Gates, all the pieces are in place now, we have a working BWM in a 3rd party device, we have great thermal aging results, we have received our own designed chips from OpSYS as well as baseline chips from IMEC, we have an up and running Class 100 Clean Room, we have 3 people certified for JILA access, so progress should be accelerating now
we should be in the tweaking stages, engineering hurdles etc, the trade-offs of specs stages, we should have a myriad of devices at this level
there should be progress notes
just saying
off to chop some wood