Micron Technology (MU)

[ciciagt]

ASE, Micron rumored to set up joint venture fab in China
Mavis Hong, Taipei; Jessie Shen, DIGITIMES [Tuesday 7 January 2014]
Rumors have circulated in the industry that IC packager Advanced Semiconductor Engineering (ASE) and memory chipmaker Micron Technology will set up a joint venture fab in Xi'an, China. The fab reportedly will be mainly responsible for the packaging and testing of next-generation DRAM products produced by Micron.

A partnership with Micron would mean ASE's return to the DRAM backend business, according to market observers.

In response, ASE declined to comment on the speculation.

The possible tie-up between ASE and Micron would have a certain impact on the landscape of the DRAM backend market, and the relationships between Micron and its existing backend partners, the observers said.

Powertech Technology (PTI), Walton Advanced Engineering and ChipMOS Technologies provide Micron with backend services mainly for standard DRAM, mobile DRAM and NAND flash memory chips, the observers revealed. Micron also has ASE, Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC offer backend services for NOR and NAND flash parts, the observers said.

ASE phased out its DRAM backend business in late 2011, when it integrated subsidiary ASE Power Technology into its operations. ASE Power used to provide packaging and testing services to Powerchip Technology, but suffered huge losses since Powerchip turned its focus away from DRAM. ASE Power also sold its equipment to fellow backend companies PTI and Walton, before merging with its parent company.
http://www.digitimes.com/news/a20140107PD205.html