to be protected from the environment without the need of expensive and large footprint gold box packaging, propelling the company forward with chip-scale packaging as required by major hyper-scaler end-users. The patent opens a new class of PICs which expands our variety of devices.
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This acquisition for low temperature ALD processes provides a key piece of the PDK that we need when working with foundries for our polymers, and allows us to achieve our goals more effectively," concluded Lebby.
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