Vein,
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HERMETIC CAPSULE AND METHOD
Publication number: 20190237930
Abstract: A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.
Type: Application
Filed: January 26, 2018
Publication date: August 1, 2019
Applicant: Lightwave Logic Inc.
Inventor: Michael Lebby