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IBB-99

08/05/19 10:27 PM

#47346 RE: vein #47345

Vein,

You seem to find the inside track to all the new patent news. Here's the abstract:


HERMETIC CAPSULE AND METHOD


Publication number: 20190237930

Abstract: A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

Type: Application

Filed: January 26, 2018

Publication date: August 1, 2019

Applicant: Lightwave Logic Inc.

Inventor: Michael Lebby
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tkg

08/06/19 5:02 AM

#47349 RE: vein #47345

Nice find vein, thx for posting! Sounds like it is related to the packaging?
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Mcfish

08/06/19 8:02 AM

#47355 RE: vein #47345

Vein...you are the news!!! You just made it by letting us know of yet another patent.
Thank you
Ps we are good here.