Replies to post #212526 on Liquidmetal Technologies Inc (LQMT)

[PayMEmf]

Changying precision...need to check some recent post I put out this year, byd is another (the latter has a question mark).

I think yi’an yihao supplies the parts...changying is assembly and has the patents to use, they are also part of ningde era.

This is all knowledge from translation (you know how that goes)

I believe their op was +600%

http://mguba.eastmoney.com/mguba/list/300115

[joshuaeyu]

We have a habit of thinking Whale CM or else.

We use the word such as Foxconn who is the Whale CM (for the final assembly).

We need to realize all products are built via a Leveled BOM (which itself is highly hierarchical). Any subcomponents can be delivered by mid layer high volume CM.

Earlier this year, we all thought Apple is doing the AIP (Antenna In package) recognizing Qualcomm Antenna Module does not meet the thickness requirement. They clearly can choose the path of integrating the 5G electronics within the Frame. Instead they choose to cut a window and cover with plastic and stick the antenna module next to it. Distasteful...ugly...bendgate.....perhaps.

Here's how they do it via a No Name CM called USI.

https://www.everythingrf.com/News/details/11138-apple-ditches-qualcomm-to-design-its-own-5g-mm-wave-antenna-module-for-the-iphone-12

Now back to Foldable phone.

Hinge assembly itself contains a lot of micro parts. Not all of them are BMG. Someone would be doing that piece of assembly....fab it, assemble it, test it...before they deliver final hinge assembly to the next tier up on the Leveled BOM.

This is no different than auto industry containing many many layered CM.