Replies to post #89890 on Lightwave Logic Inc (LWLG)

[tkg]

TSMC launches advanced packaging for silicon photonics applications
Julian Ho, Taipei; Willis Ke, DIGITIMES
Tuesday 31 August 2021

TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting the datacenter market, according to industry sources.

https://www.digitimes.com/news/a20210831PD201.html

********

Optimized Photonics: Efficient Computing to Quantum Processors

https://www.samsung.com/us/ssic/session/optimized-photonics-from-efficient-computing-to-quantum-processors/