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TI's New FlatLink(TM)3G Family Supports Next-Generation Video in Cell
Phones 24-Bit RGB Interface Enables True Color and Higher Resolution
DALLAS, March 2, 2006 /PRNewswire via COMTEX/ -- Texas Instruments Incorporated (NYSE: TXN) (TI) today introduced a new family of interface integrated circuits for true- color, high-resolution video content in handheld electronics. TI's new FlatLink(TM)3G serializers and deserializers provide a high-speed interface between liquid crystal displays (LCD) and mobile application processors such as TI's widely-adopted OMAP(TM) platform. The subLVDS (sub-low voltage differential signaling) serializers for mobile applications transmit true 24-bit red/green/blue (RGB) color data and support screen resolutions from QVGA through XGA, including VGA. They enable sharper, more realistic video in clamshell phones, multimedia players and digital cameras. (See http://www.ti.com/sc06026 .)
"Consumers today can download TV shows to their mobile phones, but existing interface technology limits the display quality," said David Mulcahy, TI's high-speed interface marketing manager. "TI's FlatLink(TM)3G family provides the bridge from processor to display panel that allows designers to take full advantage of newer, higher-resolution screens such as VGA and lets end users enjoy a palette of 16 million colors."
The high performance of the SN65LVDS301 transmitter supports current and future screen resolutions in mobile handset displays. Designers are able to select one, two or all three of the device's serial subLVDS channels according to the design needs, allowing them to develop with the same chipset for resolutions from QVGA through XGA, including VGA.
Supporting signals of up to 150-mV swing on the transmitter, the LVDS301 reduces 27 bits of data down to one, two or three channels, depending on the application. The low-swing serial signal helps reduce electromagnetic interference (EMI), which is a critical parameter in cell phones. With a noise floor around -105 dBm and spurs below -95 dBm, the EMI of the LVDS301 is extremely low. In addition, the serial transmitter requires fewer interconnects than typical parallel interfaces, allowing a much thinner flex cable to be used. This allows for a more reliable and robust mechanical connection across the clamshell hinge and makes swivel screen designs easier.
The LVDS301 offers several features that make the designer's job easier, such as bus swap, which allows more flexibility in board layout and assembly. In addition, the devices' parity check feature enables designers to catch errors while testing their design, which ensures accurate image display.
FlatLink3G devices are compatible with display modules and driver integrated circuits (IC) available from manufacturers such as Himax Technologies, Hitachi Displays, Renesas Technology LCDBU, Samsung SDI and Sanyo Epson Imaging Devices.
TI's FlatLink3G family joins the company's interface IC offering for telecommunications, consumer electronics, computing, industrial and automotive applications. TI supports more standards, offers more products and is chosen four times more often than any other interface supplier. Please see the Interface Selection Guide for more information at http://interface.ti.com .
Available Today
The SN65LVDS301 transmitter IC is sampling now in a 5-mm x 5-mm MicroStar Junior(TM) ball-grid array (BGA) package. It will be available in volume in 2Q2006, priced at $2.10 in 1,000-unit quantities. Support for designers will include IBIS models. TI will introduce the three-channel receiver, as well as one- and two-channel transmitters and receivers in the FlatLink3G family in 3Q06.
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com


Please refer all reader inquiries to: Texas Instruments Incorporated Semiconductor Group, SC-06026 Literature Response Center 14950 FAA Blvd. Fort Worth, TX 76155 1-800-477-8924 Trademarks
OMAP, FlatLink and MicroStar Junior are trademarks of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.
SOURCE Texas Instruments Incorporated


CONTACT: Janell Mirochna of Texas Instruments Incorporated, [phone], or [e-mail] ; or Heather Mills, [phone], or [e-mail] , for Texas Instruments Incorporated. Please do not publish these numbers or e-mail addresses.URL: http://www.prnewswire.com http://www.ti.com http://www.ti.com/sc06026 http://interface.ti.comwww.prnewswire.com
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